FR2835389B1 - Dispositif comprenant un support metallique isole et un circuit electrique - Google Patents
Dispositif comprenant un support metallique isole et un circuit electriqueInfo
- Publication number
- FR2835389B1 FR2835389B1 FR0201092A FR0201092A FR2835389B1 FR 2835389 B1 FR2835389 B1 FR 2835389B1 FR 0201092 A FR0201092 A FR 0201092A FR 0201092 A FR0201092 A FR 0201092A FR 2835389 B1 FR2835389 B1 FR 2835389B1
- Authority
- FR
- France
- Prior art keywords
- electrical circuit
- metal support
- isolated metal
- isolated
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0201092A FR2835389B1 (fr) | 2002-01-30 | 2002-01-30 | Dispositif comprenant un support metallique isole et un circuit electrique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0201092A FR2835389B1 (fr) | 2002-01-30 | 2002-01-30 | Dispositif comprenant un support metallique isole et un circuit electrique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2835389A1 FR2835389A1 (fr) | 2003-08-01 |
FR2835389B1 true FR2835389B1 (fr) | 2005-10-21 |
Family
ID=27619750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0201092A Expired - Fee Related FR2835389B1 (fr) | 2002-01-30 | 2002-01-30 | Dispositif comprenant un support metallique isole et un circuit electrique |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2835389B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1026114B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via component |
BE1026115B1 (nl) * | 2018-03-19 | 2019-10-17 | Dk Ceramic Circuits Bvba | Verbinding via pin |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297088A (ja) * | 1988-10-03 | 1990-04-09 | Matsushita Electric Works Ltd | プリント配線板 |
EP0460554A1 (fr) * | 1990-05-30 | 1991-12-11 | Sanyo Electric Co., Ltd. | Dispositif à circuit intégré hybride |
JPH05167302A (ja) * | 1991-12-18 | 1993-07-02 | Hitachi Ltd | 高周波電力増幅回路装置およびそれを含む高周波モジュール |
DE4242097C2 (de) * | 1992-12-14 | 2001-03-01 | Bosch Gmbh Robert | Anordnung zum elektromagnetischen Verträglichkeits(EMV)-Schutz von Hybridbauelementen |
US6181571B1 (en) * | 1998-03-06 | 2001-01-30 | Canon Kabushiki Kaisha | Printed-wiring board and electronic device having the same wiring board |
GB9911905D0 (en) * | 1999-05-22 | 1999-07-21 | Trw Lucas Varity Electric | Improvement relating to electrical power assisted steering |
FR2803716B1 (fr) * | 2000-01-11 | 2002-04-05 | Sagem | Module electronique a composants de puissance et procede de fabrication |
-
2002
- 2002-01-30 FR FR0201092A patent/FR2835389B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2835389A1 (fr) | 2003-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
ST | Notification of lapse |
Effective date: 20200914 |