FR2807907A1 - ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE - Google Patents

ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE Download PDF

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Publication number
FR2807907A1
FR2807907A1 FR0104949A FR0104949A FR2807907A1 FR 2807907 A1 FR2807907 A1 FR 2807907A1 FR 0104949 A FR0104949 A FR 0104949A FR 0104949 A FR0104949 A FR 0104949A FR 2807907 A1 FR2807907 A1 FR 2807907A1
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France
Prior art keywords
connection
plate
conductive track
connecting element
connection point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR0104949A
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French (fr)
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FR2807907B1 (en
Inventor
Roland Schnabel
Kurt Schaupert
Harry Engelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott Glaswerke AG
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Filing date
Publication date
Priority claimed from DE10018415A external-priority patent/DE10018415C1/en
Application filed by Schott Glaswerke AG filed Critical Schott Glaswerke AG
Publication of FR2807907A1 publication Critical patent/FR2807907A1/en
Application granted granted Critical
Publication of FR2807907B1 publication Critical patent/FR2807907B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Surface Treatment Of Glass (AREA)
  • Surface Heating Bodies (AREA)

Abstract

L'invention concerne une liaison entre au moins un point de connexion (13) électrique, en particulier pour un système de capteur, et une piste conductrice (5) appliquée sur une plaque, en particulier sur une plaque de verre ou de vitrocéramique.Un élément de liaison (11) électro-conducteur, qui mène au point de connexion (13), est soudé par ultrasons à l'ensemble composite formé de la piste conductrice (5).The invention relates to a connection between at least one electrical connection point (13), in particular for a sensor system, and a conductive track (5) applied to a plate, in particular to a glass or glass-ceramic plate. electrically conductive connection element (11), which leads to the connection point (13), is ultrasonically welded to the composite assembly formed by the conductive track (5).

Description

Liaison électrique entre un point de connexion et une piste conductriceElectrical connection between a connection point and a conductive track

appliquée sur une plaque, en particulier sur une  applied on a plate, in particular on a

plaque de vitrocéramique.ceramic hob.

L'invention concerne une liaison entre au moins un point de connexion électrique, en particulier pour un système de capteur, et une piste conductrice appliquée sur une plaque, en particulier sur une  The invention relates to a connection between at least one electrical connection point, in particular for a sensor system, and a conductive track applied to a plate, in particular to a

plaque de verre ou de vitrocéramique.  glass or glass-ceramic plate.

Dans le document DE 40 22 845 C2, il est indiqué que des couches métalliques appliquées par un procédé de sérigraphie sur une plaque de vitrocéramique peuvent être reliées à des contacts électriques par brasure ou par collage. Cependant, on a constaté que le  In document DE 40 22 845 C2, it is indicated that metal layers applied by a screen printing process to a glass ceramic plate can be connected to electrical contacts by soldering or by bonding. However, it was found that the

brasage ou le collage ne permettaient pas d'obtenir une liaison électro-  soldering or gluing did not allow to obtain an electro-

conductrice parfaitement fiable dans le temps.  conductor perfectly reliable over time.

Le document DE 197 07 664 A1 décrit une piste conductrice qui est appliquée sur une plaque de vitrocéramique. Etant donné que la réalisation des points de connexion sur la plaque de vitrocéramique utilisée comme plaque de cuisson est une opération complexe et chère, il est proposé une connexion mécanique au moyen de doigts de contact. Il est connu, de par le document WO 88/05 428 A1, de relier un composant électronique (puce) à une carte à circuit imprimé au moyen  Document DE 197 07 664 A1 describes a conductive track which is applied to a glass-ceramic plate. Since the realization of the connection points on the glass ceramic plate used as a cooking plate is a complex and expensive operation, a mechanical connection is proposed by means of contact fingers. It is known from document WO 88/05 428 A1 to connect an electronic component (chip) to a printed circuit board by means

de bouts de fil soudés par un procédé de soudage par ultrasons.  ends of wire welded by an ultrasonic welding process.

Des capteurs de température disposés sur une plaque de cuisson en vitrocéramique sont décrits dans les documents US 4 237 368 et DE 40 22 845 C2. Des pistes conductrices sont aménagées sur la plaque de vitrocéramique. L'agencement des points de connexion est  Temperature sensors arranged on a ceramic hob are described in documents US 4,237,368 and DE 40 22,845 C2. Conductive tracks are arranged on the glass ceramic plate. The arrangement of connection points is

laissé ouvert.left open.

Par le document DE 197 11 541 A1, on apprend que l'on peut coller un film métallique sur la face inférieure pourvue de reliefs en  From document DE 197 11 541 A1, we learn that we can stick a metal film on the underside provided with reliefs

forme de boutons d'une plaque de cuisson en vitrocéramique.  shaped like buttons on a ceramic hob.

Le document DE 692 04 564 T2 décrit un procédé de métallisation sans courant électrique d'un modèle en un matériau autre que du verre, appliqué sur un support en verre. La métallisation doit permettre la réalisation de liaisons avec des éléments électriques, en particulier par soudage par ultrasons. Le but de la présente invention est de proposer une liaison du type indiqué en introduction, qui soit résistante à la corrosion, résistante aux chocs thermiques, résistante à la traction et  Document DE 692 04 564 T2 describes a metallization process without electric current of a model made of a material other than glass, applied to a glass support. The metallization must allow the creation of connections with electrical elements, in particular by ultrasonic welding. The object of the present invention is to provide a connection of the type indicated in the introduction, which is resistant to corrosion, resistant to thermal shock, resistant to traction and

électriquement conductrice.electrically conductive.

Ce but est atteint conformément à l'invention par le fait que la piste conductrice est appliquée sur une surface de la plaque pourvue de reliefs en forme de boutons et que l'élément de liaison est soudé par ultrasons à l'ensemble composite formé de la piste conductrice et de la  This object is achieved in accordance with the invention by the fact that the conductive track is applied to a surface of the plate provided with reliefs in the form of buttons and that the connecting element is welded by ultrasound to the composite assembly formed of the conductive track and the

plaque, au niveau d'un vallon entre boutons.  plate, at the level of a valley between buttons.

Avec le soudage par ultrasons de l'élément de liaison sur l'ensemble composite formé de la piste conductrice et de la plaque, la fixation de l'élément de liaison sur la piste conductrice n'est pas seulement superficielle, comme c'est le cas dans une liaison soudée ou dans une liaison collée. Au contraire, on obtient avec le soudage par ultrasons une liaison qui traverse la piste conductrice très fine et implique celle- ci. On a ainsi, en plus de la liaison résultant de l'application de la couche conductrice sur la plaque, une force de liaison supplémentaire entre la piste conductrice et la plaque. Avec le soudage par ultrasons, les trois éléments de la liaison, à savoir la plaque, la piste conductrice et l'élément de liaison, sont assemblés de manière homogène. Il s'ensuit que l'élément de liaison est fixé d'une manière durable, résistante à la traction et aux chocs thermiques, à l'ensemble composite formé de la plaque et de la piste conductrice, et  With ultrasonic welding of the connecting element on the composite assembly formed of the conductive track and the plate, the fixing of the connecting element on the conductive track is not only superficial, as is the case in a welded connection or in a bonded connection. On the contrary, with ultrasonic welding, a connection is obtained which crosses the very fine conductive track and involves it. There is thus, in addition to the bond resulting from the application of the conductive layer on the plate, an additional bonding force between the conductive track and the plate. With ultrasonic welding, the three elements of the connection, namely the plate, the conductive track and the connection element, are assembled in a homogeneous manner. It follows that the connecting element is fixed in a durable manner, resistant to traction and to thermal shock, to the composite assembly formed by the plate and the conductive track, and

plus particulièrement à la plaque en tant qu'élément de support stable.  more particularly to the plate as a stable support element.

Malgré les coefficients de dilatation thermique très différents de la plaque et de la piste conductrice, aucun décollement de la liaison n'est  Despite the very different thermal expansion coefficients of the plate and the conductive track, no separation of the bond is

à craindre.to fear.

Avec le soudage par ultrasons, on obtient automatiquement une  With ultrasonic welding, you automatically get a

conductivité élevée entre l'élément de liaison et la piste conductrice.  high conductivity between the connecting element and the conductive track.

La liaison réalisée par soudage par ultrasons offre également une résistance à la corrosion nettement plus élevée qu'une liaison soudée  The connection produced by ultrasonic welding also offers a significantly higher corrosion resistance than a welded connection

traditionnelle ou une liaison collée.  traditional or a bonded bond.

Avec le soudage par ultrasons, à la différence d'une liaison soudée, on évite que la plaque, en particulier la plaque en vitrocéramique, soit soumise localement à une sollicitation thermique  With ultrasonic welding, unlike a welded connection, it is avoided that the plate, in particular the glass-ceramic plate, is locally subjected to a thermal stress

élevée, pouvant nuire à sa tenue dans le temps.  high, which could affect its durability over time.

La plaque présente une surface pourvue de reliefs en forme de boutons, la ou les pistes conductrices étant appliquées sur la surface portant les reliefs en forme de boutons. Pour améliorer la structure et obtenir une liaison sûre, l'élément de liaison est soudé par ultrasons à l'ensemble composite formé de la plaque et de la piste conductrice au  The plate has a surface provided with reliefs in the form of buttons, the conductive track or tracks being applied to the surface carrying the reliefs in the form of buttons. To improve the structure and obtain a secure connection, the connection element is ultrasonically welded to the composite assembly formed by the plate and the conductive track at the

niveau d'un vallon entre boutons.level of a valley between buttons.

L'élément de liaison qui, par exemple, est un fil (fil de jonction) en un matériau de type Al-Si s'étend jusqu'au point de connexion fixé à la plaque et est connecté électriquement et relié mécaniquement audit point de connexion, ce qui peut être réalisé par  The connecting element which, for example, is a wire (connecting wire) made of an Al-Si type material extends to the connection point fixed to the plate and is electrically connected and mechanically connected to said connection point , which can be achieved by

soudage traditionnel ou par soudage par ultrasons.  traditional or ultrasonic welding.

De préférence le point de connexion est disposé sur une platine de connexion - comme cela est courant en électronique - la platine de  Preferably the connection point is arranged on a connection plate - as is common in electronics - the connection plate

connexion étant fixée à la plaque, en particulier étant collée à celle-ci.  connection being fixed to the plate, in particular being glued to the latter.

Du point de connexion concerné, un cable électrique, par exemple, mène à un circuit électronique dont les détecteurs sont constitués par  From the connection point concerned, an electric cable, for example, leads to an electronic circuit, the detectors of which consist of

la ou les pistes conductrices.the conductive track or tracks.

La piste conductrice, dont l'épaisseur est considérablement plus faible que celle de la plaque et est par exemple d'environ 100 nm, est appliquée sur la plaque de préférence par un procédé de sérigraphie,  The conductive track, the thickness of which is considerably smaller than that of the plate and is for example around 100 nm, is applied to the plate preferably by a screen printing process,

par projection cathodique ou par dépôt en phase vapeur.  by cathodic projection or by vapor deposition.

Pour protéger l'élément de liaison, plus particulièrement pour le protéger de la corrosion, ledit élément de liaison est noyé dans une  To protect the connecting element, more particularly to protect it from corrosion, said connecting element is embedded in a

masse de protection qui s'étend depuis le point de connexion jusqu'au-  protective mass which extends from the connection point to

delà du point de soudage par ultrasons. La masse de protection est par exemple une résine époxyde thermodurcissable, sélectionnée en vue  beyond the point of ultrasonic welding. The protective mass is for example a thermosetting epoxy resin, selected in view

d'obtenir une bonne adhérence sur l'ensemble composite plaque-piste conductrice.  to obtain good adhesion on the composite plate-conductive track.

La liaison décrite peut être appliquée par exemple à une plaque de vitrocéramique faisant partie d'une plaque de cuisson, les pistes conductrices constituant dans ce cas des surfaces sensibles et les points de connexion étant reliés à un système de capteur électronique. La liaison décrite peut aussi être appliquée à des plaques de verre, qui constituent par exemple les vitres de  The described connection can be applied for example to a glass-ceramic plate forming part of a cooking plate, the conductive tracks constituting in this case sensitive surfaces and the connection points being connected to an electronic sensor system. The described bond can also be applied to glass plates, which constitute for example the panes of

cheminées ou les hublots de fours de cuisson.  fireplaces or portholes of baking ovens.

La liaison décrite peut encore être appliquée à des bandeaux de commande en verre portant des organes de commande ou pour éviter la  The described connection can also be applied to glass control panels carrying control members or to avoid the

condensation dans des vitres chauffées de réfrigérateurs ou de congélateurs.  condensation in heated windows of refrigerators or freezers.

D'autres avantages de l'invention apparaîtront au cours de la description  Other advantages of the invention will appear during the description

qui va suivre d'un exemple de réalisation faite en référence au dessin.  which will follow from an exemplary embodiment made with reference to the drawing.

La figure unique représente un agencement de connexion en  The single figure shows a connection arrangement in

vue en coupe schématique.schematic section view.

Une plaque de vitrocéramique 1 présente une surface 2 formant surface de pose pour des casseroles. Sur son autre surface 3 sont prévues des conformations ou reliefs en forme de boutons 4. La hauteur des boutons est par exemple comprise dans une plage allant de gm à 200 im. Des dispositifs de chauffage rayonnants courants sont associés à la plaque de vitrocéramique 1. Au moins une piste conductrice 5 est appliquée par sérigraphie, par projection cathodique ou par dépôt en phase vapeur sur la surface 3. La piste conductrice 5, dans les plaques de cuisson, sert de surface sensible de détection pour détecter les casseroles ou pour la mesure de température. La piste conductrice, dans une porte de four à micro-ondes, peut servir de blindage électromagnétique. Dans les portes de four de cuisson et les hublots de cheminées, la piste conductrice peut être prévue pour des  A vitroceramic plate 1 has a surface 2 forming a laying surface for pans. On its other surface 3 are provided conformations or reliefs in the form of buttons 4. The height of the buttons is for example in a range from gm to 200 im. Common radiant heaters are associated with the ceramic hob 1. At least one conductive track 5 is applied by screen printing, by cathode spraying or by vapor deposition on the surface 3. The conductive track 5, in the cooking plates , serves as a sensitive detection surface for detecting pans or for temperature measurement. The conductive track, in a microwave oven door, can serve as electromagnetic shielding. In baking oven doors and chimney windows, the conductive track can be provided for

raisons de sécurité, pour la mesure de la température.  security reasons, for temperature measurement.

De préférence, la piste conductrice 5 est formée d'une couche de métal précieux, en particulier à base d'or ou de platine, dont le coefficient de dilatation thermique est sensiblement plus élevé que celui de la plaque 1. La piste conductrice 5 est appliquée sous forme de pâte à base de résine, par un procédé de  Preferably, the conductive track 5 is formed of a layer of precious metal, in particular based on gold or platinum, whose coefficient of thermal expansion is substantially higher than that of the plate 1. The conductive track 5 is applied in the form of a paste based on resin, by a process of

sérigraphie. La piste conductrice 5 à une épaisseur d'environ 100 nm.  screen printing. The conductive track 5 has a thickness of about 100 nm.

Elle suit le relief des boutons et des vallons entre boutons (voir figure) . Une platine de connexion 6 est fixée à la surface 3 au moyen d'un adhésif 7. La platine de connexion 6 s'étend sur deux boutons ou plus, les vallons entre boutons étant comblés avec de l'adhésif 7. La  It follows the relief of the buttons and valleys between buttons (see figure). A connection plate 6 is fixed to the surface 3 by means of an adhesive 7. The connection plate 6 extends over two or more buttons, the valleys between buttons being filled with adhesive 7. The

platine de connexion 6 porte plusieurs surfaces de connexion 8 électro-  connection plate 6 carries several connection surfaces 8 electro-

conductrices, dont une seulement est visible sur la figure. Un câble 9 électrique est relié à la surface de connexion 8, ou aux surfaces de connexion, dans une zone 10. Le câble 9 mène à un circuit électronique. Une liaison soudée ou une liaison à enfichage peut être prévue dans la zone 10, un des éléments de la liaison à enfichage étant  conductive, only one of which is visible in the figure. An electric cable 9 is connected to the connection surface 8, or to the connection surfaces, in a zone 10. The cable 9 leads to an electronic circuit. A welded connection or a plug connection may be provided in zone 10, one of the elements of the plug connection being

alors fixé à la platine de connexion 6.  then fixed to the connection plate 6.

Pour relier la surface de connexion 8 à la piste conductrice 5, il est prévu un élément de liaison qui est formé d'un bout de fil. Le bout de fil 11 est un fil de jonction en un matériau de type Al-Si. Le fil a  To connect the connection surface 8 to the conductive track 5, there is provided a connecting element which is formed of a piece of wire. The end of the wire 11 is a connecting wire made of an Al-Si type material. The wire has

par exemple un diamètre d'environ 0,1 mm.  for example a diameter of about 0.1 mm.

L'une des extrémités du bout de fil 11 est soudée par un procédé à ultrasons à l'ensemble composite formé de la plaque de vitrocéramique 1 et de la piste conductrice 5. Le point de soudage est désignée de manière symbolique 12. Le bout de fil 11 lié par soudage ou le point de soudage 12 se termine de préférence sur la surface, ou de manière avantageuse dans la piste conductrice 5, car les informations doivent être transmises à travers celle-ci. Le point de soudage 12 est situé dans un vallon entre boutons, ce qui évite une dégradation de la piste conductrice 5, particulièrement sensible dans la région des sommets des boutons. Avec le soudage par ultrasons, on ne se limite pas seulement à connecter le bout de fil 11 à la piste conductrice 5 qui adhère exclusivement par l'effet de liaison résultant de l'application de ladite piste conductrice 5 sur la plaque de vitrocéramique. Par le procédé de soudage par ultrasons, on obtient une liaison supplémentaire entre la piste conductrice 5 et la plaque de vitrocéramique 1, dans la région du point de soudage 12 et au final, l'extrémité du bout de fil 11 est soudée à la plaque de vitrocéramique 1 dans la région du point de soudage 12. La résistance à la traction est d'au moins 200 cN. La résistance élevée de la liaison est obtenue grâce au soudage par ultrasons malgré des coefficients de dilatation thermique très différents pour la plaque de vitrocéramique 1 et pour la piste conductrice 5 soient. Dans la liaison bout de fil en un matériau de type Al-Si 11 - piste conductrice 5, en particulier piste conductrice en or, les matériaux mis en oeuvre sont très ductiles et -la finesse de la couche aidant - ils absorbent les différences de dilatation. La conductibilité thermique de la vitrocéramique est faible. Elle est de l'ordre de 1,5 W/mK. En revanche, la conductibilité thermique de la  One of the ends of the end of the wire 11 is welded by an ultrasonic process to the composite assembly formed by the glass-ceramic plate 1 and the conductive track 5. The welding point is symbolically designated 12. The end of wire 11 bonded by welding or the welding point 12 preferably ends on the surface, or advantageously in the conductive track 5, because the information must be transmitted through it. The welding point 12 is located in a valley between buttons, which prevents degradation of the conductive track 5, which is particularly sensitive in the region of the tops of the buttons. With ultrasonic welding, it is not limited solely to connecting the end of the wire 11 to the conductive track 5 which adheres exclusively by the bonding effect resulting from the application of said conductive track 5 on the glass-ceramic plate. By the ultrasonic welding process, an additional connection is obtained between the conductive track 5 and the glass-ceramic plate 1, in the region of the welding point 12 and in the end, the end of the wire end 11 is welded to the plate. of ceramic glass 1 in the region of the welding point 12. The tensile strength is at least 200 cN. The high resistance of the connection is obtained by ultrasonic welding despite very different thermal expansion coefficients for the glass ceramic plate 1 and for the conductive track 5 are. In the end-of-wire connection of a material of Al-Si 11 type - conductive track 5, in particular conductive track in gold, the materials used are very ductile and - the thinness of the layer helping - they absorb the differences in expansion . The thermal conductivity of the glass ceramic is low. It is around 1.5 W / mK. However, the thermal conductivity of the

piste conductrice 5 est élevée.conductive track 5 is high.

La résistance électrique de contact entre la piste conductrice 5 et le bout de fil 11 est faible, du fait du soudage par ultrasons. Elle est  The electrical contact resistance between the conductive track 5 and the end of the wire 11 is low, due to ultrasonic welding. She is

inférieure à 0,1 Ohm.less than 0.1 Ohm.

La soudure réalisée par ultrasons est également résistante aux chocs thermiques et à la corrosion, ce qui est avantageux notamment lorsque, comme c'est le cas dans des appareils de cuisson, la liaison  The ultrasonic welding is also resistant to thermal shock and corrosion, which is advantageous in particular when, as is the case in cooking appliances, the connection

est exposée à des températures élevées et à l'humidité.  is exposed to high temperatures and humidity.

Le bout de fil 11l s'étend sur un ou plusieurs boutons 4, en formant un arc libre, jusqu'à la surface de connexion 8 et est relié à celle-ci en un point 13. Une liaison par brasage, par soudage, par soudage par ultrasons ou par serrage peut être prévue en ce point. La flexion libre du bout de fil 11 entre les points 12 et 13 apporte une certaine élasticité ou flexibilité, avantageuse pour compenser les tolérances et également compenser les différences de dilatation thermique. Afin de protéger le bout de fil 11 et les points de connexion 12 et 13 des influences extérieures, il est prévu une masse de protection 14, sous la forme d'un bourrelet qui entoure le bout de fil 11 et recouvre les points de connexion 12 et 13. La masse de protection 14 adhère à la plaque de vitrocéramique 1 et à la piste conductrice 5. La masse de protection 14 est formée par exemple d'une résine époxyde thermodurcissable. La piste conductrice 5 peut servir de surface sensible pour divers cas d'applications. Elle peut servir à détecter une casserole dans le cas d'une table de cuisson ou bien être utilisée comme capteur de température, auquel cas, elle présente une résistance qui varie en fonction de la température.  The end of the wire 11l extends over one or more buttons 4, forming a free arc, up to the connection surface 8 and is connected to the latter at a point 13. A connection by soldering, by welding, by ultrasonic or clamp welding may be provided at this point. The free bending of the end of the wire 11 between the points 12 and 13 provides a certain elasticity or flexibility, advantageous for compensating for the tolerances and also compensating for the differences in thermal expansion. In order to protect the end of the wire 11 and the connection points 12 and 13 from external influences, a protective mass 14 is provided, in the form of a bead which surrounds the end of the wire 11 and covers the connection points 12 and 13. The protective mass 14 adheres to the glass ceramic plate 1 and to the conductive track 5. The protective mass 14 is formed for example from a thermosetting epoxy resin. The conductive track 5 can serve as a sensitive surface for various application cases. It can be used to detect a pan in the case of a hob or be used as a temperature sensor, in which case, it has a resistance which varies depending on the temperature.

Claims (14)

REVENDICATIONS 1. Liaison entre au moins un point de connexion électrique, en particulier pour un système de capteur, et une piste conductrice appliquée sur une plaque, en particulier sur une plaque de verre ou de vitrocéramique, dans laquelle un élément de liaison (11) électro- conducteur, qui s'étend jusqu'au point de connexion (13) et est connecté à celui-ci, est soudé par ultrasons à l'ensemble composite formé de la piste conductrice (5) et de la plaque (1) et dans laquelle le point de connexion (13) est fixé à la plaque (1), caractérisée en ce que la piste conductrice (5) est appliquée sur une surface (3, 4) de la plaque (1) pourvue de reliefs en forme de boutons et en ce que l'élément de liaison (11) est soudé par ultrasons à l'ensemble composite formé de la piste conductrice (5) et de la plaque (1) au niveau d'un vallon  1. Connection between at least one electrical connection point, in particular for a sensor system, and a conductive track applied to a plate, in particular to a glass or glass-ceramic plate, in which an electro-connecting element (11) - conductor, which extends to and is connected to the connection point (13), is ultrasonically welded to the composite assembly formed by the conductive track (5) and the plate (1) and in which the connection point (13) is fixed to the plate (1), characterized in that the conductive track (5) is applied to a surface (3, 4) of the plate (1) provided with reliefs in the form of buttons and in that the connecting element (11) is ultrasonically welded to the composite assembly formed by the conductive track (5) and the plate (1) at the level of a valley entre boutons.between buttons. 2. Liaison selon la revendication 1, caractérisée en ce que la piste conductrice (5) est formée d'une couche de métal précieux, en particulier à base d'or ou de platine, dont le coefficient de dilatation thermique est sensiblement plus  2. Connection according to claim 1, characterized in that the conductive track (5) is formed of a layer of precious metal, in particular based on gold or platinum, whose coefficient of thermal expansion is substantially more élevé que celui de la plaque (1).higher than that of the plate (1). 3. Liaison selon une quelconque des revendications  3. Connection according to any one of the claims précédentes, caractérisée en ce que la piste conductrice (5) est appliquée sur la plaque (1) par un procédé d'impression par sérigraphie, par projection cathodique ou par dépôt en  above, characterized in that the conductive track (5) is applied to the plate (1) by a printing process by screen printing, by cathodic projection or by deposition in phase vapeur.vapor phase. 4. Liaison selon une quelconque des revendications  4. Connection according to any one of the claims précédentes, caractérisée en ce que l'épaisseur de la piste  previous, characterized in that the thickness of the track conductrice (5) est d'environ 100 nm.  conductive (5) is about 100 nm. 5. Liaison selon une quelconque des revendications  5. Connection according to any one of the claims précédentes, caractérisée en ce que l'élément de liaison est  previous, characterized in that the connecting element is un bout de fil (11).a piece of wire (11). 6. Liaison selon la revendication 5, caractérisée en ce que le  6. Connection according to claim 5, characterized in that the bout de fil (11) a un diamètre d'environ 0,1 mm.  end of wire (11) has a diameter of about 0.1 mm. 7. Liaison selon une quelconque des revendications  7. Connection according to any one of the claims précédentes, caractérisée en ce que l'élément de liaison (11) est réalisé en un matériau de type Al-Si.  above, characterized in that the connecting element (11) is made of an Al-Si type material. 8. Liaison selon une quelconque des revendications  8. Connection according to any one of the claims précédentes, caractérisée en ce que l'élément de liaison (11) s'étend jusqu'au point de connexion(13) en formant un arc  previous, characterized in that the connecting element (11) extends to the connection point (13) by forming an arc au-dessus au moins un bouton.above at least one button. 9. Liaison selon une quelconque des revendications  9. Connection according to any one of the claims précédentes, caractérisée en ce que l'élément de liaison (11) est noyé dans une masse de protection (14) qui depuis le point de connexion (13) jusqu'au delà du point (12) de la  previous, characterized in that the connecting element (11) is embedded in a protective mass (14) which from the connection point (13) to beyond the point (12) of the soudure par ultrasons.ultrasonic welding. 10.Liaison selon une quelconque des revendications  10. Link according to any one of the claims précédentes, caractérisée en ce que le point de connexion (13), en tant que surface de connexion (8), est disposé sur une platine de connexion (6) , qui est fixée à la plaque (1) au  previous, characterized in that the connection point (13), as a connection surface (8), is arranged on a connection plate (6), which is fixed to the plate (1) at the moyen d'un adhésif (7).using an adhesive (7). 11.Liaison selon la revendication 10, caractérisée en ce que la platine de connexion (6) s'étend sur deux boutons (4) ou plus.  11. Link according to claim 10, characterized in that the connection plate (6) extends over two or more buttons (4). 12.Liaison selon une quelconque des revendications  12.Link according to any one of the claims précédentes, caractérisée en ce que la liaison est agencée de telle sorte que la résistance de contact entre la piste conductrice (5) et l'élément de liaison (11) soit inférieure à  above, characterized in that the connection is arranged in such a way that the contact resistance between the conductive track (5) and the connection element (11) is less than 0,1 Ohm.0.1 Ohm. 13.Utilisation d'une liaison selon une quelconques des  13.Use of a link according to any of revendications précédentes dans une plaque vitrocéramique  previous claims in a ceramic hob (1) d'une table de cuisson, caractérisée en ce que les pistes conductrices (5) forment des surfaces sensibles et le point de connexion (13) est relié électriquement à un système de  (1) of a hob, characterized in that the conductive tracks (5) form sensitive surfaces and the connection point (13) is electrically connected to a system of capteur électronique.electronic sensor. 14.Utilisation d'une liaison selon une quelconque des  14.Use of a link according to any one of revendications 1 à 12 précédentes, dans des hublots d'inserts  Claims 1 to 12 above, in insert windows de cheminées ou dans des hublots de four de cuisson.  chimneys or in oven oven portholes.
FR0104949A 2000-04-13 2001-04-11 ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED ON A PLATE, PARTICULARLY ON A PLATE OF VITROCERAMIC Expired - Fee Related FR2807907B1 (en)

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DE10018415A DE10018415C1 (en) 2000-04-03 2000-04-13 Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2047476A (en) * 1979-02-26 1980-11-26 Secr Defence Improvement in or relating to applying circuit elements to a substrate
US4237368A (en) * 1978-06-02 1980-12-02 General Electric Company Temperature sensor for glass-ceramic cooktop
US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
WO1988005428A1 (en) * 1987-01-21 1988-07-28 Hughes Aircraft Company Method for connecting leadless chip packages and articles
DE4022845A1 (en) * 1990-07-18 1992-01-23 Schott Glaswerke TEMPERATURE SENSOR OR SENSOR ARRANGEMENT MADE OF GLASS CERAMIC AND CONTACTING FILM RESISTORS
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
DE69204564T2 (en) * 1991-06-12 1996-05-02 Philips Electronics Nv Process for the selective electroless plating of a sample from a material other than glass on a glass substrate.
DE19707664A1 (en) * 1996-03-02 1997-10-30 Aeg Hausgeraete Gmbh Device for controlling or regulating temp. of heated surfaces, esp. glass ceramic cooking hobs
DE19711541A1 (en) * 1997-03-20 1998-09-24 Ako Werke Gmbh & Co Electric hotplate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330704A (en) * 1980-08-08 1982-05-18 Raychem Corporation Electrical devices comprising conductive polymers
JPH0770345B2 (en) * 1990-06-28 1995-07-31 株式会社エーユーイー研究所 Connector manufacturing method and connector
GB9423921D0 (en) * 1994-11-26 1995-01-11 Panaghe Stylianos Electrical connection method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237368A (en) * 1978-06-02 1980-12-02 General Electric Company Temperature sensor for glass-ceramic cooktop
GB2047476A (en) * 1979-02-26 1980-11-26 Secr Defence Improvement in or relating to applying circuit elements to a substrate
US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
WO1988005428A1 (en) * 1987-01-21 1988-07-28 Hughes Aircraft Company Method for connecting leadless chip packages and articles
DE4022845A1 (en) * 1990-07-18 1992-01-23 Schott Glaswerke TEMPERATURE SENSOR OR SENSOR ARRANGEMENT MADE OF GLASS CERAMIC AND CONTACTING FILM RESISTORS
DE69204564T2 (en) * 1991-06-12 1996-05-02 Philips Electronics Nv Process for the selective electroless plating of a sample from a material other than glass on a glass substrate.
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
DE19707664A1 (en) * 1996-03-02 1997-10-30 Aeg Hausgeraete Gmbh Device for controlling or regulating temp. of heated surfaces, esp. glass ceramic cooking hobs
DE19711541A1 (en) * 1997-03-20 1998-09-24 Ako Werke Gmbh & Co Electric hotplate

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FR2807907B1 (en) 2005-01-28
GB2362515B (en) 2003-09-24
GB2362515A (en) 2001-11-21

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