FR3103314B1 - Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant - Google Patents

Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant Download PDF

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Publication number
FR3103314B1
FR3103314B1 FR1912702A FR1912702A FR3103314B1 FR 3103314 B1 FR3103314 B1 FR 3103314B1 FR 1912702 A FR1912702 A FR 1912702A FR 1912702 A FR1912702 A FR 1912702A FR 3103314 B1 FR3103314 B1 FR 3103314B1
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Prior art keywords
maneuvering
support
tilting
module
system including
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Active
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FR1912702A
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English (en)
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FR3103314A1 (fr
Inventor
Maxime Parailloux
Joël Fleury
Cyril Dupeyrat
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Safran Electronics and Defense SAS
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Safran Electronics and Defense SAS
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Publication date
Application filed by Safran Electronics and Defense SAS filed Critical Safran Electronics and Defense SAS
Priority to FR1912702A priority Critical patent/FR3103314B1/fr
Priority to CN202080079671.5A priority patent/CN114730723A/zh
Priority to DE112020005593.0T priority patent/DE112020005593T5/de
Priority to PCT/FR2020/051942 priority patent/WO2021094665A1/fr
Priority to US17/773,938 priority patent/US11643718B2/en
Publication of FR3103314A1 publication Critical patent/FR3103314A1/fr
Application granted granted Critical
Publication of FR3103314B1 publication Critical patent/FR3103314B1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Module (10) de manœuvre d’un support (27) d’un ou plusieurs substrats (28) à traiter dans un procédé de dépôt sous vide, qui comporte un bâti pourvu d’un plateau (11) recevant d’un premier côté (10a) un ensemble électronique (15) comportant une électronique d’émission/réception radio, une carte processeur, une électronique de commande de moteurs et une batterie (17) d’alimentation du module, la carte processeur comportant une mémoire programme comportant un programme de pilotage de l’électronique de commande moteurs à partir de données reçues d’un appareil distant pourvu d’un dispositif émetteur/récepteur radio de communication avec l’électronique d’émission/réception du module et, d’un second côté (10b), d’un dispositif de manœuvre dudit support pourvu d’un premier moteur (21) de manœuvre du support en rotation autour d’un premier axe (B) parallèle au plateau et d’un second moteur (22) de manœuvre du support (27) en rotation autour d’un second axe (B) perpendiculaire au plateau. Figure 1
FR1912702A 2019-11-14 2019-11-14 Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant Active FR3103314B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1912702A FR3103314B1 (fr) 2019-11-14 2019-11-14 Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant
CN202080079671.5A CN114730723A (zh) 2019-11-14 2020-10-27 可倾斜且可旋转基板载体及包括该基板载体的多层真空沉积***
DE112020005593.0T DE112020005593T5 (de) 2019-11-14 2020-10-27 Neigbarer und ausrichtbarer substratträger und vakuum-mehrschichtbeschichtungssystem, das ihn umfasst
PCT/FR2020/051942 WO2021094665A1 (fr) 2019-11-14 2020-10-27 Porte substrat inclinable et orientable et système de dépôt multicouche sous vide le comprenant
US17/773,938 US11643718B2 (en) 2019-11-14 2020-10-27 Tiltable and rotatable substrate carrier and multi-layer vacuum deposition system comprising same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1912702A FR3103314B1 (fr) 2019-11-14 2019-11-14 Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant
FR1912702 2019-11-14

Publications (2)

Publication Number Publication Date
FR3103314A1 FR3103314A1 (fr) 2021-05-21
FR3103314B1 true FR3103314B1 (fr) 2021-10-08

Family

ID=69811033

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1912702A Active FR3103314B1 (fr) 2019-11-14 2019-11-14 Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant

Country Status (5)

Country Link
US (1) US11643718B2 (fr)
CN (1) CN114730723A (fr)
DE (1) DE112020005593T5 (fr)
FR (1) FR3103314B1 (fr)
WO (1) WO2021094665A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3127762B1 (fr) * 2021-10-05 2023-10-13 Safran Electronics & Defense Dispositif de chauffage d’un substrat pour dépôt sous vide
FR3127761A1 (fr) * 2021-10-05 2023-04-07 Safran Electronics & Defense Module de contrôle des gradients de caractéristiques physiques d’un dépôt de couche mince par un ensemble de caches automatisés
FR3128032A1 (fr) 2021-10-13 2023-04-14 Safran Electronics & Defense Elément optique antireflet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889632A (en) * 1974-05-31 1975-06-17 Ibm Variable incidence drive for deposition tooling
US4816133A (en) * 1987-05-14 1989-03-28 Northrop Corporation Apparatus for preparing thin film optical coatings on substrates
US6777770B2 (en) * 2002-03-25 2004-08-17 Micron Technology, Inc. Films deposited at glancing incidence for multilevel metallization
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
US7451935B2 (en) * 2005-05-12 2008-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist management system
US20080224327A1 (en) * 2007-03-13 2008-09-18 Daewoong Suh Microelectronic substrate including bumping sites with nanostructures
JP6361495B2 (ja) * 2014-12-22 2018-07-25 東京エレクトロン株式会社 熱処理装置
EP3414541B1 (fr) * 2016-02-08 2020-09-30 Watlow Electric Manufacturing Company Système de détection de température pour ensemble support de tranche rotatif

Also Published As

Publication number Publication date
CN114730723A (zh) 2022-07-08
FR3103314A1 (fr) 2021-05-21
US20220349043A1 (en) 2022-11-03
US11643718B2 (en) 2023-05-09
DE112020005593T5 (de) 2022-08-25
WO2021094665A1 (fr) 2021-05-20

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