FR2839061B1 - MICROMECHANICAL COMPONENT WITH INSULATED AREA AND METHOD FOR MANUFACTURING THE SAME - Google Patents
MICROMECHANICAL COMPONENT WITH INSULATED AREA AND METHOD FOR MANUFACTURING THE SAMEInfo
- Publication number
- FR2839061B1 FR2839061B1 FR0305333A FR0305333A FR2839061B1 FR 2839061 B1 FR2839061 B1 FR 2839061B1 FR 0305333 A FR0305333 A FR 0305333A FR 0305333 A FR0305333 A FR 0305333A FR 2839061 B1 FR2839061 B1 FR 2839061B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- same
- micromechanical component
- insulated area
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0069—Thermal properties, e.g. improve thermal insulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0214—Biosensors; Chemical sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0278—Temperature sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0323—Grooves
- B81B2203/0338—Channels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002119254 DE10219254B4 (en) | 2002-04-30 | 2002-04-30 | Micromechanical component with an isolation region and corresponding manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2839061A1 FR2839061A1 (en) | 2003-10-31 |
FR2839061B1 true FR2839061B1 (en) | 2007-04-06 |
Family
ID=28798928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0305333A Expired - Fee Related FR2839061B1 (en) | 2002-04-30 | 2003-04-30 | MICROMECHANICAL COMPONENT WITH INSULATED AREA AND METHOD FOR MANUFACTURING THE SAME |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10219254B4 (en) |
FR (1) | FR2839061B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH707797A1 (en) * | 2013-03-28 | 2014-09-30 | Silicior Sa | A method of manufacturing a micro-mechanical part substantially flat, and micro-mechanical part comprising at least a portion formed of silicon oxide. |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01109250A (en) * | 1987-10-22 | 1989-04-26 | Toshiba Corp | Gas sensor |
US5578528A (en) * | 1995-05-02 | 1996-11-26 | Industrial Technology Research Institute | Method of fabrication glass diaphragm on silicon macrostructure |
FR2736205B1 (en) * | 1995-06-30 | 1997-09-19 | Motorola Semiconducteurs | SEMICONDUCTOR SENSOR DEVICE AND ITS FORMING METHOD |
DE19608370A1 (en) * | 1996-03-05 | 1996-07-25 | Josef Dr Lechner | Micro-mechanical channel prodn. with connection to surrounding atmos. |
EP0856825B1 (en) * | 1997-01-31 | 2004-11-17 | STMicroelectronics S.r.l. | Process for manufacturing integrated semiconductor devices comprising a chemoresistive gas microsensor |
US6096656A (en) * | 1999-06-24 | 2000-08-01 | Sandia Corporation | Formation of microchannels from low-temperature plasma-deposited silicon oxynitride |
-
2002
- 2002-04-30 DE DE2002119254 patent/DE10219254B4/en not_active Expired - Fee Related
-
2003
- 2003-04-30 FR FR0305333A patent/FR2839061B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10219254B4 (en) | 2011-08-11 |
DE10219254A1 (en) | 2003-11-13 |
FR2839061A1 (en) | 2003-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20151231 |