FR3086460B1 - Dispositif electronique comprenant une puce optique et procede de fabrication - Google Patents

Dispositif electronique comprenant une puce optique et procede de fabrication Download PDF

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Publication number
FR3086460B1
FR3086460B1 FR1858736A FR1858736A FR3086460B1 FR 3086460 B1 FR3086460 B1 FR 3086460B1 FR 1858736 A FR1858736 A FR 1858736A FR 1858736 A FR1858736 A FR 1858736A FR 3086460 B1 FR3086460 B1 FR 3086460B1
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FR
France
Prior art keywords
chip
electronic device
cover
manufacturing process
device including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1858736A
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English (en)
Other versions
FR3086460A1 (fr
Inventor
Nicolas Mastromauro
Karine Saxod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR1858736A priority Critical patent/FR3086460B1/fr
Priority to US16/572,979 priority patent/US10923638B2/en
Publication of FR3086460A1 publication Critical patent/FR3086460A1/fr
Priority to US17/145,929 priority patent/US20210135072A1/en
Application granted granted Critical
Publication of FR3086460B1 publication Critical patent/FR3086460B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)

Abstract

Dispositif électronique et procédé de fabrication, dans lesquels : un substrat de support (2) présente une face avant de montage (4), une puce électronique (6) est montée sur la face avant de montage du substrat de support et pourvue dans sa face avant d'un composant optique (8), un capot (10) d'encapsulation de la puce est monté au-dessus de ladite face avant du substrat de support, délimite une chambre (11) dans laquelle se situe la puce et présente une ouverture avant (12) située en avant du composant optique de la puce, un élément optique (13), apte à être traversé par la lumière, est monté sur le capot et recouvre l'ouverture du capot, et un masque additionnel (14) est monté sur le capot, qui s'étend en avant dudit élément optique et qui présente une ouverture locale (15) située en avant du composant optique de la puce.
FR1858736A 2018-09-25 2018-09-25 Dispositif electronique comprenant une puce optique et procede de fabrication Active FR3086460B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1858736A FR3086460B1 (fr) 2018-09-25 2018-09-25 Dispositif electronique comprenant une puce optique et procede de fabrication
US16/572,979 US10923638B2 (en) 2018-09-25 2019-09-17 Electronic device comprising an optical chip and method of fabrication
US17/145,929 US20210135072A1 (en) 2018-09-25 2021-01-11 Electronic device comprising an optical chip and method of fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1858736A FR3086460B1 (fr) 2018-09-25 2018-09-25 Dispositif electronique comprenant une puce optique et procede de fabrication

Publications (2)

Publication Number Publication Date
FR3086460A1 FR3086460A1 (fr) 2020-03-27
FR3086460B1 true FR3086460B1 (fr) 2021-10-29

Family

ID=65243853

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1858736A Active FR3086460B1 (fr) 2018-09-25 2018-09-25 Dispositif electronique comprenant une puce optique et procede de fabrication

Country Status (2)

Country Link
US (2) US10923638B2 (fr)
FR (1) FR3086460B1 (fr)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040061799A1 (en) * 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
JP4441211B2 (ja) * 2003-08-13 2010-03-31 シチズン電子株式会社 小型撮像モジュール
US20050099659A1 (en) * 2003-11-10 2005-05-12 Jichen Wu Image sensor module
JP5252770B2 (ja) * 2004-06-10 2013-07-31 三星電子株式会社 イメージセンサーパッケージの組立方法
US7718970B2 (en) 2005-11-25 2010-05-18 Panasonic Electric Works Co., Ltd. Infrared detection unit using a semiconductor optical lens
CN100531308C (zh) * 2005-12-02 2009-08-19 鸿富锦精密工业（深圳）有限公司 数码相机模组
JP4162038B2 (ja) 2007-02-01 2008-10-08 コニカミノルタオプト株式会社 撮像装置及び携帯端末
FR2931587B1 (fr) 2008-05-21 2011-05-13 Commissariat Energie Atomique Procede de realisation d'un dispositif optique a composants optoelectroniques integres
TWI570400B (zh) * 2015-08-17 2017-02-11 原相科技股份有限公司 可防止漏光的光學偵測裝置

Also Published As

Publication number Publication date
US10923638B2 (en) 2021-02-16
US20200098958A1 (en) 2020-03-26
US20210135072A1 (en) 2021-05-06
FR3086460A1 (fr) 2020-03-27

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