GB1164776A - Improvements in or relating to the electroless deposition of palladium - Google Patents

Improvements in or relating to the electroless deposition of palladium

Info

Publication number
GB1164776A
GB1164776A GB2989968A GB2989968A GB1164776A GB 1164776 A GB1164776 A GB 1164776A GB 2989968 A GB2989968 A GB 2989968A GB 2989968 A GB2989968 A GB 2989968A GB 1164776 A GB1164776 A GB 1164776A
Authority
GB
United Kingdom
Prior art keywords
gms
present
electroless deposition
palladium
litre
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2989968A
Inventor
Alexander Sergienko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Priority to GB2989968A priority Critical patent/GB1164776A/en
Publication of GB1164776A publication Critical patent/GB1164776A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

1,164,776. Electroless deposition of Pd. BURROUGHS CORP. June 22, 1968, No.29899/68. Heading C7F. A bath for electroless deposition of palladium comprises (a) Pd, as a chelate of divalent palladium with (i) ethylenediaminetetraacetic acid or a salt thereof or combined salts thereof and (ii) ethylene diamine, and (b) a reducing agent. The bath preferably comprises Pd present in amounts of from 1À8 to 15 gms Pd/litre as a chelate with (i) EDTA or an NH 4 , Li, Na, K or Ca salt thereof, or combined salts thereof, and (ii) ethylenediamine, whereof the total present is from 9 to 75 gms/ litre, and hypophosphite ion within a range 1À8 to 10 gms/1, the solution having an electrometric pH of 8 to 11. The amount of EDTA present in addition to that present in the chelate may be up to 36 gms/litre and the hypophosphite ion is provided by H 3 PO 2 or one or more of the NH 4 , Na, Li, K, or Ca salt thereof. Excess ethylene diamine, HC1, H 2 SO 4 , or HNO 3 , may be added for pH control, and the working temperature of the bath is 115-190‹ F.
GB2989968A 1968-06-22 1968-06-22 Improvements in or relating to the electroless deposition of palladium Expired GB1164776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2989968A GB1164776A (en) 1968-06-22 1968-06-22 Improvements in or relating to the electroless deposition of palladium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2989968A GB1164776A (en) 1968-06-22 1968-06-22 Improvements in or relating to the electroless deposition of palladium

Publications (1)

Publication Number Publication Date
GB1164776A true GB1164776A (en) 1969-09-24

Family

ID=10299006

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2989968A Expired GB1164776A (en) 1968-06-22 1968-06-22 Improvements in or relating to the electroless deposition of palladium

Country Status (1)

Country Link
GB (1) GB1164776A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2844425A1 (en) * 1978-10-12 1980-04-17 Licentia Gmbh Activation of plastics surface before metallisation - by roughening, complexing treatment, exchange with noble metal complex salt and redn. to metal nuclei (NL 15.4.80)
EP0526334A2 (en) * 1991-08-02 1993-02-03 Okuno Chemical Industries Co. Ltd Electroless palladium plating composition
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2844425A1 (en) * 1978-10-12 1980-04-17 Licentia Gmbh Activation of plastics surface before metallisation - by roughening, complexing treatment, exchange with noble metal complex salt and redn. to metal nuclei (NL 15.4.80)
EP0526334A2 (en) * 1991-08-02 1993-02-03 Okuno Chemical Industries Co. Ltd Electroless palladium plating composition
EP0526334A3 (en) * 1991-08-02 1994-08-03 Okuno Chem Ind Co
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee