FR83165E - Procédé de fabrication de circuits électriques enrobés - Google Patents
Procédé de fabrication de circuits électriques enrobésInfo
- Publication number
- FR83165E FR83165E FR915945A FR915945A FR83165E FR 83165 E FR83165 E FR 83165E FR 915945 A FR915945 A FR 915945A FR 915945 A FR915945 A FR 915945A FR 83165 E FR83165 E FR 83165E
- Authority
- FR
- France
- Prior art keywords
- manufacturing process
- electrical circuits
- coated electrical
- coated
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the PCB or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR915945A FR83165E (fr) | 1962-11-20 | 1962-11-20 | Procédé de fabrication de circuits électriques enrobés |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR915945A FR83165E (fr) | 1962-11-20 | 1962-11-20 | Procédé de fabrication de circuits électriques enrobés |
Publications (1)
Publication Number | Publication Date |
---|---|
FR83165E true FR83165E (fr) | 1964-06-26 |
Family
ID=8791147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR915945A Expired FR83165E (fr) | 1962-11-20 | 1962-11-20 | Procédé de fabrication de circuits électriques enrobés |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR83165E (fr) |
-
1962
- 1962-11-20 FR FR915945A patent/FR83165E/fr not_active Expired
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR1235596A (fr) | Procédé de fabrication de circuits électriques | |
FR1378052A (fr) | Procédé de fabrication de composants ou de groupes de composants électriques ou électroniques | |
FR82632E (fr) | Procédé de fabrication de circuits électriques et circuits obtenus par ce procédé | |
FR1362828A (fr) | Procédé de fabrication de structures alvéolaires | |
FR1331507A (fr) | Procédé de fabrication de circuits électriques enrobés | |
FR1509909A (fr) | Procédé de fabrication de 3-hydroxy-benzisoxazoles | |
FR83165E (fr) | Procédé de fabrication de circuits électriques enrobés | |
FR1327213A (fr) | Procédé de fabrication de soutiens-gorge moulés | |
FR1320468A (fr) | Procédé de fabrication de dihydro-glucosides | |
FR1333693A (fr) | Procédé de fabrication de la dicyclohexylamine | |
FR1371768A (fr) | Procédé de fabrication de circuits magnétiques | |
FR1319609A (fr) | Procédé de fabrication de contacts électriques | |
FR1303108A (fr) | Procédé de fabrication d'organes électriques | |
FR1264352A (fr) | Procédé de fabrication de circuits électriques imprimés | |
FR1347775A (fr) | Procédé de fabrication de gluconates | |
FR1348848A (fr) | Procédé de fabrication de nitrophénylchloroformes | |
FR1517673A (fr) | Procédé de fabrication de 3-oxo-delta 4-6-méthyl-stéroïdes | |
FR1316200A (fr) | Procédé de fabrication de pyrrolinylpyrrolidone | |
FR1319884A (fr) | Procédé de fabrication de dl-ribose | |
FR1371801A (fr) | Procédé de fabrication de thiachromonoacridones | |
FR1320528A (fr) | Procédé de fabrication de condensateurs en matières céramiques | |
FR1322528A (fr) | Procédé de fabrication de méthochlorure de 2-pyridine-aldoxime | |
FR1365854A (fr) | Procédé de fabrication de conducteurs en forme de coupelle | |
FR1369601A (fr) | Procédé perfectionné de fabrication de semi-conducteurs | |
FR1320313A (fr) | Procédé de fabrication de phosphates |