FR2820429B3 - Substance fluorescente d'une grande efficacite - Google Patents
Substance fluorescente d'une grande efficaciteInfo
- Publication number
- FR2820429B3 FR2820429B3 FR0201267A FR0201267A FR2820429B3 FR 2820429 B3 FR2820429 B3 FR 2820429B3 FR 0201267 A FR0201267 A FR 0201267A FR 0201267 A FR0201267 A FR 0201267A FR 2820429 B3 FR2820429 B3 FR 2820429B3
- Authority
- FR
- France
- Prior art keywords
- highly efficient
- fluorescent substance
- efficient fluorescent
- substance
- highly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10105800.4A DE10105800B4 (de) | 2001-02-07 | 2001-02-07 | Hocheffizienter Leuchtstoff und dessen Verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2820429A3 FR2820429A3 (fr) | 2002-08-09 |
FR2820429B3 true FR2820429B3 (fr) | 2003-01-03 |
Family
ID=7673330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0201267A Expired - Fee Related FR2820429B3 (fr) | 2001-02-07 | 2002-02-04 | Substance fluorescente d'une grande efficacite |
Country Status (8)
Country | Link |
---|---|
US (1) | US6724142B2 (fr) |
JP (1) | JP2002322474A (fr) |
KR (1) | KR20020065843A (fr) |
DE (1) | DE10105800B4 (fr) |
FR (1) | FR2820429B3 (fr) |
GB (1) | GB2373510B (fr) |
NL (1) | NL1019917C2 (fr) |
TW (1) | TW570970B (fr) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051622A (ja) * | 2001-08-07 | 2003-02-21 | Rohm Co Ltd | 白色系半導体発光装置 |
ATE329479T1 (de) * | 2002-10-14 | 2006-06-15 | Koninkl Philips Electronics Nv | Lichtemittierendes bauelement mit einem eu(ii)- aktivierten leuchtstoff |
US7544309B2 (en) * | 2002-12-13 | 2009-06-09 | Koninklijke Philips Electronics N.V. | Illumination system comprising a radiation source and a fluorescent material |
JP4581540B2 (ja) * | 2003-06-30 | 2010-11-17 | 日亜化学工業株式会社 | 半導体発光素子とそれを用いた発光装置 |
US7723740B2 (en) * | 2003-09-18 | 2010-05-25 | Nichia Corporation | Light emitting device |
JP4805829B2 (ja) * | 2003-09-24 | 2011-11-02 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | 定義された色温度を有する白色発光led |
TWI350009B (en) * | 2003-09-24 | 2011-10-01 | Osram Gmbh | High efficient lighting system on led-basis with improved color rendition |
TWI359187B (en) * | 2003-11-19 | 2012-03-01 | Panasonic Corp | Method for preparing nitridosilicate-based compoun |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP3931239B2 (ja) * | 2004-02-18 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 発光素子及び照明器具 |
US7611641B2 (en) * | 2004-02-20 | 2009-11-03 | Koninklijke Philips Electronics N.V. | Illumination system comprising a radiation source and a fluorescent material |
WO2005103199A1 (fr) * | 2004-04-27 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Composition phosphorée et sa méthode de production, dispositif émetteur de lumière l'utilisant |
US20060017041A1 (en) * | 2004-06-25 | 2006-01-26 | Sarnoff Corporation | Nitride phosphors and devices |
US20060049414A1 (en) * | 2004-08-19 | 2006-03-09 | Chandran Ramachandran G | Novel oxynitride phosphors |
EP2360225B1 (fr) | 2004-09-22 | 2013-06-26 | National Institute for Materials Science | Phosphor, methode de production et instrument emittant de la lumière |
JP4756261B2 (ja) | 2005-01-27 | 2011-08-24 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
DE602006009768D1 (de) | 2005-02-21 | 2009-11-26 | Koninkl Philips Electronics Nv | Beleuchtungssystem mit strahlenquelle und lumineszierendem material |
US7439668B2 (en) | 2005-03-01 | 2008-10-21 | Lumination Llc | Oxynitride phosphors for use in lighting applications having improved color quality |
US7524437B2 (en) | 2005-03-04 | 2009-04-28 | Dowa Electronics Materials Co., Ltd. | Phosphor and manufacturing method of the same, and light emitting device using the phosphor |
CN101133137B (zh) | 2005-03-04 | 2013-05-08 | 三菱化学株式会社 | 荧光体及其制备方法、和使用该荧光体的发光装置 |
CN101175835B (zh) * | 2005-05-24 | 2012-10-10 | 三菱化学株式会社 | 荧光体及其应用 |
KR101264580B1 (ko) | 2005-09-27 | 2013-05-14 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체 및 그 제조방법, 및 상기 형광체를 사용한 발광장치 |
US7942556B2 (en) * | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
US7984999B2 (en) * | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
EP2163593A1 (fr) * | 2008-09-15 | 2010-03-17 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Production de phosphores à base de nitrure |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
TWI374704B (en) | 2009-11-09 | 2012-10-21 | Ind Tech Res Inst | Light transformation particle and photobioreactor |
US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
KR100984273B1 (ko) * | 2010-05-25 | 2010-10-01 | 충남대학교산학협력단 | 질화물 형광체, 이의 제조방법 및 상기 형광체를 포함하는 발광 소자 |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
KR101292320B1 (ko) * | 2011-03-11 | 2013-07-31 | 금호전기주식회사 | 형광체 및 그 제조방법 |
TWI516572B (zh) | 2012-12-13 | 2016-01-11 | 財團法人工業技術研究院 | 螢光材料、及包含其之發光裝置 |
EP2990457B1 (fr) * | 2013-04-25 | 2018-12-05 | National Institute for Materials Science | Luminophore, son procédé de production, dispositif émettant de la lumière et appareil d'affichage d'images |
CN103275705B (zh) * | 2013-06-21 | 2017-08-25 | 北京有色金属研究总院 | 荧光粉、其制备方法及包括其的发光装置 |
JP6210577B2 (ja) * | 2016-10-06 | 2017-10-11 | 日立化成株式会社 | 光半導体素子搭載用基板および光半導体装置 |
US20200161506A1 (en) * | 2018-11-21 | 2020-05-21 | Osram Opto Semiconductors Gmbh | Method for Producing a Ceramic Converter Element, Ceramic Converter Element, and Optoelectronic Component |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
WO1998039807A1 (fr) | 1997-03-04 | 1998-09-11 | Koninklijke Philips Electronics N.V. | Ecran couleur a adressage par diodes, contenant des phosphores de lanthanoides |
US6165631A (en) | 1997-03-04 | 2000-12-26 | U.S. Philips Corporation | Diode-addressed color display with lanthanoid phosphors |
US6068383A (en) * | 1998-03-02 | 2000-05-30 | Robertson; Roger | Phosphorous fluorescent light assembly excited by light emitting diodes |
EP1104799A1 (fr) * | 1999-11-30 | 2001-06-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Materiau luminescent émetteur de lumière rouge |
-
2001
- 2001-02-07 DE DE10105800.4A patent/DE10105800B4/de not_active Expired - Lifetime
-
2002
- 2002-01-11 TW TW091100290A patent/TW570970B/zh active
- 2002-01-21 GB GB0201264A patent/GB2373510B/en not_active Expired - Fee Related
- 2002-01-30 KR KR1020020005392A patent/KR20020065843A/ko not_active Application Discontinuation
- 2002-01-31 US US10/062,095 patent/US6724142B2/en not_active Expired - Lifetime
- 2002-02-04 JP JP2002027215A patent/JP2002322474A/ja not_active Withdrawn
- 2002-02-04 FR FR0201267A patent/FR2820429B3/fr not_active Expired - Fee Related
- 2002-02-07 NL NL1019917A patent/NL1019917C2/nl not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2373510B (en) | 2004-07-07 |
TW570970B (en) | 2004-01-11 |
KR20020065843A (ko) | 2002-08-14 |
NL1019917C2 (nl) | 2006-01-17 |
NL1019917A1 (nl) | 2002-08-08 |
DE10105800A1 (de) | 2002-08-08 |
US20020105269A1 (en) | 2002-08-08 |
JP2002322474A (ja) | 2002-11-08 |
GB2373510A (en) | 2002-09-25 |
DE10105800B4 (de) | 2017-08-31 |
FR2820429A3 (fr) | 2002-08-09 |
US6724142B2 (en) | 2004-04-20 |
GB0201264D0 (en) | 2002-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20071030 |