FR3043248B1 - Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene - Google Patents

Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene

Info

Publication number
FR3043248B1
FR3043248B1 FR1560418A FR1560418A FR3043248B1 FR 3043248 B1 FR3043248 B1 FR 3043248B1 FR 1560418 A FR1560418 A FR 1560418A FR 1560418 A FR1560418 A FR 1560418A FR 3043248 B1 FR3043248 B1 FR 3043248B1
Authority
FR
France
Prior art keywords
formation
semiconductor film
trap layer
hydrogen trap
removing defects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1560418A
Other languages
English (en)
Other versions
FR3043248A1 (fr
Inventor
Aurelie Tauzin
Emmanuelle Lagoutte
Frederic Mazen
Luce Flavia Piegas
Shay Reboh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1560418A priority Critical patent/FR3043248B1/fr
Priority to EP16788111.9A priority patent/EP3369110A1/fr
Priority to US15/771,557 priority patent/US20180315644A1/en
Priority to PCT/EP2016/076033 priority patent/WO2017072276A1/fr
Publication of FR3043248A1 publication Critical patent/FR3043248A1/fr
Application granted granted Critical
Publication of FR3043248B1 publication Critical patent/FR3043248B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
FR1560418A 2015-10-30 2015-10-30 Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene Active FR3043248B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1560418A FR3043248B1 (fr) 2015-10-30 2015-10-30 Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene
EP16788111.9A EP3369110A1 (fr) 2015-10-30 2016-10-28 Procédé d'élimination de défauts dans un film semiconducteur comprenant la formation d'une couche de piégeage d'hydrogène
US15/771,557 US20180315644A1 (en) 2015-10-30 2016-10-28 Method of eliminating faults in a semiconductor film comprising the formation of a hydrogen trapping layer
PCT/EP2016/076033 WO2017072276A1 (fr) 2015-10-30 2016-10-28 Procédé d'élimination de défauts dans un film semiconducteur comprenant la formation d'une couche de piégeage d'hydrogène

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1560418A FR3043248B1 (fr) 2015-10-30 2015-10-30 Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene

Publications (2)

Publication Number Publication Date
FR3043248A1 FR3043248A1 (fr) 2017-05-05
FR3043248B1 true FR3043248B1 (fr) 2017-12-15

Family

ID=55589937

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1560418A Active FR3043248B1 (fr) 2015-10-30 2015-10-30 Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene

Country Status (4)

Country Link
US (1) US20180315644A1 (fr)
EP (1) EP3369110A1 (fr)
FR (1) FR3043248B1 (fr)
WO (1) WO2017072276A1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2968121B1 (fr) * 2010-11-30 2012-12-21 Soitec Silicon On Insulator Procede de transfert d'une couche a haute temperature
FR2974944B1 (fr) * 2011-05-02 2013-06-14 Commissariat Energie Atomique Procédé de formation d'une fracture dans un matériau

Also Published As

Publication number Publication date
WO2017072276A1 (fr) 2017-05-04
US20180315644A1 (en) 2018-11-01
FR3043248A1 (fr) 2017-05-05
EP3369110A1 (fr) 2018-09-05

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