FR2806029A1 - Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions - Google Patents

Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions Download PDF

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Publication number
FR2806029A1
FR2806029A1 FR0003013A FR0003013A FR2806029A1 FR 2806029 A1 FR2806029 A1 FR 2806029A1 FR 0003013 A FR0003013 A FR 0003013A FR 0003013 A FR0003013 A FR 0003013A FR 2806029 A1 FR2806029 A1 FR 2806029A1
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FR
France
Prior art keywords
plate
cutting
depositing
extruded
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR0003013A
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French (fr)
Inventor
Christian Antoine Fournier
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to FR0003013A priority Critical patent/FR2806029A1/en
Priority to FR0010163A priority patent/FR2806030B3/en
Publication of FR2806029A1 publication Critical patent/FR2806029A1/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/022—Particular heating or welding methods not otherwise provided for
    • B29C65/028—Particular heating or welding methods not otherwise provided for making use of inherent heat, i.e. the heat for the joining comes from the moulding process of one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B29C66/4724—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat said single elements being appliques, e.g. in the form of a text or drawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411—Roller, cylinder or drum types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8351—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws
    • B29C66/83511—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws jaws mounted on rollers, cylinders or drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/005—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore cutting-off or cutting-out a part of a strip-like or sheet-like material, transferring that part and fixing it to an article
    • B29C69/006—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore cutting-off or cutting-out a part of a strip-like or sheet-like material, transferring that part and fixing it to an article rotating transfer means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)

Abstract

Portable objects are produced continuously by extruding a strip and then cutting it on line into ISO card format or other dimensions. Independent claims are included for the following: (a) Depositing microcircuits or integrated circuits for an ISO card into an extruded strip while it is moving. (b) Attaching microchips to an extruded strip and after the strip has been into cards, etc. the chips are connected by metallization or serigraphy (c) Forming a cavity in a moving extruded strip for subsequently receiving a microchip. (d) Applying to an extruded strip downstream of an extruder a security and/or decorative element, magnetic strip, a scratchable or a security finish. Preferred Features: The microchip, etc is attached mechanically, chemically or physically. The temperature of the freshly extruded strip activates adhesive on the security element or forms a direct mechanical bond with the element. A base for electrical contact pads is also formed during the extrusion process. The cards are printed on before or after being cut to size.

Description

Titre: PROCEDE DE FABRICATION D'OBJETS PORTABLES La présente invention concerne la fabrication d'objets portables tels que par exemple étiquettes électroniques ou cartes. Ces objets portables comme pour les cartes électroniques peuvent être de type à contact ou sans contact du fait de leur aptitude à échanger des informations par l'intermédiaire de contacts ou à distance avec un lecteur suivant un mode lecture ou bien un mode écriture/lecture. Title: PROCESS FOR MANUFACTURING PORTABLE OBJECTS The present invention relates to the manufacture of portable objects such as for example electronic labels or cards. These portable objects as for electronic cards can be of the contact or contactless type due to their ability to exchange information via contacts or remotely with a reader according to a reading mode or else a writing / reading mode.

Dans un procédé connu de fabrication d'une carte, est mise en oeuvre la technique dite de lamination. Elle consiste ici à disposer entre les plateaux d'une presse un empilement de feuilles thermoplastiques, préalablement imprimées ou pas. Par élévation de la température et de la pression est ainsi constituée une plaque dans laquelle il est possible de découper des corps de carte. Ces corps de carte doivent ensuite être usiner pour réaliser une cavité. Cette cavité est destinée à recevoir le micromodule, fixé au corps de carte par collage. L'inconvénient de ce procédé est le grand nombre d'opérations qu'il nécessite - L'impression des feuilles de plastiques - L'assemblage des feuilles - La lamination - La découpe au format des cartes - L'usinage de la cavité - Le report du micromodule dans la cavité Par ailleurs les investissements d'équipements sont très lourds et la productivité est très faible. In a known method of manufacturing a card, the so-called lamination technique is implemented. It consists here of placing between the platens of a press a stack of thermoplastic sheets, previously printed or not. By raising the temperature and the pressure, a plate is thus formed from which it is possible to cut card bodies. These card bodies must then be machined to produce a cavity. This cavity is intended to receive the micromodule, fixed to the card body by gluing. The disadvantage of this process is the large number of operations it requires - Printing plastic sheets - Assembling the sheets - Laminating - Cutting to card format - Machining the cavity - The transfer of the micromodule into the cavity Furthermore, the investment in equipment is very heavy and the productivity is very low.

Il est proposé une solution à ce problème selon laquelle le corps de carte est obtenu directement avec sa cavité par le procédé bien connu de l'injection de thermoplastique. Ce procédé consiste à injecter de la matière thermoplastique à l'état liquide dans un moule présentant la forme d'une carte normalisée sans son module. A solution is proposed to this problem according to which the card body is obtained directly with its cavity by the well-known method of injecting thermoplastic. This process consists in injecting thermoplastic material in the liquid state into a mold having the form of a standardized card without its module.

Ce procédé à toutefois le désavantage d'être de mise en oeuvre complexe. Les investissements sont lourds, les choix de matériaux sont limités. This process however has the disadvantage of being complex to implement. Investments are heavy, the choice of materials is limited.

La présente invention procède d'une recherche d'une nouvelle solution de fabrication d'objets portable comme une carte pour satisfaire aux objectifs d'automatisation de fabrication et de production en grande série à cadence élevée et supprimer les inconvénients connus dans l'art antérieur. The present invention proceeds from a search for a new solution for manufacturing portable objects such as a card to meet the objectives of manufacturing automation and mass production at high speed and eliminate the drawbacks known in the prior art. .

Le procédé d'extrusion consiste à pousser en continu la dite matière ramollie par la chaleur à travers une filière qui définit la géométrie du profilé à section droite constante qui est refroidi en forme. Une extrudeuse utilisée pour ce procédé n'est pas l'objet de l'invention. The extrusion process consists in continuously pushing said softened material by heat through a die which defines the geometry of the profile with a constant cross section which is cooled in shape. An extruder used for this process is not the subject of the invention.

A cet effet, l'invention consiste en un procédé d'extrusion afin d'obtenir une plaque de thermoplastique (1). To this end, the invention consists of an extrusion process in order to obtain a thermoplastic plate (1).

Un module devant être reporté sur la plaque extrudée est issu d'une bobine de film contenant de nombreux modules. Par module, il s'agit d'un objet électronique assemblé sur un support à contact. Ce film est découpé (18) afin d'obtenir des modules. Le module une fois découpée et sans être lâché est directement inséré (19) dans la plaque au plus prés de l'extrudeuse. La plaque contenant les modules distants d'un pas constant passe entre des rouleaux de calandrage (5). La Fig. 3 est une vue schématique en coupe illustrant dans son principe un dispositif de découpe et dépose en continu d'un module utilisé dans une forme de mise en oeuvre du procédé selon l'invention. A module to be transferred to the extruded plate comes from a film reel containing many modules. By module, it is an electronic object assembled on a contact support. This film is cut (18) in order to obtain modules. The module, once cut and without being released, is directly inserted (19) in the plate as close as possible to the extruder. The plate containing the remote modules with a constant pitch passes between calendering rollers (5). Fig. 3 is a schematic sectional view illustrating in principle a device for cutting and continuously depositing a module used in one form of implementation of the method according to the invention.

Les étapes suivantes de refroidissement (6) et de marquage (7) sont faites indifféremment dans un ordre ou un autre. The following stages of cooling (6) and marking (7) are carried out indifferently in one order or another.

Par marquage on entend tout report sur la plaque, d'impression ayant pour fonction le cosmétique ou le sécuritaire. By marking is meant any transfer on the plate, of printing having for cosmetic or security function.

Fig. 2 - Dans une forme de réalisation de l'invention, un matriçage (15) est effectué en sortie de filière. Il est obtenu ainsi une cavité sur la plaque (17) pouvant recevoir par exemple un micromodule ou tout autre objet.  Fig. 2 - In one embodiment of the invention, a stamping (15) is carried out at the outlet of the die. A cavity is thus obtained on the plate (17) which can receive, for example, a micromodule or any other object.

Selon une autre caractéristique de l'invention, l'étape de découpe (12) comprend une phase préalable de repérage (10), en vue du positionnement pour la découpe proprement dite, le repérage consistant en une détection du micromodule en surface de la plaque ou d'une marque réalisée dans la plaque lors de la dépose du module. According to another characteristic of the invention, the cutting step (12) comprises a preliminary marking phase (10), with a view to positioning for the actual cutting, the marking consisting in detecting the micromodule on the surface of the plate or a mark made in the plate when removing the module.

Dans une variante de l'invention, il est prévu de fabriquer des objets portables tel que cartes plastiques, par exemple, sans micromodules, mais ne comportant que des éléments de décoration ou sécuritaire. Dans ce cas le repérage avant découpe de la plaque (1) en carte par exemple(l 1) est effectuée sur ces éléments décoratifs ou sécuritaires. In a variant of the invention, provision is made to manufacture portable objects such as plastic cards, for example, without micromodules, but comprising only decorative or security elements. In this case, the location before cutting the plate (1) into a card for example (l 1) is carried out on these decorative or security elements.

Afin d'obtenir une découpe de bonne qualité il est possible d'avoir recours au procédé bien connu de la découpe poinçon matrice. Dans ce cas il est prévu un buffer (9) car ce procédé étant alternatif, il ne peu s'effectuer sur une avance en continu de la plaque.  In order to obtain a good quality cut, it is possible to have recourse to the well known process of die punch cutting. In this case a buffer (9) is provided because this process is alternative, it cannot be carried out on a continuous advance of the plate.

Les chutes de matières (13) résultant de la découpe peuvent, suite à un broyage, être directement renvoyé en entrée d'extrudeuse et ainsi être avantageusement recyclé immédiatement. Scraps of material (13) resulting from cutting can, after grinding, be returned directly to the extruder inlet and thus advantageously be recycled immediately.

La largeur de la plaque extrudée comporte une, deux ou plus d'objets portables.The width of the extruded plate includes one, two or more portable objects.

Claims (1)

REVENDICATIONS 1.) Procédé de fabrication d'objets portables en continue par extrusion, caractérisé en ce qu'il comprend les étapes suivantes - Extrusion de la dite plaque. - Découpe en ligne au format carte ISO ou dimensions différentes. 2.) Procédé de fabrication selon la revendication 1, caractérisé en ce qu'il comprend une étape de dépôt sur au moins une surface de la dite plaque d'éléments sécuritaires et, ou décoratifs. 3.) Procédé de fabrication selon la revendication 2, caractérisé en ce que lors de l'étape de dépôt un module est inséré dans la dite plaque par pression mécanique. 4.) Procédé de fabrication selon la revendication 3, caractérisé en ce que le dépôt est réalisé en continu. 5.) Procédé de fabrication, selon une quelconque des revendications précédentes, caractérisé en ce qu'il est utilisé la température élevée de la plaque extrudée pour activer une colle, fixant physiquement le module dans la plaque. 6.) Procédé selon la revendication 2, caractérisé en ce qu'il est utilisé le ramollissement de la matière extrudée pour ancrer mécaniquement le module. 7.) Procédé selon la revendication 2, caractérisé en ce que suite à l'étape d'extrusion à lieu en ligne une étape de matriçage ou formage (19) de la plaque extrudée (20) à l'étape de dépose du circuit intégré permettant ultérieurement la réalisation des plages de contact. 8.) Procédé de dépose des micromodules ou des circuits intégrés au pas des cartes ISO sur la plaque extrudée sans arrêt de celle-ci ou â tout autre pas. 9.) Procédé de fabrication selon la revendication 2 ou 3, caractérisé en ce que le module est fixé à la dite plaque par des moyens mécaniques, physiques ou chimiques. 10.) Procédé de fixation et ancrage de puces nues sur la plaque extrudée. Ces puces, une fois la carte découpée ou toutes autres géométries, pouvant être connecter par sérigraphie ou métallisation à des plages de connections. 11.) Procédé selon la revendication 8, caractérisé par une fixation de puce très fine (25pm par exemple) en surface de la plaque en mode continu, sans création de cavité spécifique. 12.) Procédé caractérisé par le Formage (15) d'une cavité pendant l'avance de la plaque après la filière (22) d'extrusion. Cavité dans laquelle peut-être déposé de la colle pour un report à posteriori d'un micromodule de fonctionnement à contact ou sans contact selon la revendication 10. 13.) Procédé selon les revendications 2, 6, 10, caractérisé par la création d'une pression en continu sur le module (5), positionné dans la plaque, ceci afin de le positionner précisément et durablement. 14.) Procédé caractérisé par la Dépose en ligne, d'élément sécuritaire et ou décoratif (7) pavet sécuritaire, pavet grattable, piste magnétique ... sur la plaque issue directement d'extrusion. 15.) Procédé selon la revendication 14, caractérisé en ce que toutes les techniques d'impression sont possibles sur la plaque en continu avant ou après découpe au format carte (jet d'encre, laser, estampage, motif en relief, tampographie, sérigraphie, offset, Héliographie, flexographie... ). 16.) Procédé caractérisé en ce qu'il comprend une étape de découpe (12) au format final (11) dans laquelle est prévue une phase de repérage (10) au préalable du micromodule et/ou d'une marque générée lors de la dépose du micromodule, selon les revendications ( 5, 6, 10)ou l'impression selon les revendications 14, 15. 17.) Procédé selon la revendication 14, caractérisé en ce que suite à l'étape d'extrusion et avant, pendant ou après refroidissement (6) ai lieu une étape de découpe (12) au format carte ISO ou tout autre géométrie (11) tel que micro-carte, barrette, étiquette... 18.) Procédé selon la revendication 6, caractérisé en ce que la découpe des modules ou micromodules est faite par un outil rotatif, le transfert de ces modules découpés sur la plaque extrudée et fait directement ou soit par une roue de dépose intermédiaire (25). <I>Revendications</I> indépendantes.) Procédé selon la revendication 7, caractérisé en ce que la découpe et la dépose du micromodule se fassent au travers de l'outil (12) sur l'élément presseur (22). Cet élément presseur déposant ensuite le module (23) sur la plaque, selon la revendication 6. CLAIMS 1.) Method of manufacturing portable objects continuously by extrusion, characterized in that it comprises the following stages - Extrusion of said plate. - Online cutting in ISO card format or different dimensions. 2.) The manufacturing method according to claim 1, characterized in that it comprises a step of depositing on at least one surface of said plate of security and or decorative elements. 3.) Manufacturing method according to claim 2, characterized in that during the deposition step a module is inserted into said plate by mechanical pressure. 4.) The manufacturing method according to claim 3, characterized in that the deposition is carried out continuously. 5.) Manufacturing process according to any one of the preceding claims, characterized in that the high temperature of the extruded plate is used to activate an adhesive, physically fixing the module in the plate. 6.) Method according to claim 2, characterized in that the softening of the extruded material is used to mechanically anchor the module. 7.) Method according to claim 2, characterized in that following the extrusion step takes place in line a stamping or forming step (19) of the extruded plate (20) in the step of removing the integrated circuit subsequently allowing the production of contact pads. 8.) Method for depositing micromodules or integrated circuits at the step of ISO cards on the extruded plate without stopping the latter or at any other step. 9.) The manufacturing method according to claim 2 or 3, characterized in that the module is fixed to said plate by mechanical, physical or chemical means. 10.) Method of fixing and anchoring bare chips on the extruded plate. These chips, once the card cut out or any other geometry, can be connected by screen printing or metallization to connection pads. 11.) Method according to claim 8, characterized by a very fine chip fixation (25pm for example) on the surface of the plate in continuous mode, without creation of specific cavity. 12.) Method characterized by the forming (15) of a cavity during the advancement of the plate after the extrusion die (22). Cavity in which can be deposited glue for a posteriori transfer of a contact or contactless micromodule according to claim 10. 13.) Method according to claims 2, 6, 10, characterized by the creation of continuous pressure on the module (5), positioned in the plate, in order to position it precisely and durably. 14.) Process characterized by the Online removal, of a security and or decorative element (7) security block, scrapable block, magnetic track ... on the plate directly from extrusion. 15.) Method according to claim 14, characterized in that all printing techniques are possible on the plate continuously before or after cutting in card format (inkjet, laser, stamping, relief pattern, pad printing, screen printing , offset, heliography, flexography ...). 16.) A method characterized in that it comprises a cutting step (12) in the final format (11) in which a marking phase (10) is provided beforehand for the micromodule and / or a mark generated during the depositing the micromodule according to claims (5, 6, 10) or printing according to claims 14, 15. 17.) Method according to claim 14, characterized in that following the extrusion step and before, during or after cooling (6) a cutting step (12) takes place in ISO card format or any other geometry (11) such as micro-card, bar, label, etc. 18.) Method according to claim 6, characterized in that that the cutting of the modules or micromodules is made by a rotary tool, the transfer of these cut modules on the extruded plate and done directly or either by an intermediate depositing wheel (25). <I> Independent claims </I>.) Method according to claim 7, characterized in that the cutting and depositing of the micromodule is done through the tool (12) on the pressing element (22). This pressing element then depositing the module (23) on the plate, according to claim 6.
FR0003013A 2000-03-09 2000-03-09 Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions Pending FR2806029A1 (en)

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FR0003013A FR2806029A1 (en) 2000-03-09 2000-03-09 Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions
FR0010163A FR2806030B3 (en) 2000-03-09 2000-08-01 PROCESS FOR MANUFACTURING PORTABLE OBJECTS

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FR0003013A FR2806029A1 (en) 2000-03-09 2000-03-09 Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions

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US7984740B2 (en) 2004-10-14 2011-07-26 Glenn Roche Flexible magnetised portion applicator dispensing apparatus and method
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US8246773B2 (en) 2002-01-18 2012-08-21 Avery Dennison Corporation RFID label technique
US8350703B2 (en) 2003-03-24 2013-01-08 Alien Technology Corporation RFID tags and processes for producing RFID tags
US8912907B2 (en) 2003-03-24 2014-12-16 Alien Technology, Llc RFID tags and processes for producing RFID tags
US9418328B2 (en) 2003-03-24 2016-08-16 Ruizhang Technology Limited Company RFID tags and processes for producing RFID tags
US7868766B2 (en) 2003-03-24 2011-01-11 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7984740B2 (en) 2004-10-14 2011-07-26 Glenn Roche Flexible magnetised portion applicator dispensing apparatus and method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
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US9070063B2 (en) 2004-11-22 2015-06-30 Ruizhang Technology Limited Company Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US8531297B2 (en) 2005-04-25 2013-09-10 Avery Dennison Corporation High-speed RFID circuit placement method and device
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