FR3086460B1 - Dispositif electronique comprenant une puce optique et procede de fabrication - Google Patents
Dispositif electronique comprenant une puce optique et procede de fabrication Download PDFInfo
- Publication number
- FR3086460B1 FR3086460B1 FR1858736A FR1858736A FR3086460B1 FR 3086460 B1 FR3086460 B1 FR 3086460B1 FR 1858736 A FR1858736 A FR 1858736A FR 1858736 A FR1858736 A FR 1858736A FR 3086460 B1 FR3086460 B1 FR 3086460B1
- Authority
- FR
- France
- Prior art keywords
- chip
- electronic device
- cover
- manufacturing process
- device including
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Abstract
Dispositif électronique et procédé de fabrication, dans lesquels : un substrat de support (2) présente une face avant de montage (4), une puce électronique (6) est montée sur la face avant de montage du substrat de support et pourvue dans sa face avant d'un composant optique (8), un capot (10) d'encapsulation de la puce est monté au-dessus de ladite face avant du substrat de support, délimite une chambre (11) dans laquelle se situe la puce et présente une ouverture avant (12) située en avant du composant optique de la puce, un élément optique (13), apte à être traversé par la lumière, est monté sur le capot et recouvre l'ouverture du capot, et un masque additionnel (14) est monté sur le capot, qui s'étend en avant dudit élément optique et qui présente une ouverture locale (15) située en avant du composant optique de la puce.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1858736A FR3086460B1 (fr) | 2018-09-25 | 2018-09-25 | Dispositif electronique comprenant une puce optique et procede de fabrication |
US16/572,979 US10923638B2 (en) | 2018-09-25 | 2019-09-17 | Electronic device comprising an optical chip and method of fabrication |
US17/145,929 US20210135072A1 (en) | 2018-09-25 | 2021-01-11 | Electronic device comprising an optical chip and method of fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1858736A FR3086460B1 (fr) | 2018-09-25 | 2018-09-25 | Dispositif electronique comprenant une puce optique et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3086460A1 FR3086460A1 (fr) | 2020-03-27 |
FR3086460B1 true FR3086460B1 (fr) | 2021-10-29 |
Family
ID=65243853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1858736A Active FR3086460B1 (fr) | 2018-09-25 | 2018-09-25 | Dispositif electronique comprenant une puce optique et procede de fabrication |
Country Status (2)
Country | Link |
---|---|
US (2) | US10923638B2 (fr) |
FR (1) | FR3086460B1 (fr) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040061799A1 (en) * | 2002-09-27 | 2004-04-01 | Konica Corporation | Image pickup device and portable terminal equipped therewith |
JP4441211B2 (ja) * | 2003-08-13 | 2010-03-31 | シチズン電子株式会社 | 小型撮像モジュール |
US20050099659A1 (en) * | 2003-11-10 | 2005-05-12 | Jichen Wu | Image sensor module |
JP5252770B2 (ja) * | 2004-06-10 | 2013-07-31 | 三星電子株式会社 | イメージセンサーパッケージの組立方法 |
US7718970B2 (en) | 2005-11-25 | 2010-05-18 | Panasonic Electric Works Co., Ltd. | Infrared detection unit using a semiconductor optical lens |
CN100531308C (zh) * | 2005-12-02 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模组 |
JP4162038B2 (ja) | 2007-02-01 | 2008-10-08 | コニカミノルタオプト株式会社 | 撮像装置及び携帯端末 |
FR2931587B1 (fr) | 2008-05-21 | 2011-05-13 | Commissariat Energie Atomique | Procede de realisation d'un dispositif optique a composants optoelectroniques integres |
TWI570400B (zh) * | 2015-08-17 | 2017-02-11 | 原相科技股份有限公司 | 可防止漏光的光學偵測裝置 |
-
2018
- 2018-09-25 FR FR1858736A patent/FR3086460B1/fr active Active
-
2019
- 2019-09-17 US US16/572,979 patent/US10923638B2/en active Active
-
2021
- 2021-01-11 US US17/145,929 patent/US20210135072A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US10923638B2 (en) | 2021-02-16 |
US20200098958A1 (en) | 2020-03-26 |
US20210135072A1 (en) | 2021-05-06 |
FR3086460A1 (fr) | 2020-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7659134B2 (en) | Microelectronic imagers and methods for manufacturing such microelectronic imagers | |
US8851154B2 (en) | Cooling module and system for lamp device | |
JP2020504937A5 (fr) | ||
US10326039B2 (en) | Proximity detector device with interconnect layers and related methods | |
CN109698894A (zh) | 基于金属支架的感光组件和摄像模组 | |
ATE402563T1 (de) | Kameramodul | |
TWI688835B (zh) | 相機模組的製作方法 | |
TNSN07302A1 (fr) | Procede de placement d'un ensemble electronique sur un substrat et dispositif de placement d'un tel ensemble | |
US20160254424A1 (en) | Optoelectronic lighting device | |
FR3086459B1 (fr) | Dispositif electronique comprenant une puce optique et procede de fabrication | |
FR3086460B1 (fr) | Dispositif electronique comprenant une puce optique et procede de fabrication | |
TW201811012A (zh) | 影像感測模組及照相模組 | |
US9470635B2 (en) | System of measuring warpage and method of measuring warpage | |
WO2018115709A1 (fr) | Module électronique de puissance comprenant une face d'échange thermique | |
FR3062923B1 (fr) | Dispositif et procede d'etalonnage pour mesures radar | |
CN105810623A (zh) | 基板尺度的掩模对准 | |
US11320379B2 (en) | SELS nano finger sidewall coating layer | |
EP3732732B1 (fr) | Modules optoélectroniques comportant des substrats transparents et leurs procédés de fabrication | |
FR3109245B1 (fr) | Dispositif électronique comprenant une structure d’encapsulation transparente logeant une puce électronique et procédé de fabrication correspondant | |
CN212873037U (zh) | 带摄像头的振镜 | |
FR3096831B1 (fr) | Dispositif électronique comprenant une puce électronique montée au-dessus d’un substrat de support | |
JP6884595B2 (ja) | 電子部品、電子機器及び電子部品の製造方法 | |
TW202026686A (zh) | 光學裝置 | |
FR2497962A1 (fr) | Dispositif photometrique reflex pour appareil photographique | |
FR3077177B1 (fr) | Systeme de refroidissement d'un dispositif electronique et methode d'assemblage |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20200327 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |