GB1069977A - Sputtering method - Google Patents
Sputtering methodInfo
- Publication number
- GB1069977A GB1069977A GB5175264A GB5175264A GB1069977A GB 1069977 A GB1069977 A GB 1069977A GB 5175264 A GB5175264 A GB 5175264A GB 5175264 A GB5175264 A GB 5175264A GB 1069977 A GB1069977 A GB 1069977A
- Authority
- GB
- United Kingdom
- Prior art keywords
- grid
- anode
- sputtering
- coils
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An anode, a cathode and a grid are used in a method of sputter deposition by glow discharge. Sputtering apparatus comprises a cathode 16 coated with a magnetic material 18 to be deposited and surrounded by an earthed shield 22, a wire grid 28 coated with SiO or SiO2, an earthed glass or metal substrate 24 provided with a heater 27 <PICT:1069977/C6-C7/1> and movable shutters 29, 31 all enclosed within a bell jar 10 located between coils 12, 14 which maintain a uniform magnetic field between the anode and cathode. The grid wires are fastened under tension by springs to pins (38) Fig.2 (not shown) on a frame (36) and are interconnected to permit current to pass in series through the wires creating a magnetic field to supplement that of coils 12, 14. Sputtering takes place in argon where after cleaning with shutter 29 open and shutter 31 closed, a high frequency voltage is applied to the grid sputtering the silicon oxide on to the substrate and finally with the voltage on the anode and grid the same sputtering material 18 on to the substrate. In another embodiment the grid forms part of a coil enclosing the anode which creates a magnetic field instead of coils 12, 14.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33259063A | 1963-12-23 | 1963-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1069977A true GB1069977A (en) | 1967-05-24 |
Family
ID=23298908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5175264A Expired GB1069977A (en) | 1963-12-23 | 1964-12-21 | Sputtering method |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1069977A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2346155A (en) * | 1999-01-06 | 2000-08-02 | Trikon Holdings Ltd | Sputtering apparatus |
CN101494151A (en) * | 2009-03-05 | 2009-07-29 | 苏州晶能科技有限公司 | Magnetic control cathode assembly for cleaning one-dimensional linear plasma with high efficiency |
-
1964
- 1964-12-21 GB GB5175264A patent/GB1069977A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2346155A (en) * | 1999-01-06 | 2000-08-02 | Trikon Holdings Ltd | Sputtering apparatus |
GB2346155B (en) * | 1999-01-06 | 2003-06-25 | Trikon Holdings Ltd | Sputtering apparatus |
US6660140B2 (en) | 1999-01-06 | 2003-12-09 | Trikon Holdings Limited | Sputtering apparatus |
CN101494151A (en) * | 2009-03-05 | 2009-07-29 | 苏州晶能科技有限公司 | Magnetic control cathode assembly for cleaning one-dimensional linear plasma with high efficiency |
CN101494151B (en) * | 2009-03-05 | 2013-11-13 | 苏州晶能科技有限公司 | Magnetic control cathode assembly for cleaning one-dimensional linear plasma with high efficiency |
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