FR3093270B1 - Superposition of electronic components with insertion into cavities - Google Patents
Superposition of electronic components with insertion into cavities Download PDFInfo
- Publication number
- FR3093270B1 FR3093270B1 FR1901925A FR1901925A FR3093270B1 FR 3093270 B1 FR3093270 B1 FR 3093270B1 FR 1901925 A FR1901925 A FR 1901925A FR 1901925 A FR1901925 A FR 1901925A FR 3093270 B1 FR3093270 B1 FR 3093270B1
- Authority
- FR
- France
- Prior art keywords
- insulating layer
- electronic component
- superposition
- cavities
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000037431 insertion Effects 0.000 title 1
- 238000003780 insertion Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
L’invention concerne une carte électronique (1) comprenant : un premier circuit imprimé (10) comprenant une première couche isolante (11), une deuxième couche isolante (13) fixée sur la première couche isolante (11) et dans laquelle est formée une cavité (5) débouchante et au moins une deuxième couche conductrice fixée sur la deuxième couche isolante (13), ladite deuxième couche conductrice étant traitée de sorte à former au moins une deuxième plage de brasage (14), et au moins un premier composant électronique (2) et au moins un deuxième composant électronique (3), le premier composant électronique (2) étant logé dans la cavité (5) de la deuxième couche isolante (13), le deuxième composant électronique (3) étant placé de sorte à recouvrir de la cavité (5) et du premier composant électronique (2) en étant brasé sur l’au moins une deuxième plage de brasage (14). Figure pour l’abrégé : Fig. 4The invention relates to an electronic card (1) comprising: a first printed circuit (10) comprising a first insulating layer (11), a second insulating layer (13) fixed to the first insulating layer (11) and in which a first insulating layer (11) is formed. opening cavity (5) and at least one second conductive layer fixed to the second insulating layer (13), said second conductive layer being treated so as to form at least one second soldering pad (14), and at least one first electronic component (2) and at least a second electronic component (3), the first electronic component (2) being housed in the cavity (5) of the second insulating layer (13), the second electronic component (3) being placed so as to covering the cavity (5) and the first electronic component (2) by being soldered to the at least one second soldering pad (14). Figure for the abstract: Fig. 4
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1901925A FR3093270B1 (en) | 2019-02-25 | 2019-02-25 | Superposition of electronic components with insertion into cavities |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1901925 | 2019-02-25 | ||
FR1901925A FR3093270B1 (en) | 2019-02-25 | 2019-02-25 | Superposition of electronic components with insertion into cavities |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3093270A1 FR3093270A1 (en) | 2020-08-28 |
FR3093270B1 true FR3093270B1 (en) | 2021-11-05 |
Family
ID=67587818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1901925A Active FR3093270B1 (en) | 2019-02-25 | 2019-02-25 | Superposition of electronic components with insertion into cavities |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3093270B1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080157295A1 (en) * | 2006-12-20 | 2008-07-03 | Custom One Design, Inc. | Methods and apparatus for multichip module packaging |
US20140158414A1 (en) | 2012-12-11 | 2014-06-12 | Chris Baldwin | Recessed discrete component mounting on organic substrate |
KR102171021B1 (en) * | 2014-03-14 | 2020-10-28 | 삼성전자주식회사 | Method for manufacturing circuit board and semiconductor package |
US20180020547A1 (en) * | 2016-07-13 | 2018-01-18 | Alcatel-Lucent Canada Inc. | Underlying recessed component placement |
FR3069127B1 (en) | 2017-07-13 | 2019-07-26 | Safran Electronics & Defense | ELECTRONIC CARD COMPRISING BRASED CMS ON BRAZING BEACHES ENTERREES |
FR3069128B1 (en) | 2017-07-13 | 2020-06-26 | Safran Electronics & Defense | FIXING A CMS ON AN INSULATING LAYER WITH A SOLDERING JOINT IN A CAVITY PRODUCED IN AN INSULATING LAYER |
-
2019
- 2019-02-25 FR FR1901925A patent/FR3093270B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3093270A1 (en) | 2020-08-28 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20200828 |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |