FR3093270B1 - Superposition of electronic components with insertion into cavities - Google Patents

Superposition of electronic components with insertion into cavities Download PDF

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Publication number
FR3093270B1
FR3093270B1 FR1901925A FR1901925A FR3093270B1 FR 3093270 B1 FR3093270 B1 FR 3093270B1 FR 1901925 A FR1901925 A FR 1901925A FR 1901925 A FR1901925 A FR 1901925A FR 3093270 B1 FR3093270 B1 FR 3093270B1
Authority
FR
France
Prior art keywords
insulating layer
electronic component
superposition
cavities
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1901925A
Other languages
French (fr)
Other versions
FR3093270A1 (en
Inventor
Philippe Chocteau
Denis Lecordier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Safran Electronics and Defense SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electronics and Defense SAS filed Critical Safran Electronics and Defense SAS
Priority to FR1901925A priority Critical patent/FR3093270B1/en
Publication of FR3093270A1 publication Critical patent/FR3093270A1/en
Application granted granted Critical
Publication of FR3093270B1 publication Critical patent/FR3093270B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L’invention concerne une carte électronique (1) comprenant : un premier circuit imprimé (10) comprenant une première couche isolante (11), une deuxième couche isolante (13) fixée sur la première couche isolante (11) et dans laquelle est formée une cavité (5) débouchante et au moins une deuxième couche conductrice fixée sur la deuxième couche isolante (13), ladite deuxième couche conductrice étant traitée de sorte à former au moins une deuxième plage de brasage (14), et au moins un premier composant électronique (2) et au moins un deuxième composant électronique (3), le premier composant électronique (2) étant logé dans la cavité (5) de la deuxième couche isolante (13), le deuxième composant électronique (3) étant placé de sorte à recouvrir de la cavité (5) et du premier composant électronique (2) en étant brasé sur l’au moins une deuxième plage de brasage (14). Figure pour l’abrégé : Fig. 4The invention relates to an electronic card (1) comprising: a first printed circuit (10) comprising a first insulating layer (11), a second insulating layer (13) fixed to the first insulating layer (11) and in which a first insulating layer (11) is formed. opening cavity (5) and at least one second conductive layer fixed to the second insulating layer (13), said second conductive layer being treated so as to form at least one second soldering pad (14), and at least one first electronic component (2) and at least a second electronic component (3), the first electronic component (2) being housed in the cavity (5) of the second insulating layer (13), the second electronic component (3) being placed so as to covering the cavity (5) and the first electronic component (2) by being soldered to the at least one second soldering pad (14). Figure for the abstract: Fig. 4

FR1901925A 2019-02-25 2019-02-25 Superposition of electronic components with insertion into cavities Active FR3093270B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1901925A FR3093270B1 (en) 2019-02-25 2019-02-25 Superposition of electronic components with insertion into cavities

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1901925 2019-02-25
FR1901925A FR3093270B1 (en) 2019-02-25 2019-02-25 Superposition of electronic components with insertion into cavities

Publications (2)

Publication Number Publication Date
FR3093270A1 FR3093270A1 (en) 2020-08-28
FR3093270B1 true FR3093270B1 (en) 2021-11-05

Family

ID=67587818

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1901925A Active FR3093270B1 (en) 2019-02-25 2019-02-25 Superposition of electronic components with insertion into cavities

Country Status (1)

Country Link
FR (1) FR3093270B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157295A1 (en) * 2006-12-20 2008-07-03 Custom One Design, Inc. Methods and apparatus for multichip module packaging
US20140158414A1 (en) 2012-12-11 2014-06-12 Chris Baldwin Recessed discrete component mounting on organic substrate
KR102171021B1 (en) * 2014-03-14 2020-10-28 삼성전자주식회사 Method for manufacturing circuit board and semiconductor package
US20180020547A1 (en) * 2016-07-13 2018-01-18 Alcatel-Lucent Canada Inc. Underlying recessed component placement
FR3069127B1 (en) 2017-07-13 2019-07-26 Safran Electronics & Defense ELECTRONIC CARD COMPRISING BRASED CMS ON BRAZING BEACHES ENTERREES
FR3069128B1 (en) 2017-07-13 2020-06-26 Safran Electronics & Defense FIXING A CMS ON AN INSULATING LAYER WITH A SOLDERING JOINT IN A CAVITY PRODUCED IN AN INSULATING LAYER

Also Published As

Publication number Publication date
FR3093270A1 (en) 2020-08-28

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