FR2987616B1 - Dispositif transducteur micromecanique de son et son procede de realisation - Google Patents

Dispositif transducteur micromecanique de son et son procede de realisation

Info

Publication number
FR2987616B1
FR2987616B1 FR1351944A FR1351944A FR2987616B1 FR 2987616 B1 FR2987616 B1 FR 2987616B1 FR 1351944 A FR1351944 A FR 1351944A FR 1351944 A FR1351944 A FR 1351944A FR 2987616 B1 FR2987616 B1 FR 2987616B1
Authority
FR
France
Prior art keywords
producing
same
transducer device
micromechanical transducer
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1351944A
Other languages
English (en)
Other versions
FR2987616A1 (fr
Inventor
Ricardo Ehrenpfordt
Mathias Bruendel
Andre Gerlach
Christina Leinenbach
Sonja Knies
Ando Feyh
Ulrike Scholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2987616A1 publication Critical patent/FR2987616A1/fr
Application granted granted Critical
Publication of FR2987616B1 publication Critical patent/FR2987616B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/006—Transducers other than those covered by groups H04R9/00 - H04R21/00 using solid state devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
FR1351944A 2012-03-05 2013-03-05 Dispositif transducteur micromecanique de son et son procede de realisation Active FR2987616B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012203373A DE102012203373A1 (de) 2012-03-05 2012-03-05 Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren

Publications (2)

Publication Number Publication Date
FR2987616A1 FR2987616A1 (fr) 2013-09-06
FR2987616B1 true FR2987616B1 (fr) 2017-11-10

Family

ID=48985124

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1351944A Active FR2987616B1 (fr) 2012-03-05 2013-03-05 Dispositif transducteur micromecanique de son et son procede de realisation

Country Status (4)

Country Link
US (1) US20130228937A1 (fr)
CN (1) CN103313172B (fr)
DE (1) DE102012203373A1 (fr)
FR (1) FR2987616B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106794983A (zh) * 2014-08-01 2017-05-31 卡尔·弗罗伊登伯格公司 传感器
US10433088B2 (en) 2014-08-26 2019-10-01 Goertek Inc. PCB speaker and method for micromachining speaker diaphragm on PCB substrate
US10057689B2 (en) * 2014-08-26 2018-08-21 Goertek Inc. Silicon speaker
JP6402983B2 (ja) * 2014-08-29 2018-10-10 セイコーエプソン株式会社 超音波デバイス、超音波デバイスの製造方法、超音波プローブ、超音波測定装置、電子機器
CN104735596A (zh) * 2014-12-30 2015-06-24 华天科技（西安）有限公司 一种硅麦克风封装结构及其制备方法
US9952111B2 (en) 2015-04-15 2018-04-24 Infineon Technologies Ag System and method for a packaged MEMS device
CN106658317A (zh) * 2016-11-21 2017-05-10 歌尔股份有限公司 一种mems发声装置及电子设备
US10911854B2 (en) 2017-02-15 2021-02-02 Wildlife Acoustics, Inc. Ultrasonic microphone enclosure
US10612967B2 (en) * 2017-02-15 2020-04-07 Wildlife Acoustics, Inc. Ultrasonic microphone enclosure

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001019134A2 (fr) * 1999-09-06 2001-03-15 Microtronic A/S Systeme de capteur a base de silicium
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
DE10238523B4 (de) * 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
DE102005055478A1 (de) 2005-11-22 2007-05-24 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
DE102005056759A1 (de) 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
KR100722686B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
US7753120B2 (en) * 2006-12-13 2010-07-13 Carl Keller Pore fluid sampling system with diffusion barrier and method of use thereof
US7550828B2 (en) * 2007-01-03 2009-06-23 Stats Chippac, Inc. Leadframe package for MEMS microphone assembly
US7875942B2 (en) * 2007-01-04 2011-01-25 Stmicroelectronics, S.R.L. Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
ITMI20070099A1 (it) * 2007-01-24 2008-07-25 St Microelectronics Srl Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati
KR100891517B1 (ko) * 2007-06-18 2009-04-06 주식회사 하이닉스반도체 플립 칩 패키지 및 그의 제조방법
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
DE102009019446B4 (de) * 2009-04-29 2014-11-13 Epcos Ag MEMS Mikrofon
CN102075849B (zh) * 2009-11-17 2014-08-06 飞兆半导体公司 微机电***麦克风封装***
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems

Also Published As

Publication number Publication date
CN103313172A (zh) 2013-09-18
FR2987616A1 (fr) 2013-09-06
CN103313172B (zh) 2019-03-15
US20130228937A1 (en) 2013-09-05
DE102012203373A1 (de) 2013-09-05

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