FR2809229B1 - Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres - Google Patents

Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres

Info

Publication number
FR2809229B1
FR2809229B1 FR0006514A FR0006514A FR2809229B1 FR 2809229 B1 FR2809229 B1 FR 2809229B1 FR 0006514 A FR0006514 A FR 0006514A FR 0006514 A FR0006514 A FR 0006514A FR 2809229 B1 FR2809229 B1 FR 2809229B1
Authority
FR
France
Prior art keywords
burry
chip
integrated circuits
injection mold
encapsulation material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0006514A
Other languages
English (en)
Other versions
FR2809229A1 (fr
Inventor
Jonathan Abela
Remi Brechignac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0006514A priority Critical patent/FR2809229B1/fr
Priority to US09/862,983 priority patent/US6696006B2/en
Publication of FR2809229A1 publication Critical patent/FR2809229A1/fr
Application granted granted Critical
Publication of FR2809229B1 publication Critical patent/FR2809229B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
FR0006514A 2000-05-22 2000-05-22 Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres Expired - Fee Related FR2809229B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0006514A FR2809229B1 (fr) 2000-05-22 2000-05-22 Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres
US09/862,983 US6696006B2 (en) 2000-05-22 2001-05-22 Mold for flashless injection molding to encapsulate an integrated circuit chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0006514A FR2809229B1 (fr) 2000-05-22 2000-05-22 Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres

Publications (2)

Publication Number Publication Date
FR2809229A1 FR2809229A1 (fr) 2001-11-23
FR2809229B1 true FR2809229B1 (fr) 2002-12-13

Family

ID=8850476

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0006514A Expired - Fee Related FR2809229B1 (fr) 2000-05-22 2000-05-22 Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres

Country Status (2)

Country Link
US (1) US6696006B2 (fr)
FR (1) FR2809229B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969918B1 (en) * 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
US20040214371A1 (en) * 2003-04-25 2004-10-28 Mahmood Syed Omar Syed System and method for conventional molding using a new design potblock
US20060043635A1 (en) * 2003-10-31 2006-03-02 Groth Lauren A Singular and co-molded pre-forms
US7618249B2 (en) * 2006-09-22 2009-11-17 Asm Technology Singapore Pte Ltd. Memory card molding apparatus and process
TWI515842B (zh) * 2008-11-17 2016-01-01 先進封裝技術私人有限公司 半導體晶片封裝系統
WO2017023959A1 (fr) * 2015-08-05 2017-02-09 Illinois Tool Works Inc. Procédé et outil de moulage par injection
AU2016210598B9 (en) 2015-08-05 2021-11-04 Illinois Tool Works Inc. Tool for forming a cartridge piston and method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2583035A (en) * 1948-02-11 1952-01-22 Winterhalter Martin Sliding clasp fastener
US3134141A (en) * 1961-10-27 1964-05-26 Int Vulcanizing Corp Injection molding apparatus
US3626051A (en) * 1969-09-19 1971-12-07 James P Liautaud Injection molding encapsulation of paper-wound flyback transformers and the like
US3779506A (en) * 1971-08-25 1973-12-18 Motorola Inc Apparatus for equalizing the flow rate of molding compound into each of a series of mold cavities
DE2418247C3 (de) * 1974-04-13 1978-11-23 Elastogran Maschinenbau Gmbh & Co, 8021 Strasslach Geteilte Gießform für Mehrkomponentenkunststoffe, insbesondere Polyurethane
US3975494A (en) * 1974-12-02 1976-08-17 Claude Tritenne Method of making synthetic-resin target pigeon
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
JPS62221523A (ja) * 1986-03-24 1987-09-29 Mitsubishi Electric Corp 樹脂成形用金型
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
US4867663A (en) * 1988-04-28 1989-09-19 Ats Automation Tooling Systems Inc. Seal for molded part insert
US5071612A (en) * 1988-12-12 1991-12-10 Kabushiki Kaisha Toshiba Method for sealingly molding semiconductor electronic components
JP2578209B2 (ja) * 1989-07-04 1997-02-05 株式会社東芝 樹脂封止タイプ半導体デバイス用樹脂封止装置
JP2834257B2 (ja) * 1990-02-28 1998-12-09 株式会社日立製作所 半導体装置の製造方法およびモールド装置
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
SG50009A1 (en) * 1996-03-14 1998-06-15 Towa Corp Method of sealing electronic component with molded resin
JP3127889B2 (ja) * 1998-06-25 2001-01-29 日本電気株式会社 半導体パッケージの製造方法およびその成形用金型
US6355199B1 (en) * 1999-02-12 2002-03-12 St. Assembly Test Services Pte Ltd Method of molding flexible circuit with molded stiffener

Also Published As

Publication number Publication date
US20020051832A1 (en) 2002-05-02
FR2809229A1 (fr) 2001-11-23
US6696006B2 (en) 2004-02-24

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080131