CH528146A - Device with heat sinks for semiconductor components held by this - Google Patents
Device with heat sinks for semiconductor components held by thisInfo
- Publication number
- CH528146A CH528146A CH1466471A CH1466471A CH528146A CH 528146 A CH528146 A CH 528146A CH 1466471 A CH1466471 A CH 1466471A CH 1466471 A CH1466471 A CH 1466471A CH 528146 A CH528146 A CH 528146A
- Authority
- CH
- Switzerland
- Prior art keywords
- heat sinks
- semiconductor components
- components held
- held
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702051839 DE2051839C3 (en) | 1970-10-22 | 1970-10-22 | Device for assembling heat sinks for semiconductor components |
Publications (1)
Publication Number | Publication Date |
---|---|
CH528146A true CH528146A (en) | 1972-09-15 |
Family
ID=5785840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1466471A CH528146A (en) | 1970-10-22 | 1971-10-08 | Device with heat sinks for semiconductor components held by this |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH528146A (en) |
DE (1) | DE2051839C3 (en) |
FR (1) | FR2113080A7 (en) |
-
1970
- 1970-10-22 DE DE19702051839 patent/DE2051839C3/en not_active Expired
-
1971
- 1971-10-08 CH CH1466471A patent/CH528146A/en not_active IP Right Cessation
- 1971-10-21 FR FR7137909A patent/FR2113080A7/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2051839B2 (en) | 1973-04-12 |
DE2051839C3 (en) | 1973-11-22 |
FR2113080A7 (en) | 1972-06-23 |
DE2051839A1 (en) | 1972-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |