FR3103314B1 - Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant - Google Patents
Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant Download PDFInfo
- Publication number
- FR3103314B1 FR3103314B1 FR1912702A FR1912702A FR3103314B1 FR 3103314 B1 FR3103314 B1 FR 3103314B1 FR 1912702 A FR1912702 A FR 1912702A FR 1912702 A FR1912702 A FR 1912702A FR 3103314 B1 FR3103314 B1 FR 3103314B1
- Authority
- FR
- France
- Prior art keywords
- maneuvering
- support
- tilting
- module
- system including
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Module (10) de manœuvre d’un support (27) d’un ou plusieurs substrats (28) à traiter dans un procédé de dépôt sous vide, qui comporte un bâti pourvu d’un plateau (11) recevant d’un premier côté (10a) un ensemble électronique (15) comportant une électronique d’émission/réception radio, une carte processeur, une électronique de commande de moteurs et une batterie (17) d’alimentation du module, la carte processeur comportant une mémoire programme comportant un programme de pilotage de l’électronique de commande moteurs à partir de données reçues d’un appareil distant pourvu d’un dispositif émetteur/récepteur radio de communication avec l’électronique d’émission/réception du module et, d’un second côté (10b), d’un dispositif de manœuvre dudit support pourvu d’un premier moteur (21) de manœuvre du support en rotation autour d’un premier axe (B) parallèle au plateau et d’un second moteur (22) de manœuvre du support (27) en rotation autour d’un second axe (B) perpendiculaire au plateau. Figure 1
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1912702A FR3103314B1 (fr) | 2019-11-14 | 2019-11-14 | Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant |
CN202080079671.5A CN114730723A (zh) | 2019-11-14 | 2020-10-27 | 可倾斜且可旋转基板载体及包括该基板载体的多层真空沉积*** |
DE112020005593.0T DE112020005593T5 (de) | 2019-11-14 | 2020-10-27 | Neigbarer und ausrichtbarer substratträger und vakuum-mehrschichtbeschichtungssystem, das ihn umfasst |
PCT/FR2020/051942 WO2021094665A1 (fr) | 2019-11-14 | 2020-10-27 | Porte substrat inclinable et orientable et système de dépôt multicouche sous vide le comprenant |
US17/773,938 US11643718B2 (en) | 2019-11-14 | 2020-10-27 | Tiltable and rotatable substrate carrier and multi-layer vacuum deposition system comprising same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1912702A FR3103314B1 (fr) | 2019-11-14 | 2019-11-14 | Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant |
FR1912702 | 2019-11-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3103314A1 FR3103314A1 (fr) | 2021-05-21 |
FR3103314B1 true FR3103314B1 (fr) | 2021-10-08 |
Family
ID=69811033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1912702A Active FR3103314B1 (fr) | 2019-11-14 | 2019-11-14 | Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant |
Country Status (5)
Country | Link |
---|---|
US (1) | US11643718B2 (fr) |
CN (1) | CN114730723A (fr) |
DE (1) | DE112020005593T5 (fr) |
FR (1) | FR3103314B1 (fr) |
WO (1) | WO2021094665A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3127762B1 (fr) * | 2021-10-05 | 2023-10-13 | Safran Electronics & Defense | Dispositif de chauffage d’un substrat pour dépôt sous vide |
FR3127761A1 (fr) * | 2021-10-05 | 2023-04-07 | Safran Electronics & Defense | Module de contrôle des gradients de caractéristiques physiques d’un dépôt de couche mince par un ensemble de caches automatisés |
FR3128032A1 (fr) | 2021-10-13 | 2023-04-14 | Safran Electronics & Defense | Elément optique antireflet |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889632A (en) * | 1974-05-31 | 1975-06-17 | Ibm | Variable incidence drive for deposition tooling |
US4816133A (en) * | 1987-05-14 | 1989-03-28 | Northrop Corporation | Apparatus for preparing thin film optical coatings on substrates |
US6777770B2 (en) * | 2002-03-25 | 2004-08-17 | Micron Technology, Inc. | Films deposited at glancing incidence for multilevel metallization |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US7451935B2 (en) * | 2005-05-12 | 2008-11-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist management system |
US20080224327A1 (en) * | 2007-03-13 | 2008-09-18 | Daewoong Suh | Microelectronic substrate including bumping sites with nanostructures |
JP6361495B2 (ja) * | 2014-12-22 | 2018-07-25 | 東京エレクトロン株式会社 | 熱処理装置 |
EP3414541B1 (fr) * | 2016-02-08 | 2020-09-30 | Watlow Electric Manufacturing Company | Système de détection de température pour ensemble support de tranche rotatif |
-
2019
- 2019-11-14 FR FR1912702A patent/FR3103314B1/fr active Active
-
2020
- 2020-10-27 CN CN202080079671.5A patent/CN114730723A/zh active Pending
- 2020-10-27 WO PCT/FR2020/051942 patent/WO2021094665A1/fr active Application Filing
- 2020-10-27 DE DE112020005593.0T patent/DE112020005593T5/de active Pending
- 2020-10-27 US US17/773,938 patent/US11643718B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN114730723A (zh) | 2022-07-08 |
FR3103314A1 (fr) | 2021-05-21 |
US20220349043A1 (en) | 2022-11-03 |
US11643718B2 (en) | 2023-05-09 |
DE112020005593T5 (de) | 2022-08-25 |
WO2021094665A1 (fr) | 2021-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR3103314B1 (fr) | Porte substrat inclinable et orientable et systeme de depot multicouche sous vide le comprenant | |
US11457047B2 (en) | Managing computer security services for cloud computing platforms | |
WO2019137248A1 (fr) | Procédé d'interpolation de trame vidéo, support de stockage et terminal | |
WO2020041187A1 (fr) | Système et procédé d'authentification de service à service | |
US20200036465A1 (en) | Synchronized Transmission on Shared Channel | |
US10127804B2 (en) | Trainable transceiver and cloud computing system architecture systems and methods | |
US7734181B2 (en) | Devices, systems and methods for ad hoc wireless communication | |
US8032622B2 (en) | System and method for social-networking based presence | |
EP3931985A1 (fr) | Système et procédé pour autoriser un accès dans des communications par satellite | |
CN105100415B (zh) | 登录方法、移动终端 | |
EP1981183A2 (fr) | Dispositifs, systèmes et procédés pour communication ad hoc sans fil | |
CN113014969B (zh) | 视频播放的控制方法、终端设备、服务器和存储介质 | |
US20160219057A1 (en) | Privacy controlled network media sharing | |
CN101030969A (zh) | 用于移动车辆的网络服务的方法和*** | |
HK1077141A1 (en) | Method and apparatus for pushing e-mail to wireless communication devices | |
WO2001045388A2 (fr) | Procedes et dispositif de manipulation d'images | |
WO2001075761A2 (fr) | Procede et appareil de traitement de transaction en ligne | |
CN105323341B (zh) | 一种移动终端的交互装置和交互方法 | |
CN109146435A (zh) | 一种授权第三方支付***进行银行转账的方法和装置 | |
CN105320515A (zh) | 一种流计算***中的配置方法、装置和*** | |
US20020142765A1 (en) | Network appliance wireless configuration interface | |
CN106385498A (zh) | 信息归类方法及装置 | |
CN106912004A (zh) | 一种数据传输与接收方法、装置及移动终端 | |
EP0762310B1 (fr) | Système d'échange de données comportant une pluralité de porteurs de données | |
US11620366B2 (en) | Device enabling user preferred functions, preferences, and settings in another electronic device and corresponding methods |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20210521 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |