GB1257002A - - Google Patents

Info

Publication number
GB1257002A
GB1257002A GB1328770A GB1257002DA GB1257002A GB 1257002 A GB1257002 A GB 1257002A GB 1328770 A GB1328770 A GB 1328770A GB 1257002D A GB1257002D A GB 1257002DA GB 1257002 A GB1257002 A GB 1257002A
Authority
GB
United Kingdom
Prior art keywords
hook
wire
lever
testing
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1328770A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1257002A publication Critical patent/GB1257002A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0028—Force sensors associated with force applying means
    • G01L5/0033—Force sensors associated with force applying means applying a pulling force
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

1,257,002. Bond strength testing. NORTH AMERICAN ROCKWELL CORP. March 19, 1970, No. 13287/70. Heading G1S. An apparatus for testing the bonding of a wire 36 connected to an electric circuit and for testing the slackness of the wire comprises a hook 10 suspended from one end of a pivoted beam 6 which is loaded at its other end. A load is applied to the wire by depressing lever 17 to lower the hook, engaging the hook under the wire and releasing lever 17 which is then pushed upwardly by spring 19 to abut stop 21. If the wire is satisfactory, the movement of the beam is arrested before lever 17 abuts stop 21 and a signal lamp 32 is lit as a result of the cam 29 ceasing to contact the beam. If the wire breaks loose or is too slack, the beam remains in contact with cam 29 and no signals given. A damper 18 is connected to lever 17. Lever 17 moves between adjustable stops 20 and 21 and both stops may be lowered or raised in unison by screw 23 to compensate for differing thicknesses of tested circuit boards. In the hook of Fig. 1 and 2 the hook is maintained vertical by co-operating shapes of the support 5 and the hole 4 receiving the support. The part 3 acts to damp oscillations of the hook tip. In the hook of Fig. 3 the co-operation of magnet 35 with ball 3 serves to maintain the hook vertical and to damp oscillations of the tip.
GB1328770A 1970-03-19 1970-03-19 Expired GB1257002A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1328770 1970-03-19

Publications (1)

Publication Number Publication Date
GB1257002A true GB1257002A (en) 1971-12-15

Family

ID=10020225

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1328770A Expired GB1257002A (en) 1970-03-19 1970-03-19

Country Status (1)

Country Link
GB (1) GB1257002A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194844A (en) * 1986-09-05 1988-03-16 Philips Electronic Associated Wire-bond pull-testing
EP0772036A3 (en) * 1995-10-31 1998-05-13 Gerold Staudinger Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194844A (en) * 1986-09-05 1988-03-16 Philips Electronic Associated Wire-bond pull-testing
EP0772036A3 (en) * 1995-10-31 1998-05-13 Gerold Staudinger Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks

Similar Documents

Publication Publication Date Title
ES199393U (en) Device for the subjection of structural elements to a support. (Machine-translation by Google Translate, not legally binding)
ES407931A1 (en) Device for holding test head
GB1257002A (en)
GB1404159A (en) Methods and apparatus for measuring the parameters of electrical devices
ES366443A1 (en) Method and apparatus for indicating track conditions
GB972847A (en) Fault-finding method for coil-loaded cables
GB729171A (en) Improvements relating to beams for mine supports
GB1151780A (en) Constant Current Pulse Circuit.
FR2407691A1 (en) Rod in plate suspension device - is clamped between two fixtures, one having under part to which primary lower socket is screwed
ES369334A1 (en) Cantilevered spring pressure measurement and adjustment
GB1002898A (en) Fastening device
GB1330280A (en) Measuring heads for strength testers
GB549598A (en) Improvements in resilient supports or mountings
GB582262A (en) Improvements in or relating to tone arm guides
CH258501A (en) Method and device for automatic braking adjustment.
GB703193A (en) Improvements in or relating to hardness testing machines
SU499153A1 (en) Cargo compensator contact network
FR1426052A (en) Electronic accumulation device ensuring simultaneous recording during at least part of the exploration period
GB1175195A (en) An Improved Electrical Contact Making Device.
ES130136U (en) Device of unión and anchorage of mounted mountains (Machine-translation by Google Translate, not legally binding)
GB715559A (en) Improvements in and relating to tensiometers
GB1157644A (en) Apparatus for Testing Physical Properties of Filaments
ES156245U (en) Guide and elevation device for sliding parts of furniture. (Machine-translation by Google Translate, not legally binding)
GB691723A (en) An improved vehicle running on rails and having a returning device for the bogie
GB729498A (en) Improvements in and relating to radio receiver circuits

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees