GB1275577A - Arrangement and method for controlling the displacements of a wafer or like sample in electronic apparatus - Google Patents

Arrangement and method for controlling the displacements of a wafer or like sample in electronic apparatus

Info

Publication number
GB1275577A
GB1275577A GB5122669A GB5122669A GB1275577A GB 1275577 A GB1275577 A GB 1275577A GB 5122669 A GB5122669 A GB 5122669A GB 5122669 A GB5122669 A GB 5122669A GB 1275577 A GB1275577 A GB 1275577A
Authority
GB
United Kingdom
Prior art keywords
wafer
circuit
specimen
interferometers
servo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5122669A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of GB1275577A publication Critical patent/GB1275577A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • G05D3/12—Control of position or direction using feedback
    • G05D3/20—Control of position or direction using feedback using a digital comparing device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

1275577 Interferometry; programmed control of position COMPAGNIE FRANCAISE THOMSON HOUSTON-HOTCHKISS BRANDT 17 Oct 1969 [25 Oct 1968] 51226/69 Headings G2J and G3N [Also in Division H1] The position of a specimen within a scanning electron beam irradiation apparatus is determined by means of interferometers. In Fig.2, a semiconductor wafer 21 coated with photo-resist is mounted on a block BS which is positioned within a frame 23 mounted on an angular adjustment head adjustable by the knob G; this head in turn is carried by orthogonal carriages which can be moved in the X and Y directions by external servomotors QX and QY. Fine adjustment of the block BS within the frame 23 may be made by means of three Piezo-electric elements CX1, CX2 and CY, and its position may be determined by means of two mirrors AX and AY which co-operate with the other mirrors shown to form three interferometers fed from an external helium-neon laser L through a window 27. The receivers EX1, EX2 and EY for the interferometers include counters for counting the number of fringes, and these supply an input to a servo-circuit AS which controls the inputs to the motors QX and QY and to the Piezo-electric elements CX and CY. The servo-circuit may be connected to a control circuit CS which is capable of controlling the sequence of operations of the servo circuit in accordance with a programme, e.g. to print a number of patterns on the wafer. Electron beam apparatus, Fig. 1 The specimen 5 is mounted within an enclosure evacuated by a pump 4, and is scanned by a beam from the gun 2 to produce secondary electrons which are collected by an electron-multiplier 10, and the output is fed to display tubes 8 and 9 which are scanned in synchronism. In one mode of operation the output of tube 9 is focussed on to a transparency 11 which is a large-scale negative replica of a pattern to be etched on the specimen 5, and a photo-cell 12 feeds a beam-suppressing coil 7 so that an opaque region of the transparency 11 causes the beam to be suppressed whilst a transparent region has no effect. Two diametrically opposed permanent marks may be made on a semi-conductor wafer so that their images on the display 8 may be aligned with a reference mark on the display to establish a reference position and orientation for the wafer.
GB5122669A 1968-10-25 1969-10-17 Arrangement and method for controlling the displacements of a wafer or like sample in electronic apparatus Expired GB1275577A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR171342 1968-10-25

Publications (1)

Publication Number Publication Date
GB1275577A true GB1275577A (en) 1972-05-24

Family

ID=8656116

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5122669A Expired GB1275577A (en) 1968-10-25 1969-10-17 Arrangement and method for controlling the displacements of a wafer or like sample in electronic apparatus

Country Status (4)

Country Link
DE (1) DE1953712C3 (en)
FR (1) FR1587573A (en)
GB (1) GB1275577A (en)
SE (1) SE362987B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133930A (en) * 1983-01-08 1984-08-01 Canon Kk Workpiece carriages
WO2007001900A1 (en) * 2005-06-23 2007-01-04 Lewis George C System and method for positioning an object
CN107665827A (en) * 2016-07-29 2018-02-06 上海微电子装备（集团）股份有限公司 Chip bonding apparatus and method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8204450A (en) * 1982-11-17 1984-06-18 Philips Nv MOVING DEVICE, IN PARTICULAR FOR THE RADIATION LITHOGRAPHIC TREATMENT OF A SUBSTRATE.
US5140242A (en) * 1990-04-30 1992-08-18 International Business Machines Corporation Servo guided stage system
WO1994010895A1 (en) * 1992-11-16 1994-05-26 Winterhalter Gastronom Gmbh Dishwashing machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133930A (en) * 1983-01-08 1984-08-01 Canon Kk Workpiece carriages
WO2007001900A1 (en) * 2005-06-23 2007-01-04 Lewis George C System and method for positioning an object
US7298495B2 (en) 2005-06-23 2007-11-20 Lewis George C System and method for positioning an object through use of a rotating laser metrology system
CN107665827A (en) * 2016-07-29 2018-02-06 上海微电子装备（集团）股份有限公司 Chip bonding apparatus and method
CN107665827B (en) * 2016-07-29 2020-01-24 上海微电子装备（集团）股份有限公司 Chip bonding apparatus and method

Also Published As

Publication number Publication date
DE1953712A1 (en) 1970-06-18
DE1953712B2 (en) 1979-09-06
FR1587573A (en) 1970-03-20
DE1953712C3 (en) 1980-06-26
SE362987B (en) 1973-12-27

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee