FR2728726B1 - Composant electronique multipolaire, pouvant etre monte sur une surface - Google Patents
Composant electronique multipolaire, pouvant etre monte sur une surfaceInfo
- Publication number
- FR2728726B1 FR2728726B1 FR9515350A FR9515350A FR2728726B1 FR 2728726 B1 FR2728726 B1 FR 2728726B1 FR 9515350 A FR9515350 A FR 9515350A FR 9515350 A FR9515350 A FR 9515350A FR 2728726 B1 FR2728726 B1 FR 2728726B1
- Authority
- FR
- France
- Prior art keywords
- electronic component
- circuit board
- housing
- foil
- contact surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011888 foil Substances 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Multi-Conductor Connections (AREA)
- Led Device Packages (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Led Devices (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4446566A DE4446566A1 (de) | 1994-12-24 | 1994-12-24 | Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2728726A1 FR2728726A1 (fr) | 1996-06-28 |
FR2728726B1 true FR2728726B1 (fr) | 1998-03-13 |
Family
ID=6537096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9515350A Expired - Fee Related FR2728726B1 (fr) | 1994-12-24 | 1995-12-22 | Composant electronique multipolaire, pouvant etre monte sur une surface |
Country Status (7)
Country | Link |
---|---|
US (1) | US5706177A (fr) |
JP (1) | JPH08306501A (fr) |
DE (1) | DE4446566A1 (fr) |
FR (1) | FR2728726B1 (fr) |
GB (1) | GB2296602B (fr) |
IT (1) | IT1276178B1 (fr) |
TW (1) | TW365106B (fr) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59402033D1 (de) | 1993-09-30 | 1997-04-17 | Siemens Ag | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
WO1999007023A1 (fr) * | 1997-07-29 | 1999-02-11 | Osram Opto Semiconductors Gmbh & Co. Ohg | Composant optoelectronique |
GB9716705D0 (en) * | 1997-08-08 | 1997-10-15 | Arjo Ltd | Invalid hoists |
EP1089335A4 (fr) * | 1998-05-20 | 2002-02-06 | Rohm Co Ltd | Dispositif semi-conducteur |
JP3842444B2 (ja) | 1998-07-24 | 2006-11-08 | 富士通株式会社 | 半導体装置の製造方法 |
JP2000183407A (ja) * | 1998-12-16 | 2000-06-30 | Rohm Co Ltd | 光半導体装置 |
US6324066B1 (en) * | 1999-07-19 | 2001-11-27 | Motorola, Inc. | Surface mountable electronic device |
DE10019488B4 (de) * | 2000-04-19 | 2005-12-01 | Infineon Technologies Ag | Oberflächenmontierbares optoelektronisches Bauelement, einteiliger Zuschnitt zur Herstellung eines gehäusten oberflächenmontierbaren optoelektronischen Bauelementes und Gehäuse für oberflächenmontierbare optolektronische Schaltungen |
DE10019489B4 (de) * | 2000-04-19 | 2005-12-08 | Infineon Technologies Ag | Gehäuse für ein oberflächenmontierbares elektronisches Bauelement |
DE10024336A1 (de) * | 2000-05-17 | 2001-11-22 | Heidenhain Gmbh Dr Johannes | Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung |
DE10246786A1 (de) * | 2002-10-08 | 2004-04-22 | Ultrastar Limited | Gehäusekonstruktion einer LED für Oberflächenmontage sowie Verfahren zum Herstellen derselben |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
JP2005197318A (ja) * | 2003-12-26 | 2005-07-21 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
DE102004042145A1 (de) * | 2004-08-31 | 2006-03-02 | Infineon Technologies Ag | Chipmodul |
CN100397962C (zh) * | 2004-10-26 | 2008-06-25 | 赵建铭 | 半导体元件的封装体及其封装方法 |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US8669572B2 (en) * | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
EP1744373B1 (fr) * | 2005-07-13 | 2018-12-05 | CML Innovative Technologies | Dispositif de maintien et de connexion de composants optoélectroniques comme les LEDs du type PLCC2 et PLCC4 |
JP4739842B2 (ja) * | 2005-07-25 | 2011-08-03 | スタンレー電気株式会社 | 表面実装型led |
KR100632003B1 (ko) * | 2005-08-08 | 2006-10-09 | 삼성전기주식회사 | 열전달부에 오목부가 형성된 led 패키지 |
US9609711B2 (en) | 2014-09-28 | 2017-03-28 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
DE102006032416A1 (de) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) * | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
JP4922663B2 (ja) * | 2006-05-18 | 2012-04-25 | スタンレー電気株式会社 | 半導体光学装置 |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9711703B2 (en) * | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
JP2008198807A (ja) * | 2007-02-14 | 2008-08-28 | Nichia Corp | 半導体装置 |
JP4689637B2 (ja) * | 2007-03-23 | 2011-05-25 | シャープ株式会社 | 半導体発光装置 |
JP2008258530A (ja) * | 2007-04-09 | 2008-10-23 | Rohm Co Ltd | 半導体発光装置 |
CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
TWM337834U (en) * | 2007-12-10 | 2008-08-01 | Everlight Electronics Co Ltd | Package structure for light emitting diode |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
JP2010003743A (ja) * | 2008-06-18 | 2010-01-07 | Toshiba Corp | 発光装置 |
US9022632B2 (en) * | 2008-07-03 | 2015-05-05 | Samsung Electronics Co., Ltd. | LED package and a backlight unit unit comprising said LED package |
US8411451B2 (en) | 2008-07-30 | 2013-04-02 | Panasonic Corporation | Power line communication apparatus |
US10021742B2 (en) | 2014-09-28 | 2018-07-10 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8368112B2 (en) * | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
JP2010232210A (ja) * | 2009-03-25 | 2010-10-14 | Denso Corp | 発光ダイオードおよびその取付方法 |
JP5104793B2 (ja) * | 2009-03-25 | 2012-12-19 | 株式会社デンソー | Led光源ユニット |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US8598809B2 (en) * | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
EP2590236A1 (fr) * | 2011-11-07 | 2013-05-08 | Odelo GmbH | Diode lumineuse et moyen d'éclairage doté d'au moins deux diodes lumineuses comme sources de lumière |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
DE102012101463A1 (de) | 2012-02-23 | 2013-08-29 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes optoelektronisches Bauelement |
KR101908656B1 (ko) * | 2012-04-09 | 2018-10-16 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
US9689536B2 (en) | 2015-03-10 | 2017-06-27 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
US10514134B2 (en) | 2014-12-05 | 2019-12-24 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
US10047932B2 (en) * | 2015-04-02 | 2018-08-14 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube light with LED leadframes |
Family Cites Families (24)
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DE2458305C2 (de) * | 1974-12-10 | 1984-06-07 | Schurter AG, 6002 Luzern | Adapter zur Halterung einer Leuchtdiode auf einer gedruckten Schaltung |
US4478588A (en) * | 1978-03-06 | 1984-10-23 | Amp Incorporated | Light emitting diode assembly |
JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
WO1982002980A1 (fr) * | 1981-02-27 | 1982-09-02 | Inc Motorola | Module de haute intensite avec conducteurs a multi-niveaux |
US4574297A (en) * | 1981-07-15 | 1986-03-04 | Rohm Company Limited | Encapsulated semiconductor with terminals having tabs to increase solder wetting |
DE3412492A1 (de) * | 1984-04-03 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrischer kondensator als chip-bauelement |
FR2581827B1 (fr) * | 1985-05-10 | 1989-04-28 | Europ Composants Electron | Bande de connexion pour la fabrication de composants electriques a report direct et procede de fabrication de ces composants |
US4660127A (en) * | 1985-12-17 | 1987-04-21 | North American Philips Corporation | Fail-safe lead configuration for polar SMD components |
DE8609489U1 (de) * | 1986-04-08 | 1986-10-02 | Schurter GmbH, 79346 Endingen | Modulare Mehrfach-Leuchtdiodenfassung |
DE3811895A1 (de) * | 1987-05-09 | 1989-02-09 | Georg Sillner | Verfahren sowie vorrichtung zum umformen von zylindrischen elektrischen bauteilen |
US4890383A (en) * | 1988-01-15 | 1990-01-02 | Simens Corporate Research & Support, Inc. | Method for producing displays and modular components |
DE3813435A1 (de) * | 1988-04-21 | 1989-11-02 | Siemens Ag | Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper |
FR2634616B1 (fr) * | 1988-07-20 | 1995-08-25 | Matra | Procede de montage de micro-composants electroniques sur un support et produit realisable par le procede |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
US5262925A (en) * | 1991-10-15 | 1993-11-16 | Hewlett-Packard Company | Tab frame with area array edge contacts |
US5386342A (en) * | 1992-01-30 | 1995-01-31 | Lsi Logic Corporation | Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device |
DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
CA2092165C (fr) * | 1992-03-23 | 2001-05-15 | Tuyosi Nagano | Support intermediaire pour dispositif optique |
TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
JP3096169B2 (ja) * | 1992-09-11 | 2000-10-10 | 株式会社日立製作所 | 半導体装置 |
JP3187578B2 (ja) * | 1992-12-28 | 2001-07-11 | ローム株式会社 | パッケージ型固体電解コンデンサの構造 |
DE4311872C2 (de) * | 1993-04-10 | 1998-07-02 | Heraeus Gmbh W C | Leiterrahmen für integrierte Schaltungen |
JP3238803B2 (ja) * | 1993-08-24 | 2001-12-17 | ローム株式会社 | 面実装型有極性電子部品の基板実装構造 |
JPH07230934A (ja) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | 電子部品及びその基板実装構造 |
-
1994
- 1994-12-24 DE DE4446566A patent/DE4446566A1/de not_active Ceased
-
1995
- 1995-11-24 TW TW084112530A patent/TW365106B/zh active
- 1995-11-30 IT IT95MI002508A patent/IT1276178B1/it active IP Right Grant
- 1995-12-08 US US08/569,995 patent/US5706177A/en not_active Expired - Fee Related
- 1995-12-19 GB GB9525989A patent/GB2296602B/en not_active Expired - Fee Related
- 1995-12-21 JP JP35453095A patent/JPH08306501A/ja active Pending
- 1995-12-22 FR FR9515350A patent/FR2728726B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW365106B (en) | 1999-07-21 |
IT1276178B1 (it) | 1997-10-27 |
ITMI952508A0 (fr) | 1995-11-30 |
JPH08306501A (ja) | 1996-11-22 |
GB2296602A (en) | 1996-07-03 |
GB2296602B (en) | 1998-09-16 |
FR2728726A1 (fr) | 1996-06-28 |
US5706177A (en) | 1998-01-06 |
DE4446566A1 (de) | 1996-06-27 |
ITMI952508A1 (it) | 1997-05-30 |
GB9525989D0 (en) | 1996-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |