FR2797554B1 - Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procede - Google Patents
Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procedeInfo
- Publication number
- FR2797554B1 FR2797554B1 FR9910449A FR9910449A FR2797554B1 FR 2797554 B1 FR2797554 B1 FR 2797554B1 FR 9910449 A FR9910449 A FR 9910449A FR 9910449 A FR9910449 A FR 9910449A FR 2797554 B1 FR2797554 B1 FR 2797554B1
- Authority
- FR
- France
- Prior art keywords
- support
- device obtained
- electronic device
- electronic components
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9910449A FR2797554B1 (fr) | 1999-08-12 | 1999-08-12 | Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procede |
KR1020017004550A KR20010083902A (ko) | 1999-08-12 | 2000-08-09 | 지지대 상에 전자 구성요소를 어셈블리하는 방법 및 그방법으로 얻어지는 디바이스 |
PCT/FR2000/002281 WO2001013687A1 (fr) | 1999-08-12 | 2000-08-09 | Procede d'assemblage de composants electroniques sur un support et dispositif obtenu par ce procede |
EP00958654A EP1125480A1 (fr) | 1999-08-12 | 2000-08-09 | Procede d'assemblage de composants electroniques sur un support et dispositif obtenu par ce procede |
JP2001517845A JP2003507897A (ja) | 1999-08-12 | 2000-08-09 | 電子部品を支持体上に取り付ける方法及び該方法により得られるデバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9910449A FR2797554B1 (fr) | 1999-08-12 | 1999-08-12 | Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procede |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2797554A1 FR2797554A1 (fr) | 2001-02-16 |
FR2797554B1 true FR2797554B1 (fr) | 2001-11-02 |
Family
ID=9549107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9910449A Expired - Fee Related FR2797554B1 (fr) | 1999-08-12 | 1999-08-12 | Procede d'assemblage de composants electroniques sur un support et dispositif electronique obtenu par ce procede |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1125480A1 (fr) |
JP (1) | JP2003507897A (fr) |
KR (1) | KR20010083902A (fr) |
FR (1) | FR2797554B1 (fr) |
WO (1) | WO2001013687A1 (fr) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3503721A (en) * | 1967-02-16 | 1970-03-31 | Nytronics Inc | Electronic components joined by tinsilver eutectic solder |
DE2655238A1 (de) * | 1976-12-06 | 1978-06-08 | Patra Patent Treuhand | Verfahren zur herstellung von glassockelgluehlampen mit maschinell loetfaehigen stromzufuehrungen aus stromlos verzinntem kupfermanteldraht von kleiner oder gleich 9 mm laenge |
JPS6461089A (en) * | 1987-09-01 | 1989-03-08 | Fujitsu Ltd | Surface mounting structure of printed board |
US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
US5520752A (en) * | 1994-06-20 | 1996-05-28 | The United States Of America As Represented By The Secretary Of The Army | Composite solders |
DE19512838C2 (de) * | 1995-04-06 | 2000-09-14 | Hella Kg Hueck & Co | Elektrisches oder elektronisches Gerät |
WO1997009455A1 (fr) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Composition de brasage |
JPH09153673A (ja) * | 1995-12-01 | 1997-06-10 | Matsushita Electric Ind Co Ltd | 電子部品のハンダ接続方法 |
CA2214130C (fr) * | 1996-09-19 | 2003-12-02 | Northern Telecom Limited | Ensembles de substrats et de composants electroniques |
-
1999
- 1999-08-12 FR FR9910449A patent/FR2797554B1/fr not_active Expired - Fee Related
-
2000
- 2000-08-09 KR KR1020017004550A patent/KR20010083902A/ko not_active Application Discontinuation
- 2000-08-09 JP JP2001517845A patent/JP2003507897A/ja not_active Withdrawn
- 2000-08-09 EP EP00958654A patent/EP1125480A1/fr not_active Withdrawn
- 2000-08-09 WO PCT/FR2000/002281 patent/WO2001013687A1/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2001013687A1 (fr) | 2001-02-22 |
JP2003507897A (ja) | 2003-02-25 |
EP1125480A1 (fr) | 2001-08-22 |
KR20010083902A (ko) | 2001-09-03 |
FR2797554A1 (fr) | 2001-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20060428 |