AU6713300A - Cooling apparatus - Google Patents

Cooling apparatus

Info

Publication number: AU6713300A
Authority: AU; Australia
Prior art keywords: cooling apparatus; cooling
Prior art date: 2000-01-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU67133/00A

Inventor

Nicholas Foley

Bruce Fryers

Gerard Macmanus

Michael Tate

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

3Com Corp

Original Assignee

3Com Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-01-21

Filing date

2000-08-23

Publication date

2001-07-31

2000-08-23 Application filed by 3Com Corp filed Critical 3Com Corp

2001-07-31 Publication of AU6713300A publication Critical patent/AU6713300A/en

Status Abandoned legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

AU67133/00A 2000-01-21 2000-08-23 Cooling apparatus Abandoned AU6713300A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
GB0001442A GB2358463A (en)	2000-01-21	2000-01-21	A cooling apparatus
GB0001442		2000-01-21
PCT/GB2000/003276 WO2001054169A2 (en)	2000-01-21	2000-08-23	Cooling apparatus

Publications (1)

Publication Number	Publication Date
AU6713300A true AU6713300A (en)	2001-07-31

Family

ID=9884134

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU67133/00A Abandoned AU6713300A (en)	2000-01-21	2000-08-23	Cooling apparatus

Country Status (3)

Country	Link
AU (1)	AU6713300A (en)
GB (2)	GB2358463A (en)
WO (1)	WO2001054169A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2101351B1 (en) *	2008-03-13	2016-08-17	Siemens Aktiengesellschaft	Cooling device for cooling a component
WO2011131686A1 (en) *	2010-04-23	2011-10-27	Napatech A/S	A thermally controlled assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA795886A (en) *	1962-02-16	1968-10-01	The General Electric Company Limited. London	Electronic assemblies
US4851965A (en) *	1987-03-09	1989-07-25	Unisys Corporation	Directed air management system for cooling multiple heat sinks
US5103374A (en) *	1990-05-23	1992-04-07	At&T Bell Laboratories	Circuit pack cooling using turbulators
US5110335A (en) *	1990-06-25	1992-05-05	At&T Bell Laboratories	Method of glass soot deposition using ultrasonic nozzle
JP2934493B2 (en) *	1990-10-24	1999-08-16	株式会社日立製作所	Electronic equipment cooling device
DE69307753T2 (en) *	1992-03-24	1997-08-28	Hitachi Ltd	Nozzle cooling device for electronic assembly and computer with this device
JPH09123732A (en) *	1995-11-01	1997-05-13	Zexel Corp	Air conditioner for automobile
WO1997038566A1 (en) *	1996-04-10	1997-10-16	Intergraph Corporation	Removable circuit board with ducted cooling

2000
- 2000-01-21 GB GB0001442A patent/GB2358463A/en not_active Withdrawn
- 2000-08-23 WO PCT/GB2000/003276 patent/WO2001054169A2/en active Application Filing
- 2000-08-23 AU AU67133/00A patent/AU6713300A/en not_active Abandoned
2001
- 2001-01-22 GB GB0101587A patent/GB2358464A/en not_active Withdrawn

Also Published As

Publication number	Publication date
GB2358464A (en)	2001-07-25
GB0001442D0 (en)	2000-03-08
WO2001054169A2 (en)	2001-07-26
GB0101587D0 (en)	2001-03-07
GB2358463A (en)	2001-07-25

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Legal Events

Date	Code	Title	Description
2002-02-28	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase