FR2864109B1 - Croissance organisee de nano-structures - Google Patents

Croissance organisee de nano-structures

Info

Publication number
FR2864109B1
FR2864109B1 FR0351186A FR0351186A FR2864109B1 FR 2864109 B1 FR2864109 B1 FR 2864109B1 FR 0351186 A FR0351186 A FR 0351186A FR 0351186 A FR0351186 A FR 0351186A FR 2864109 B1 FR2864109 B1 FR 2864109B1
Authority
FR
France
Prior art keywords
nano
structures
organized growth
organized
growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0351186A
Other languages
English (en)
Other versions
FR2864109A1 (fr
Inventor
Frederic Mazen
Thierry Baron
Sebastien Decossas
Abdelkader Souifi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0351186A priority Critical patent/FR2864109B1/fr
Priority to PCT/FR2004/050743 priority patent/WO2005064040A1/fr
Priority to US10/584,053 priority patent/US20070104888A1/en
Priority to JP2006546284A priority patent/JP2007517136A/ja
Priority to EP04816590A priority patent/EP1697559A1/fr
Publication of FR2864109A1 publication Critical patent/FR2864109A1/fr
Application granted granted Critical
Publication of FR2864109B1 publication Critical patent/FR2864109B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
FR0351186A 2003-12-23 2003-12-23 Croissance organisee de nano-structures Expired - Fee Related FR2864109B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0351186A FR2864109B1 (fr) 2003-12-23 2003-12-23 Croissance organisee de nano-structures
PCT/FR2004/050743 WO2005064040A1 (fr) 2003-12-23 2004-12-21 Croissance organisee de nano-structures
US10/584,053 US20070104888A1 (en) 2003-12-23 2004-12-21 Method for the organised growth of nanostructures
JP2006546284A JP2007517136A (ja) 2003-12-23 2004-12-21 ナノストラクチャーの組織化された成長
EP04816590A EP1697559A1 (fr) 2003-12-23 2004-12-21 Croissance organisee de nano-structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0351186A FR2864109B1 (fr) 2003-12-23 2003-12-23 Croissance organisee de nano-structures

Publications (2)

Publication Number Publication Date
FR2864109A1 FR2864109A1 (fr) 2005-06-24
FR2864109B1 true FR2864109B1 (fr) 2006-07-21

Family

ID=34630632

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0351186A Expired - Fee Related FR2864109B1 (fr) 2003-12-23 2003-12-23 Croissance organisee de nano-structures

Country Status (5)

Country Link
US (1) US20070104888A1 (fr)
EP (1) EP1697559A1 (fr)
JP (1) JP2007517136A (fr)
FR (1) FR2864109B1 (fr)
WO (1) WO2005064040A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2922680A1 (fr) * 2007-10-18 2009-04-24 Commissariat Energie Atomique Procede de fabrication d'un composant microelectronique avec realisation de nanocristaux metalliques localises sur une couche en materiau dielectrique
JPWO2010082345A1 (ja) * 2009-01-19 2012-06-28 日新電機株式会社 シリコンドット形成方法及びシリコンドット形成装置
DE102009041264A1 (de) * 2009-09-11 2011-03-24 IPHT Jena Institut für Photonische Technologien e.V. Verfahren zur Herstellung von optisch aktiven Nanostrukturen
US8853078B2 (en) * 2011-01-30 2014-10-07 Fei Company Method of depositing material
US9768338B2 (en) 2012-01-23 2017-09-19 Stc.Unm Multi-source optimal reconfigurable energy harvester

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240723A (ja) * 1985-08-17 1987-02-21 Fujitsu Ltd 半導体装置の製造方法
JPH08973B2 (ja) * 1986-03-31 1996-01-10 キヤノン株式会社 堆積膜形成法
JP2525773B2 (ja) * 1986-06-30 1996-08-21 キヤノン株式会社 半導体装置及びその製造方法
US4908226A (en) * 1988-05-23 1990-03-13 Hughes Aircraft Company Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams
US5083033A (en) * 1989-03-31 1992-01-21 Kabushiki Kaisha Toshiba Method of depositing an insulating film and a focusing ion beam apparatus
US5082359A (en) * 1989-11-28 1992-01-21 Epion Corporation Diamond films and method of growing diamond films on nondiamond substrates
JPH03262911A (ja) * 1990-03-14 1991-11-22 Matsushita Electric Ind Co Ltd 原子間力顕微鏡用探針およびその製造方法
US5363793A (en) * 1990-04-06 1994-11-15 Canon Kabushiki Kaisha Method for forming crystals
JPH04118916A (ja) * 1990-04-20 1992-04-20 Hitachi Ltd 半導体装置およびその製造方法
US5504340A (en) * 1993-03-10 1996-04-02 Hitachi, Ltd. Process method and apparatus using focused ion beam generating means
JP2884054B2 (ja) * 1995-11-29 1999-04-19 工業技術院長 微細加工方法
US6806228B2 (en) * 2000-06-29 2004-10-19 University Of Louisville Low temperature synthesis of semiconductor fibers
KR20030055346A (ko) * 2000-12-11 2003-07-02 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 나노센서
US6835613B2 (en) * 2001-12-06 2004-12-28 University Of South Florida Method of producing an integrated circuit with a carbon nanotube
US6761803B2 (en) * 2001-12-17 2004-07-13 City University Of Hong Kong Large area silicon cone arrays fabrication and cone based nanostructure modification
US7342225B2 (en) * 2002-02-22 2008-03-11 Agere Systems, Inc. Crystallographic metrology and process control
US7208094B2 (en) * 2003-12-17 2007-04-24 Hewlett-Packard Development Company, L.P. Methods of bridging lateral nanowires and device using same

Also Published As

Publication number Publication date
US20070104888A1 (en) 2007-05-10
JP2007517136A (ja) 2007-06-28
EP1697559A1 (fr) 2006-09-06
FR2864109A1 (fr) 2005-06-24
WO2005064040A1 (fr) 2005-07-14

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Effective date: 20100831