GB0608131D0 - Substrate-free flip chip light emitting diode and manufacturing method thereof - Google Patents
Substrate-free flip chip light emitting diode and manufacturing method thereofInfo
- Publication number
- GB0608131D0 GB0608131D0 GBGB0608131.9A GB0608131A GB0608131D0 GB 0608131 D0 GB0608131 D0 GB 0608131D0 GB 0608131 A GB0608131 A GB 0608131A GB 0608131 D0 GB0608131 D0 GB 0608131D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- manufacturing
- light emitting
- emitting diode
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
-
- H01L33/0079—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0708932A GB2437848B (en) | 2005-05-09 | 2006-04-25 | Substrate-free chip light emitting diode and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094114854A TWI246786B (en) | 2005-05-09 | 2005-05-09 | Substrate-free flip chip light emitting diode and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0608131D0 true GB0608131D0 (en) | 2006-06-07 |
GB2426123A GB2426123A (en) | 2006-11-15 |
GB2426123B GB2426123B (en) | 2007-09-26 |
Family
ID=36589747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0608131A Expired - Fee Related GB2426123B (en) | 2005-05-09 | 2006-04-25 | Substrate-free flip chip light emitting diode and manufacturing method thereof |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE102006019373A1 (en) |
FR (1) | FR2885455A1 (en) |
GB (1) | GB2426123B (en) |
TW (1) | TWI246786B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008006757A1 (en) | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Surface-mountable component e.g. thin film LED, for being assembled on mother board i.e. printed circuit board, has semiconductor chip with rear side contact connected with contact structure that is arranged on surface of substrate |
DE102008021402B4 (en) | 2008-04-29 | 2023-08-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Surface mount light emitting diode module and method for manufacturing a surface mount light emitting diode module |
DE102009060759A1 (en) | 2009-12-30 | 2011-07-07 | OSRAM Opto Semiconductors GmbH, 93055 | A radiation-emitting device, module with a radiation-emitting device and method for producing a radiation-emitting device |
US9601657B2 (en) | 2011-03-17 | 2017-03-21 | Epistar Corporation | Light-emitting device |
TWI646701B (en) * | 2017-09-29 | 2019-01-01 | 鼎元光電科技股份有限公司 | Light-emitting diode without substrate and manufacturing method thereof |
CN109671810A (en) * | 2017-10-16 | 2019-04-23 | 鼎元光电科技股份有限公司 | Light emitting diode and its manufacturing method without substrate |
TWI635605B (en) * | 2017-11-02 | 2018-09-11 | 錼創顯示科技股份有限公司 | Micro-led display panel |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11154774A (en) * | 1997-08-05 | 1999-06-08 | Canon Inc | Surface light emission type semiconductor device, manufacture thereof, and display device using the same |
US20040211972A1 (en) * | 2003-04-22 | 2004-10-28 | Gelcore, Llc | Flip-chip light emitting diode |
US20050191777A1 (en) * | 2003-09-22 | 2005-09-01 | National Chung-Hsing University | Method for producing light emitting diode with plated substrate |
US6806112B1 (en) * | 2003-09-22 | 2004-10-19 | National Chung-Hsing University | High brightness light emitting diode |
-
2005
- 2005-05-09 TW TW094114854A patent/TWI246786B/en not_active IP Right Cessation
-
2006
- 2006-04-23 DE DE102006019373A patent/DE102006019373A1/en not_active Withdrawn
- 2006-04-25 GB GB0608131A patent/GB2426123B/en not_active Expired - Fee Related
- 2006-05-04 FR FR0651612A patent/FR2885455A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2426123B (en) | 2007-09-26 |
TW200640032A (en) | 2006-11-16 |
GB2426123A (en) | 2006-11-15 |
DE102006019373A1 (en) | 2006-11-23 |
FR2885455A1 (en) | 2006-11-10 |
TWI246786B (en) | 2006-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160425 |