GB1292006A - Improvements in or relating to the electroplating of wire - Google Patents

Improvements in or relating to the electroplating of wire

Info

Publication number
GB1292006A
GB1292006A GB2968/70A GB296870A GB1292006A GB 1292006 A GB1292006 A GB 1292006A GB 2968/70 A GB2968/70 A GB 2968/70A GB 296870 A GB296870 A GB 296870A GB 1292006 A GB1292006 A GB 1292006A
Authority
GB
United Kingdom
Prior art keywords
wire
plating
electro
bath
sulphate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2968/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP464269A external-priority patent/JPS4843534B1/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of GB1292006A publication Critical patent/GB1292006A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils

Abstract

1292006 Electro-plating wire with Ni or Ni/Co and then Au FURUKAWA ELECTRIC CO Ltd 21 Jan 1970 [22 Jan 1969 17 Dec 1969] 2968/70 Heading C7B In electro-plating Ni or Ni/Co and then Au layers on to a wire substrate, the Ni or Ni/Co is electro-plated from a bath containing a Ni salt of a mineral acid (e.g. nickel sulphate) together with an alkali metal, alkaline earth metal or cobalt sulphate (e.g. Na, K, Li or Co sulphate). The wire may be of Cu, brass, Cu/Be or Fe/Ni. Before electro-plating, the wire may be smoothed by buffing, degreased by dipping in an alkali bath and/or descaled by dipping in an alkali cyanide bath. Before the gold plating stage, the Ni or Ni/Co plated wire may be drawn and heat-treated. The Au electro-plating may be from cyanide baths, firstly with a strike plating from a bath containing 0À05 to 2 grams Au/ litre and then from a bath containing at least 4 grams Au/litre. Thereafter, the wire may be drawn and heattreated.
GB2968/70A 1969-01-22 1970-01-21 Improvements in or relating to the electroplating of wire Expired GB1292006A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP464269A JPS4843534B1 (en) 1969-01-22 1969-01-22
JP10142369 1969-12-17

Publications (1)

Publication Number Publication Date
GB1292006A true GB1292006A (en) 1972-10-11

Family

ID=26338456

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2968/70A Expired GB1292006A (en) 1969-01-22 1970-01-21 Improvements in or relating to the electroplating of wire

Country Status (3)

Country Link
US (1) US3708405A (en)
DE (1) DE2002836A1 (en)
GB (1) GB1292006A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013078B2 (en) * 1978-09-05 1985-04-04 日本特殊陶業株式会社 Gold-plated electronic components and their manufacturing method
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US5051317A (en) * 1990-01-03 1991-09-24 Krementz & Co. Inc. Multilayered electroplating process utilizing fine gold
TW200414453A (en) * 2002-03-26 2004-08-01 Sumitomo Electric Wintec Inc Bonding wire and IC device using the bonding wire
US8137752B2 (en) * 2003-12-08 2012-03-20 Syscom Advanced Materials, Inc. Method and apparatus for the treatment of individual filaments of a multifilament yarn
EP3521492B1 (en) * 2007-07-16 2023-11-01 Micrometal Technologies Inc. Electrical shielding material composed of metallized stainless steel monofilament yarn
US9324472B2 (en) 2010-12-29 2016-04-26 Syscom Advanced Materials, Inc. Metal and metallized fiber hybrid wire

Also Published As

Publication number Publication date
DE2002836A1 (en) 1970-09-03
US3708405A (en) 1973-01-02

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee