FR3076395B1 - Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes - Google Patents

Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes Download PDF

Info

Publication number
FR3076395B1
FR3076395B1 FR1701388A FR1701388A FR3076395B1 FR 3076395 B1 FR3076395 B1 FR 3076395B1 FR 1701388 A FR1701388 A FR 1701388A FR 1701388 A FR1701388 A FR 1701388A FR 3076395 B1 FR3076395 B1 FR 3076395B1
Authority
FR
France
Prior art keywords
temperature
component
cooling module
thermal control
electronic system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1701388A
Other languages
English (en)
Other versions
FR3076395A1 (fr
Inventor
Romain Hodot
Claude Sarno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR1701388A priority Critical patent/FR3076395B1/fr
Priority to NO20181675A priority patent/NO20181675A1/en
Priority to US16/232,779 priority patent/US11300332B2/en
Priority to CN201811601696.8A priority patent/CN109976411B/zh
Priority to DE102018133643.8A priority patent/DE102018133643A1/de
Publication of FR3076395A1 publication Critical patent/FR3076395A1/fr
Application granted granted Critical
Publication of FR3076395B1 publication Critical patent/FR3076395B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
    • G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
    • G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
    • G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
    • G01C21/18—Stabilised platforms, e.g. by gyroscope
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Nonlinear Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Eletrric Generators (AREA)
  • Control Of Electric Motors In General (AREA)
  • Control Of Linear Motors (AREA)
  • Power Conversion In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de contrôle (16) thermique d'un composant (14), le dispositif de contrôle (16) comportant : - une alimentation électrique, - un convertisseur propre à convertir une variation de température en une variation de résistance, - un module de refroidissement comportant deux faces, une première face à une première température et une deuxième face à une deuxième température, la différence entre la première température et la deuxième température étant fonction du courant alimentant le module de refroidissement, la première face étant en contact avec le composant (14), le module de refroidissement, le convertisseur et l'alimentation électrique étant agencés électriquement pour que le courant alimentant le convertisseur diminue avec une augmentation de température, le courant alimentant le module de refroidissement reste lui constant.
FR1701388A 2017-12-28 2017-12-28 Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes Active FR3076395B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1701388A FR3076395B1 (fr) 2017-12-28 2017-12-28 Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes
NO20181675A NO20181675A1 (en) 2017-12-28 2018-12-21 Thermal control device of a component, associated electronic system and platform
US16/232,779 US11300332B2 (en) 2017-12-28 2018-12-26 Thermal control device of a component, associated electronic system and platform
CN201811601696.8A CN109976411B (zh) 2017-12-28 2018-12-26 部件的热控制装置、相关电子***及平台
DE102018133643.8A DE102018133643A1 (de) 2017-12-28 2018-12-28 Vorrichtung zur thermischen Steuerung eines Bauteils, zugehöriges elektronisches System und Plattform

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1701388 2017-12-28
FR1701388A FR3076395B1 (fr) 2017-12-28 2017-12-28 Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes

Publications (2)

Publication Number Publication Date
FR3076395A1 FR3076395A1 (fr) 2019-07-05
FR3076395B1 true FR3076395B1 (fr) 2020-01-17

Family

ID=62143228

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1701388A Active FR3076395B1 (fr) 2017-12-28 2017-12-28 Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes

Country Status (5)

Country Link
US (1) US11300332B2 (fr)
CN (1) CN109976411B (fr)
DE (1) DE102018133643A1 (fr)
FR (1) FR3076395B1 (fr)
NO (1) NO20181675A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110874105A (zh) * 2019-11-20 2020-03-10 中国船舶重工集团公司第七0七研究所 一种保持惯导***惯性组件恒定空间温度场的温补结构
CN112556235B (zh) * 2020-11-25 2022-04-15 杭州大和热磁电子有限公司 一种多回路微型半导体制冷芯片

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518282B1 (fr) * 1981-12-16 1985-09-06 Paturel Michel Procede pour controler la temperature d'un appareil et appareils mettant en oeuvre un tel procede
US5117638A (en) * 1991-03-14 1992-06-02 Steve Feher Selectively cooled or heated seat construction and apparatus for providing temperature conditioned fluid and method therefor
JPH07288351A (ja) * 1994-04-19 1995-10-31 Fujitsu Ltd ペルチェ制御回路及びその素子構造
US5704213A (en) * 1995-08-15 1998-01-06 Raytheon E-Systems, Inc. Method and apparatus for controlling the temperature of a device using independent multi-stage thermoelectric coolers
US5687573A (en) * 1996-06-06 1997-11-18 Shih; Ping-Ho Thermal control device for cooling or heating parked vehicles
FR2752942B1 (fr) * 1996-08-29 1998-11-20 Gibert Francis Jean Paul Composant accelerometre a faible derive
US6864092B1 (en) * 1998-08-13 2005-03-08 Symyx Technologies, Inc. Parallel reactor with internal sensing and method of using same
US6443003B1 (en) * 2000-11-14 2002-09-03 International Business Machines Corporation Thermoelectric air flow sensor
US6557353B1 (en) * 2002-01-25 2003-05-06 Michael A. Fusco Apparatus and method for cooling an object
US6487864B1 (en) * 2002-04-23 2002-12-03 Honeywell International Inc. Cyrogenic inertial micro-electro-mechanical system (MEMS) device
JP4108400B2 (ja) * 2002-07-24 2008-06-25 富士通株式会社 電界吸収型光変調器を備えた半導体レーザモジュールの駆動回路および駆動方法
US6711904B1 (en) * 2003-03-06 2004-03-30 Texas Instruments Incorporated Active thermal management of semiconductor devices
JP4307130B2 (ja) * 2003-04-08 2009-08-05 キヤノン株式会社 露光装置
JP5148815B2 (ja) * 2005-01-20 2013-02-20 住友電気工業株式会社 光送信モジュール
WO2007001291A2 (fr) * 2005-06-24 2007-01-04 Carrier Corporation Dispositif concu pour commander un systeme thermoelectrique
US7872399B2 (en) * 2005-11-11 2011-01-18 Hitachi Medical Corporation Ultrasonic probe and ultrasonic diagnosis apparatus
JP4695989B2 (ja) * 2006-01-27 2011-06-08 富士通株式会社 差動ｍ位相偏移変調信号の復調用干渉計
WO2008086499A2 (fr) * 2007-01-10 2008-07-17 Amerigon Incorporated Dispositif thermoélectrique
CN101463984A (zh) * 2007-12-17 2009-06-24 富士迈半导体精密工业（上海）有限公司 照明装置
US20120042661A1 (en) * 2008-12-11 2012-02-23 Lamos Inc. Split thermo-electric cycles for simultaneous cooling, heating, and temperature control
JP5481977B2 (ja) * 2009-07-10 2014-04-23 富士通株式会社 温度制御方法、温度制御装置及び光デバイス
JP5308294B2 (ja) * 2009-09-25 2013-10-09 パナソニック株式会社 ペルチェ素子の冷却制御回路
DE102009058673A1 (de) * 2009-12-16 2011-06-22 Behr GmbH & Co. KG, 70469 Thermoelektrischer Wärmetauscher
GB2484486A (en) * 2010-10-12 2012-04-18 Oclaro Technology Ltd Component Temperature Control
WO2012063011A2 (fr) * 2010-11-08 2012-05-18 Bg Research Ltd Chauffage et refroidissement de cuves à réaction biologique à faible volume
US20120198859A1 (en) * 2011-02-03 2012-08-09 Iberica del Espacio, S.A., Thermal control device
WO2014022419A1 (fr) * 2012-07-30 2014-02-06 Marlow Industries, Inc. Literie à commande thermoélectrique du niveau personnel de confort
KR101438949B1 (ko) * 2012-12-14 2014-09-11 현대자동차주식회사 전기차량의 공조장치
KR20140113029A (ko) * 2013-03-15 2014-09-24 삼성전자주식회사 열전소자가 배치된 히트 슬러그 및 이를 구비하는 반도체 패키지
US10198048B2 (en) * 2013-10-03 2019-02-05 Peerless Industries, Inc. Media device enclosure system
US20150323228A1 (en) * 2014-05-08 2015-11-12 Delphi Technologies, Inc. Heat Exchanger Having a Plurality of Thermoelectric Modules Connected in Series
GB2534081B (en) * 2013-10-22 2020-01-22 Guentner Gmbh & Co Kg Control unit for a heat exchanger, heat exchanger, and a method for regulating a heat exchanger
US9797632B2 (en) * 2014-03-03 2017-10-24 Marlow Industries, Inc. Dual core personal comfort engine (PCE)
JP6782225B2 (ja) * 2014-04-29 2020-11-11 ウィリアム ディーン ウォレスＷＡＬＬＡＣＥ， Ｗｉｌｌｉａｍ， Ｄｅａｎ 頸部の腫瘍性及び増殖性細胞及び他の皮膚科学的又は表面関連疾患を治療する治療方法及びポータブル外科装置
CN111998572B (zh) * 2014-05-23 2022-05-03 莱尔德热管理***股份有限公司 包括电阻加热器的热电加热/冷却装置
US9685598B2 (en) * 2014-11-05 2017-06-20 Novation Iq Llc Thermoelectric device
US10072881B2 (en) * 2014-11-26 2018-09-11 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
US20160178264A1 (en) * 2014-12-23 2016-06-23 The Trustees Of Dartmouth College Temperature gradient system and method
EP3112182A1 (fr) * 2015-06-30 2017-01-04 Dong-A Pencil Co., Ltd. Dispositif de suppression de chaleur destiné à éliminer l'encre modifiable thermiquement
DE102015213294A1 (de) * 2015-07-15 2017-01-19 Mahle International Gmbh Thermoelektrischer Wärmetauscher
US9745621B2 (en) * 2015-08-17 2017-08-29 Wisys Technology Foundation, Inc. Temperature gradient surface plasmon resonance instrument
US20170135902A1 (en) * 2015-10-23 2017-05-18 Stephen J. Scully, JR. All-in-one system to store and transport temperature sensitive items: devices and methods for controlling and monitoring temperature as well as security in real-time.
CN106793669B (zh) * 2015-11-20 2019-04-19 华为技术有限公司 一种散热组件及通信设备
US10655896B2 (en) * 2015-12-21 2020-05-19 Invensense, Inc. Temperature stabilizing enclosure
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
US20170276409A1 (en) * 2016-03-25 2017-09-28 Vital Trends, Inc. Active Temperature Controlled Mobile Transportation Device
US10299655B2 (en) * 2016-05-16 2019-05-28 General Electric Company Caloric heat pump dishwasher appliance
US20170328608A1 (en) * 2016-05-16 2017-11-16 General Electric Company Caloric Heat Pump Ice Making Appliance

