FR2820429B3 - Substance fluorescente d'une grande efficacite - Google Patents

Substance fluorescente d'une grande efficacite

Info

Publication number
FR2820429B3
FR2820429B3 FR0201267A FR0201267A FR2820429B3 FR 2820429 B3 FR2820429 B3 FR 2820429B3 FR 0201267 A FR0201267 A FR 0201267A FR 0201267 A FR0201267 A FR 0201267A FR 2820429 B3 FR2820429 B3 FR 2820429B3
Authority
FR
France
Prior art keywords
highly efficient
fluorescent substance
efficient fluorescent
substance
highly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0201267A
Other languages
English (en)
Other versions
FR2820429A3 (fr
Inventor
Andries Ellens
Gunter Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Publication of FR2820429A3 publication Critical patent/FR2820429A3/fr
Application granted granted Critical
Publication of FR2820429B3 publication Critical patent/FR2820429B3/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
FR0201267A 2001-02-07 2002-02-04 Substance fluorescente d'une grande efficacite Expired - Fee Related FR2820429B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10105800.4A DE10105800B4 (de) 2001-02-07 2001-02-07 Hocheffizienter Leuchtstoff und dessen Verwendung

Publications (2)

Publication Number Publication Date
FR2820429A3 FR2820429A3 (fr) 2002-08-09
FR2820429B3 true FR2820429B3 (fr) 2003-01-03

Family

ID=7673330

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0201267A Expired - Fee Related FR2820429B3 (fr) 2001-02-07 2002-02-04 Substance fluorescente d'une grande efficacite

Country Status (8)

Country Link
US (1) US6724142B2 (fr)
JP (1) JP2002322474A (fr)
KR (1) KR20020065843A (fr)
DE (1) DE10105800B4 (fr)
FR (1) FR2820429B3 (fr)
GB (1) GB2373510B (fr)
NL (1) NL1019917C2 (fr)
TW (1) TW570970B (fr)

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JP2003051622A (ja) * 2001-08-07 2003-02-21 Rohm Co Ltd 白色系半導体発光装置
ATE329479T1 (de) * 2002-10-14 2006-06-15 Koninkl Philips Electronics Nv Lichtemittierendes bauelement mit einem eu(ii)- aktivierten leuchtstoff
US7544309B2 (en) * 2002-12-13 2009-06-09 Koninklijke Philips Electronics N.V. Illumination system comprising a radiation source and a fluorescent material
JP4581540B2 (ja) * 2003-06-30 2010-11-17 日亜化学工業株式会社 半導体発光素子とそれを用いた発光装置
US7723740B2 (en) * 2003-09-18 2010-05-25 Nichia Corporation Light emitting device
JP4805829B2 (ja) * 2003-09-24 2011-11-02 パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング 定義された色温度を有する白色発光ｌｅｄ
TWI350009B (en) * 2003-09-24 2011-10-01 Osram Gmbh High efficient lighting system on led-basis with improved color rendition
TWI359187B (en) * 2003-11-19 2012-03-01 Panasonic Corp Method for preparing nitridosilicate-based compoun
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP3931239B2 (ja) * 2004-02-18 2007-06-13 独立行政法人物質・材料研究機構 発光素子及び照明器具
US7611641B2 (en) * 2004-02-20 2009-11-03 Koninklijke Philips Electronics N.V. Illumination system comprising a radiation source and a fluorescent material
WO2005103199A1 (fr) * 2004-04-27 2005-11-03 Matsushita Electric Industrial Co., Ltd. Composition phosphorée et sa méthode de production, dispositif émetteur de lumière l'utilisant
US20060017041A1 (en) * 2004-06-25 2006-01-26 Sarnoff Corporation Nitride phosphors and devices
US20060049414A1 (en) * 2004-08-19 2006-03-09 Chandran Ramachandran G Novel oxynitride phosphors
EP2360225B1 (fr) 2004-09-22 2013-06-26 National Institute for Materials Science Phosphor, methode de production et instrument emittant de la lumière
JP4756261B2 (ja) 2005-01-27 2011-08-24 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
DE602006009768D1 (de) 2005-02-21 2009-11-26 Koninkl Philips Electronics Nv Beleuchtungssystem mit strahlenquelle und lumineszierendem material
US7439668B2 (en) 2005-03-01 2008-10-21 Lumination Llc Oxynitride phosphors for use in lighting applications having improved color quality
US7524437B2 (en) 2005-03-04 2009-04-28 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method of the same, and light emitting device using the phosphor
CN101133137B (zh) 2005-03-04 2013-05-08 三菱化学株式会社 荧光体及其制备方法、和使用该荧光体的发光装置
CN101175835B (zh) * 2005-05-24 2012-10-10 三菱化学株式会社 荧光体及其应用
KR101264580B1 (ko) 2005-09-27 2013-05-14 미쓰비시 가가꾸 가부시키가이샤 형광체 및 그 제조방법, 및 상기 형광체를 사용한 발광장치
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
US7984999B2 (en) * 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
US9086213B2 (en) * 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
EP2163593A1 (fr) * 2008-09-15 2010-03-17 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Production de phosphores à base de nitrure
US8220971B2 (en) 2008-11-21 2012-07-17 Xicato, Inc. Light emitting diode module with three part color matching
TWI374704B (en) 2009-11-09 2012-10-21 Ind Tech Res Inst Light transformation particle and photobioreactor
US9631782B2 (en) * 2010-02-04 2017-04-25 Xicato, Inc. LED-based rectangular illumination device
US8104908B2 (en) 2010-03-04 2012-01-31 Xicato, Inc. Efficient LED-based illumination module with high color rendering index
KR100984273B1 (ko) * 2010-05-25 2010-10-01 충남대학교산학협력단 질화물 형광체, 이의 제조방법 및 상기 형광체를 포함하는 발광 소자
US20120051045A1 (en) 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source
KR101292320B1 (ko) * 2011-03-11 2013-07-31 금호전기주식회사 형광체 및 그 제조방법
TWI516572B (zh) 2012-12-13 2016-01-11 財團法人工業技術研究院 螢光材料、及包含其之發光裝置
EP2990457B1 (fr) * 2013-04-25 2018-12-05 National Institute for Materials Science Luminophore, son procédé de production, dispositif émettant de la lumière et appareil d'affichage d'images
CN103275705B (zh) * 2013-06-21 2017-08-25 北京有色金属研究总院 荧光粉、其制备方法及包括其的发光装置
JP6210577B2 (ja) * 2016-10-06 2017-10-11 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
US20200161506A1 (en) * 2018-11-21 2020-05-21 Osram Opto Semiconductors Gmbh Method for Producing a Ceramic Converter Element, Ceramic Converter Element, and Optoelectronic Component

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TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
WO1998039807A1 (fr) 1997-03-04 1998-09-11 Koninklijke Philips Electronics N.V. Ecran couleur a adressage par diodes, contenant des phosphores de lanthanoides
US6165631A (en) 1997-03-04 2000-12-26 U.S. Philips Corporation Diode-addressed color display with lanthanoid phosphors
US6068383A (en) * 1998-03-02 2000-05-30 Robertson; Roger Phosphorous fluorescent light assembly excited by light emitting diodes
EP1104799A1 (fr) * 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Materiau luminescent émetteur de lumière rouge

Also Published As

Publication number Publication date
GB2373510B (en) 2004-07-07
TW570970B (en) 2004-01-11
KR20020065843A (ko) 2002-08-14
NL1019917C2 (nl) 2006-01-17
NL1019917A1 (nl) 2002-08-08
DE10105800A1 (de) 2002-08-08
US20020105269A1 (en) 2002-08-08
JP2002322474A (ja) 2002-11-08
GB2373510A (en) 2002-09-25
DE10105800B4 (de) 2017-08-31
FR2820429A3 (fr) 2002-08-09
US6724142B2 (en) 2004-04-20
GB0201264D0 (en) 2002-03-06

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Effective date: 20071030