GB1122238A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
GB1122238A
GB1122238A GB4699864A GB4699864A GB1122238A GB 1122238 A GB1122238 A GB 1122238A GB 4699864 A GB4699864 A GB 4699864A GB 4699864 A GB4699864 A GB 4699864A GB 1122238 A GB1122238 A GB 1122238A
Authority
GB
United Kingdom
Prior art keywords
heat sink
tinned
members
jig
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4699864A
Inventor
Anthony Johnson
Frederick William Mathews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Co Ltd
Original Assignee
English Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Co Ltd filed Critical English Electric Co Ltd
Priority to GB4699864A priority Critical patent/GB1122238A/en
Publication of GB1122238A publication Critical patent/GB1122238A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1,122,238. Soldering. ENGLISH ELECTRIC CO. Ltd. 16 Nov., 1965 [18 Nov., 1964], No. 46998/64. Heading B3R. [Also in Division H1] A semi-conductor device is secured to a heat sink by a soldering technique in which the device and the sink are pre-tinned and then assembled, together with a mass of solder, in a jig which is subsequently immersed in a heated liquid. The device depicted in the drawings (not shown) is a diode mounted on a conductive support and the heat sink consists of two initially separate U-shaped members which are fitted one within the other with their bases attached to the device support and their limbs projecting therefrom to constitute cooling fins. The devices -a plurality of which may be handled together on a conveyer or in a tray-are pre-tinned by immersion; the heat sink members are individually pre-tinned ultrasonically. Each diode and its associated heat sink members, together with a mass or masses of solder-preferably 60% Sn, 40% Pb-are then assembled in the jig which is passed through an oil vat at a temperature of 205-210‹ C. for about 4 minutes.
GB4699864A 1964-11-18 1964-11-18 Semi-conductor device Expired GB1122238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4699864A GB1122238A (en) 1964-11-18 1964-11-18 Semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4699864A GB1122238A (en) 1964-11-18 1964-11-18 Semi-conductor device

Publications (1)

Publication Number Publication Date
GB1122238A true GB1122238A (en) 1968-07-31

Family

ID=10443351

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4699864A Expired GB1122238A (en) 1964-11-18 1964-11-18 Semi-conductor device

Country Status (1)

Country Link
GB (1) GB1122238A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233593B (en) * 1989-06-28 1993-11-10 Hitachi Ltd Semiconductor device
GB2267243A (en) * 1992-05-12 1993-12-01 Fuji Electric Co Ltd Method of soldering

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233593B (en) * 1989-06-28 1993-11-10 Hitachi Ltd Semiconductor device
GB2267243A (en) * 1992-05-12 1993-12-01 Fuji Electric Co Ltd Method of soldering
US5361973A (en) * 1992-05-12 1994-11-08 Fuji Electric Co., Ltd. Method of soldering
GB2267243B (en) * 1992-05-12 1995-12-06 Fuji Electric Co Ltd Method of soldering

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