FR2766051B1 - ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT - Google Patents

ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT

Info

Publication number
FR2766051B1
FR2766051B1 FR9708719A FR9708719A FR2766051B1 FR 2766051 B1 FR2766051 B1 FR 2766051B1 FR 9708719 A FR9708719 A FR 9708719A FR 9708719 A FR9708719 A FR 9708719A FR 2766051 B1 FR2766051 B1 FR 2766051B1
Authority
FR
France
Prior art keywords
dissipation
assembly
thermal energy
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9708719A
Other languages
French (fr)
Other versions
FR2766051A1 (en
Inventor
Alain Prolonge
Alain Dreyfus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9708719A priority Critical patent/FR2766051B1/en
Publication of FR2766051A1 publication Critical patent/FR2766051A1/en
Application granted granted Critical
Publication of FR2766051B1 publication Critical patent/FR2766051B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9708719A 1997-07-09 1997-07-09 ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT Expired - Lifetime FR2766051B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9708719A FR2766051B1 (en) 1997-07-09 1997-07-09 ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9708719A FR2766051B1 (en) 1997-07-09 1997-07-09 ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT

Publications (2)

Publication Number Publication Date
FR2766051A1 FR2766051A1 (en) 1999-01-15
FR2766051B1 true FR2766051B1 (en) 1999-10-15

Family

ID=9509048

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9708719A Expired - Lifetime FR2766051B1 (en) 1997-07-09 1997-07-09 ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT

Country Status (1)

Country Link
FR (1) FR2766051B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20032131A1 (en) * 2003-11-05 2005-05-06 Sp El Srl CONTAINER WITH HIGH DISSIPATION CAPACITY FOR

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769768A (en) * 1980-10-20 1982-04-28 Fujitsu Ltd Equipping structure of electronic circuit unit containing high electric power parts
JP2906635B2 (en) * 1990-10-15 1999-06-21 日本電気株式会社 Hybrid integrated circuit device
FR2706730B1 (en) * 1993-06-18 1995-08-25 Sagem Electronic power module having a heat dissipation support.
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures

Also Published As

Publication number Publication date
FR2766051A1 (en) 1999-01-15

Similar Documents

Publication Publication Date Title
DE69807597D1 (en) Bicycle computer with cover
DE69823749D1 (en) Carburetor with multiple swirling devices
FR2760593B1 (en) ELECTRICAL ASSEMBLY WITH HIGH HEAT DISSIPATION
DE69501809T2 (en) Thermal printer
FR2771593B1 (en) THERMAL DISSIPATION DEVICE
FR2764114B1 (en) SEMICONDUCTOR DEVICE PROVIDED WITH A THERMAL DISSIPATOR
DE69502782D1 (en) Thermal printer
DE69514053D1 (en) Printed circuit board with bimetallic heat sink
DE59801493D1 (en) Subrack with cover plates
DE59801434D1 (en) Subrack with shielding plates
FR2766051B1 (en) ASSEMBLY OF A PRINTED CIRCUIT BOARD ASSOCIATED WITH MEANS OF DISSIPATION OF THE THERMAL ENERGY OF THE CIRCUIT
FR2761539B1 (en) STARTER ASSEMBLY WITH PRINTED CIRCUIT
DE69505089D1 (en) THERMAL PRINTER
DE69801055T2 (en) INSERTABLE ELECTRONIC ASSEMBLY WITH IMPROVED HEAT EXHAUST
DE59801492D1 (en) Subrack with cover plates
FR2777734B1 (en) ASSEMBLY OF A PRINTED CIRCUIT BOARD WITH POWER COMPONENTS AND A RADIATOR FOR THE BOARD
DE59605550D1 (en) Integrated circuit with thermal shutdown
FR2764051B1 (en) PLUG-IN MODULE FOR A COOKER WITH A VITROCERAMIC COOKING SURFACE
DE69718462D1 (en) Electronic device with improved heat sink arrangement
KR960012949U (en) Circuit board for power with excellent heat dissipation
FR2671260B1 (en) ELECTRIC PRINTED CIRCUIT SUPPORT WITH THERMAL DRAINAGE MEANS.
ID20867A (en) THE BIKE IS MOVED BY ELECTRICITY
KR970050765U (en) Computer desk with heat dissipation means
IT239455Y1 (en) HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS EQUIPPED WITH MODULAR STRUCTURE
KR930024972U (en) Electronic thermal rice cooker with demanding function

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20