GB0001442D0 - Cooling apparatus - Google Patents
Cooling apparatusInfo
- Publication number
- GB0001442D0 GB0001442D0 GB0001442A GB0001442A GB0001442D0 GB 0001442 D0 GB0001442 D0 GB 0001442D0 GB 0001442 A GB0001442 A GB 0001442A GB 0001442 A GB0001442 A GB 0001442A GB 0001442 D0 GB0001442 D0 GB 0001442D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooling apparatus
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0001442A GB2358463A (en) | 2000-01-21 | 2000-01-21 | A cooling apparatus |
AU67133/00A AU6713300A (en) | 2000-01-21 | 2000-08-23 | Cooling apparatus |
PCT/GB2000/003276 WO2001054169A2 (en) | 2000-01-21 | 2000-08-23 | Cooling apparatus |
GB0101587A GB2358464A (en) | 2000-01-21 | 2001-01-22 | A cooling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0001442A GB2358463A (en) | 2000-01-21 | 2000-01-21 | A cooling apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0001442D0 true GB0001442D0 (en) | 2000-03-08 |
GB2358463A GB2358463A (en) | 2001-07-25 |
Family
ID=9884134
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0001442A Withdrawn GB2358463A (en) | 2000-01-21 | 2000-01-21 | A cooling apparatus |
GB0101587A Withdrawn GB2358464A (en) | 2000-01-21 | 2001-01-22 | A cooling apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0101587A Withdrawn GB2358464A (en) | 2000-01-21 | 2001-01-22 | A cooling apparatus |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6713300A (en) |
GB (2) | GB2358463A (en) |
WO (1) | WO2001054169A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2101351B1 (en) | 2008-03-13 | 2016-08-17 | Siemens Aktiengesellschaft | Cooling device for cooling a component |
CN102986318B (en) | 2010-04-23 | 2015-04-15 | 纳派泰克股份公司 | A thermally controlled assembly |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA795886A (en) * | 1962-02-16 | 1968-10-01 | The General Electric Company Limited. London | Electronic assemblies |
US4851965A (en) * | 1987-03-09 | 1989-07-25 | Unisys Corporation | Directed air management system for cooling multiple heat sinks |
US5103374A (en) * | 1990-05-23 | 1992-04-07 | At&T Bell Laboratories | Circuit pack cooling using turbulators |
US5110335A (en) * | 1990-06-25 | 1992-05-05 | At&T Bell Laboratories | Method of glass soot deposition using ultrasonic nozzle |
JP2934493B2 (en) * | 1990-10-24 | 1999-08-16 | 株式会社日立製作所 | Electronic equipment cooling device |
DE69307753T2 (en) * | 1992-03-24 | 1997-08-28 | Hitachi Ltd | Nozzle cooling device for electronic assembly and computer with this device |
JPH09123732A (en) * | 1995-11-01 | 1997-05-13 | Zexel Corp | Air conditioner for automobile |
WO1997038566A1 (en) * | 1996-04-10 | 1997-10-16 | Intergraph Corporation | Removable circuit board with ducted cooling |
-
2000
- 2000-01-21 GB GB0001442A patent/GB2358463A/en not_active Withdrawn
- 2000-08-23 AU AU67133/00A patent/AU6713300A/en not_active Abandoned
- 2000-08-23 WO PCT/GB2000/003276 patent/WO2001054169A2/en active Application Filing
-
2001
- 2001-01-22 GB GB0101587A patent/GB2358464A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
AU6713300A (en) | 2001-07-31 |
GB0101587D0 (en) | 2001-03-07 |
GB2358463A (en) | 2001-07-25 |
GB2358464A (en) | 2001-07-25 |
WO2001054169A2 (en) | 2001-07-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |