FR2766051B1 - Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit - Google Patents

Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit

Info

Publication number
FR2766051B1
FR2766051B1 FR9708719A FR9708719A FR2766051B1 FR 2766051 B1 FR2766051 B1 FR 2766051B1 FR 9708719 A FR9708719 A FR 9708719A FR 9708719 A FR9708719 A FR 9708719A FR 2766051 B1 FR2766051 B1 FR 2766051B1
Authority
FR
France
Prior art keywords
dissipation
assembly
thermal energy
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9708719A
Other languages
English (en)
Other versions
FR2766051A1 (fr
Inventor
Alain Prolonge
Alain Dreyfus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9708719A priority Critical patent/FR2766051B1/fr
Publication of FR2766051A1 publication Critical patent/FR2766051A1/fr
Application granted granted Critical
Publication of FR2766051B1 publication Critical patent/FR2766051B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9708719A 1997-07-09 1997-07-09 Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit Expired - Lifetime FR2766051B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9708719A FR2766051B1 (fr) 1997-07-09 1997-07-09 Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9708719A FR2766051B1 (fr) 1997-07-09 1997-07-09 Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit

Publications (2)

Publication Number Publication Date
FR2766051A1 FR2766051A1 (fr) 1999-01-15
FR2766051B1 true FR2766051B1 (fr) 1999-10-15

Family

ID=9509048

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9708719A Expired - Lifetime FR2766051B1 (fr) 1997-07-09 1997-07-09 Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit

Country Status (1)

Country Link
FR (1) FR2766051B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20032131A1 (it) * 2003-11-05 2005-05-06 Sp El Srl Contenitore ad elevata capacita' di dissipazione per

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769768A (en) * 1980-10-20 1982-04-28 Fujitsu Ltd Equipping structure of electronic circuit unit containing high electric power parts
JP2906635B2 (ja) * 1990-10-15 1999-06-21 日本電気株式会社 混成集積回路装置
FR2706730B1 (fr) * 1993-06-18 1995-08-25 Sagem Module électronique de puissance ayant un support d'évacuation de la chaleur.
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures

Also Published As

Publication number Publication date
FR2766051A1 (fr) 1999-01-15

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