CH528146A - Device with heat sinks for semiconductor components held by this - Google Patents

Device with heat sinks for semiconductor components held by this

Info

Publication number
CH528146A
CH528146A CH1466471A CH1466471A CH528146A CH 528146 A CH528146 A CH 528146A CH 1466471 A CH1466471 A CH 1466471A CH 1466471 A CH1466471 A CH 1466471A CH 528146 A CH528146 A CH 528146A
Authority
CH
Switzerland
Prior art keywords
heat sinks
semiconductor components
components held
held
semiconductor
Prior art date
Application number
CH1466471A
Other languages
German (de)
Inventor
Reiter Karl
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH528146A publication Critical patent/CH528146A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH1466471A 1970-10-22 1971-10-08 Device with heat sinks for semiconductor components held by this CH528146A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702051839 DE2051839C3 (en) 1970-10-22 1970-10-22 Device for assembling heat sinks for semiconductor components

Publications (1)

Publication Number Publication Date
CH528146A true CH528146A (en) 1972-09-15

Family

ID=5785840

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1466471A CH528146A (en) 1970-10-22 1971-10-08 Device with heat sinks for semiconductor components held by this

Country Status (3)

Country Link
CH (1) CH528146A (en)
DE (1) DE2051839C3 (en)
FR (1) FR2113080A7 (en)

Also Published As

Publication number Publication date
DE2051839B2 (en) 1973-04-12
DE2051839C3 (en) 1973-11-22
FR2113080A7 (en) 1972-06-23
DE2051839A1 (en) 1972-04-27

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Legal Events

Date Code Title Description
PL Patent ceased