FR2786902B1 - Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication - Google Patents

Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication

Info

Publication number
FR2786902B1
FR2786902B1 FR9815374A FR9815374A FR2786902B1 FR 2786902 B1 FR2786902 B1 FR 2786902B1 FR 9815374 A FR9815374 A FR 9815374A FR 9815374 A FR9815374 A FR 9815374A FR 2786902 B1 FR2786902 B1 FR 2786902B1
Authority
FR
France
Prior art keywords
module
methods
chip card
making same
contactless electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9815374A
Other languages
English (en)
Other versions
FR2786902A1 (fr
Inventor
Ray Freeman
Jean Pierre Gloton
Laurent Chevillon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9815374A priority Critical patent/FR2786902B1/fr
Priority to AU12783/00A priority patent/AU1278300A/en
Priority to EP99956106A priority patent/EP1138017A1/fr
Priority to PCT/FR1999/002864 priority patent/WO2000034916A1/fr
Priority to CN99814106A priority patent/CN1329735A/zh
Publication of FR2786902A1 publication Critical patent/FR2786902A1/fr
Application granted granted Critical
Publication of FR2786902B1 publication Critical patent/FR2786902B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9815374A 1998-12-04 1998-12-04 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication Expired - Fee Related FR2786902B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9815374A FR2786902B1 (fr) 1998-12-04 1998-12-04 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
AU12783/00A AU1278300A (en) 1998-12-04 1999-11-22 Contactless electronic module, chip card comprising same, and methods for makingsame
EP99956106A EP1138017A1 (fr) 1998-12-04 1999-11-22 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
PCT/FR1999/002864 WO2000034916A1 (fr) 1998-12-04 1999-11-22 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
CN99814106A CN1329735A (zh) 1998-12-04 1999-11-22 无触点电子模块、带有该模块的芯片卡及制造该模块的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9815374A FR2786902B1 (fr) 1998-12-04 1998-12-04 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication

Publications (2)

Publication Number Publication Date
FR2786902A1 FR2786902A1 (fr) 2000-06-09
FR2786902B1 true FR2786902B1 (fr) 2001-01-26

Family

ID=9533625

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9815374A Expired - Fee Related FR2786902B1 (fr) 1998-12-04 1998-12-04 Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication

Country Status (5)

Country Link
EP (1) EP1138017A1 (fr)
CN (1) CN1329735A (fr)
AU (1) AU1278300A (fr)
FR (1) FR2786902B1 (fr)
WO (1) WO2000034916A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE302473T1 (de) 2000-01-19 2005-09-15 Fractus Sa Raumfüllende miniaturantenne
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
TW594588B (en) * 2001-06-13 2004-06-21 Nagracard Sa Detachable smart card on a pre-punched support
DE10139383B4 (de) * 2001-08-10 2006-06-01 Infineon Technologies Ag Chipmodul
EP1451893A1 (fr) 2001-12-10 2004-09-01 Fractus, S.A. Dispositif d'identification sans contact
AU2002340506A1 (en) 2002-11-07 2004-06-07 Fractus, S.A. Integrated circuit package including miniature antenna
CN1910598A (zh) 2004-01-23 2007-02-07 株式会社半导体能源研究所 膜状物品及其制作方法
WO2006008180A1 (fr) 2004-07-23 2006-01-26 Fractus S.A. Antenne dans un boitier a interaction electromagnetique reduite avec des elements integres sur la puce
WO2007147629A1 (fr) 2006-06-23 2007-12-27 Fractus, S.A. Module de puce, carte sim, dispositif sans fil et procédé de communication sans fil
US8738103B2 (en) 2006-07-18 2014-05-27 Fractus, S.A. Multiple-body-configuration multimedia and smartphone multifunction wireless devices
WO2011062272A1 (fr) * 2009-11-19 2011-05-26 株式会社フジクラ Dispositif d'antenne
JP5672067B2 (ja) 2010-03-09 2015-02-18 株式会社リコー 可逆性感熱記録媒体の製造方法及び製造装置、並びに可逆性感熱記録媒体
CN106104290B (zh) * 2014-01-29 2019-06-04 北京嘉岳同乐极电子有限公司 高灵敏磁传感器及其制作方法
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
FR3086099B1 (fr) * 2018-09-18 2022-12-16 Smart Packaging Solutions Procede de fabrication d'un module a carte et le module obtenu

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
SG59977A1 (en) * 1993-10-05 1999-02-22 Gemplus Card Int Fraud-proof electronic token and method of manufacture
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.

Also Published As

Publication number Publication date
AU1278300A (en) 2000-06-26
EP1138017A1 (fr) 2001-10-04
CN1329735A (zh) 2002-01-02
WO2000034916A1 (fr) 2000-06-15
FR2786902A1 (fr) 2000-06-09

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090831