Also Published As

Publication number Publication date
CN109976411B (zh) 2021-11-12
US11300332B2 (en) 2022-04-12
US20190203982A1 (en) 2019-07-04
CN109976411A (zh) 2019-07-05
DE102018133643A1 (de) 2019-07-04
NO20181675A1 (en) 2019-07-01
FR3076395A1 (fr) 2019-07-05

Similar Documents

Publication Publication Date Title
KR200421908Y1 (ko) 다용도 손난로
JP5540668B2 (ja) 充電システム
FR3076395B1 (fr) Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes
FR2868219B1 (fr) Systeme d'alimentation de vehicule avec regulateur serie
JP2009106010A (ja) 電源システム
FR3054737B1 (fr) Dispositif de controle-commande d'un inverseur de sources
FR3053856B1 (fr) Systeme d’alimentation electrique d’un propulseur electrique a effet hall
FR3078593B1 (fr) Circuit de protection contre les surtensions et appareil electrique comportant au moins un tel circuit de protection
FR3045978B1 (fr) Dispositif de controle d’un convertisseur dc/dc en presence d’une surtension ou sous-tension dans un circuit electrique
FR2988534B1 (fr) Dispositif d'alimentation electrique
FR3010593B1 (fr) Systeme de commande d'une charge electrique
CN103078559A (zh) 一种热电转换方法及终端
FR3089053B1 (fr) Dispositif de protection pour un circuit électrique, circuit électrique équipé d’un tel dispositif et procédé de protection d’un tel circuit électrique
JP6031802B2 (ja) 温度制御装置
PL412959A1 (pl) Obudowa do elementów elektrycznych i elektronicznych
FR3062530B1 (fr) Dispositif de pilotage de l'alimentation electrique pour une source lumineuse a semi-conducteur
FR3096466B1 (fr) Dispositif comprenant un circuit de démarrage
FR3100116B1 (fr) Appareil électrique, notamment à raclette
KR20200027222A (ko) 온도 차를 이용한 충전 장치
FI20110144A (fi) Järjestely sulakkeen valvomiseksi
FR3091057B1 (fr) Dispositif de pré-charge et convertisseur de tension comportant un tel dispositif.
FR3019407B1 (fr) Mono-onduleur
EP2782151B1 (fr) Générateur électrique
FR3089360B1 (fr) Variateur électronique pour circuit basse tension
FR3064877B1 (fr) Dispositif d'alimentation electrique d'au moins une led et d'au moins un composant electronique, comprenant un circuit de pilotage de l'alimentation electrique muni d'un insert

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20190705

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7