FR2706139A1 - Material for soldering - Google Patents

Material for soldering Download PDF

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Publication number
FR2706139A1
FR2706139A1 FR9306829A FR9306829A FR2706139A1 FR 2706139 A1 FR2706139 A1 FR 2706139A1 FR 9306829 A FR9306829 A FR 9306829A FR 9306829 A FR9306829 A FR 9306829A FR 2706139 A1 FR2706139 A1 FR 2706139A1
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France
Prior art keywords
substance
material according
grains
alloy
printed circuit
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Granted
Application number
FR9306829A
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French (fr)
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FR2706139B1 (en
Inventor
Val Christian
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Thales SA
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Thomson CSF SA
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Priority to FR9306829A priority Critical patent/FR2706139B1/en
Publication of FR2706139A1 publication Critical patent/FR2706139A1/en
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Publication of FR2706139B1 publication Critical patent/FR2706139B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0308—Shape memory alloy [SMA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The subject of the present invention is a material for soldering, such as a solder paste, for mounting electronic components on a printed circuit. The material is composed of tin/lead particles (21) and particles (22) of a material chosen especially for its coefficient of expansion and its elastic modulus, both sets of particles being bound together with a flux (23).

Description

MATERIAU POUR BRASURE
La présente invention a pour objet un matériau pour brasure, tel qu'une pâte à braser.BRAZING MATERIAL
The present invention relates to a material for brazing, such as a solder paste.

Dans le domaine du montage en surface de composants électroniques, ou de boîtiers contenant ces composants, sur des substrats de type circuit imprimé, il se pose le problème de la fiabilité des joints de brasure reliant ces composants au circuit imprimé. En effet, un joint de brasure assure, d'une part, une fonction de connexion électrique entre les plots de connexion du composant et les zones de connexion correspondantes du circuit imprimé, mais il a également pour fonction, d'autre part, d'assurer la fixation mécanique du composant sur le circuit imprimé. In the field of surface mounting of electronic components, or of boxes containing these components, on substrates of the printed circuit type, there is the problem of the reliability of the solder joints joining these components to the printed circuit. Indeed, a solder joint provides, on the one hand, an electrical connection function between the connection pads of the component and the corresponding connection areas of the printed circuit, but it also has the function, on the other hand, of ensure the mechanical fixing of the component on the printed circuit.

Ainsi qu'il est connu, des difficultés peuvent se présenter lors de variations de la température environnante, notamment lors des cycles de variation rapide de température auxquels sont soumis les circuits électroniques lors de leurs tests. En effet, d'une part, le matériau de brasure est choisi pour ses propriétés physiques et chimiques : il doit être métallurgiquement compatible avec le cuivre qui forme en général les plots de connexion, tant du composant que du circuit imprimé; il doit également correctement "mouiller" les surfaces à braser, c'est-à-dire avoir une bonne adhérence sur ces surfaces, et enfin il doit avoir une viscosité adaptée à l'utilisation qui en est faite. Les matériaux de brasure très généralement retenus sont à base d'étain-plomb. Par ailleurs, le circuit imprimé est en général soit en époxy soit en céramique (alumine, fréquemment) et les boîtiers sont soit en plastique, soit également en céramique. II apparaît que les coefficients de dilatation de ces trois éléments sont différents et, même dans le cas où circuit imprimé et boîtier sont en céramique, ces différences sont suffisantes pour faire apparaître des fissures dans le joint de brasure et permettre à la corrosion de s'installer dans les fissures, corrosion qui a de plus tendance à agrandir les fissures. L'ensemble du mécanisme peut conduire à la rupture du joint de brasure, avec ses conséquences dommageables tant sur le plan électrique que sur le plan mécanique.  As is known, difficulties may arise during variations in the surrounding temperature, in particular during rapid temperature variation cycles to which the electronic circuits are subjected during their tests. Indeed, on the one hand, the solder material is chosen for its physical and chemical properties: it must be metallurgically compatible with the copper which generally forms the connection pads, both of the component and of the printed circuit; it must also correctly "wet" the surfaces to be brazed, that is to say have good adhesion to these surfaces, and finally it must have a viscosity adapted to the use which is made of them. The solder materials generally used are based on tin-lead. In addition, the printed circuit is generally either in epoxy or ceramic (alumina, frequently) and the housings are either plastic, or also ceramic. It appears that the coefficients of expansion of these three elements are different and, even in the case where the printed circuit and case are made of ceramic, these differences are sufficient to cause cracks to appear in the solder joint and allow corrosion to occur. install in cracks, corrosion which tends to enlarge the cracks. The whole mechanism can lead to the rupture of the solder joint, with its damaging consequences both electrically and mechanically.

La présente invention a pour objet un matériau pour brasure qui permette d'éviter, ou au moins de fortement limiter, ce type de problème, en introduisant dans un matériau de brasure à base d'étain-plomb, des grains répartis d'une substance dont les propriétés physiques et chimiques et la proportion sont telles que:
ils amènent le coefficient de dilatation de l'ensemble à une valeur intermédiaire entre celle du composant et celle du circuit imprimé;
le module d'élasticité résultant soit suffisant pour absorber les différences d'allongement dues aux différences de coefficients de dilatation résiduelles;
leur température de fusion soit supérieure à celle de l'étainplomb,
et enfin que ces grains ne modifient pas substantiellement les propriétés métallurgiques et rhéologiques, notamment de mouillage et de viscosité, de la brasure.The subject of the present invention is a solder material which makes it possible to avoid, or at least greatly limit, this type of problem, by introducing into a solder material based on tin-lead, distributed grains of a substance. whose physical and chemical properties and proportion are such that:
they bring the coefficient of expansion of the assembly to an intermediate value between that of the component and that of the printed circuit;
the resulting elastic modulus is sufficient to absorb the differences in elongation due to the differences in residual expansion coefficients;
their melting point is higher than that of tin lead,
and finally that these grains do not substantially modify the metallurgical and rheological properties, in particular of wetting and viscosity, of the solder.

D'autres objets, particularités et résultats de l'invention ressortiront de la description suivante, donnée à titre d'exemple et illustrée par les dessins annexés, qui représentent:
- la figure la, le schéma d'un composant monté sur un substrat de circuit imprimé;
- la figure 1 b, un détail de la figure précédente;
- la figure 2, une vue en coupe du matériau selon l'invention.Other objects, features and results of the invention will emerge from the following description, given by way of example and illustrated by the appended drawings, which represent:
- Figure la, the diagram of a component mounted on a printed circuit substrate;
- Figure 1b, a detail of the previous figure;
- Figure 2, a sectional view of the material according to the invention.

Sur la figure la, on a donc représenté, vu en coupe, un substrat électriquement isolant Cl, du type circuit imprimé, par exemple en époxy ou en céramique, portant classiquement des zones conductrices pour la connexion des composants, interconnectées par des pistes également conductrices. Ces zones et pistes sont généralement réalisées par dépôt métallique, la plupart du temps en cuivre. In FIG. 1 a, an electrically insulating substrate C1, of the printed circuit type, for example made of epoxy or ceramic, is therefore shown, seen in section, conventionally carrying conductive zones for the connection of components, interconnected by equally conductive tracks. . These zones and tracks are generally made by metallic deposition, most of the time in copper.

Selon la technique dite de montage à plat, également appelée montage en surface, les composants ou microcircuits électroniques, disposés ou non sous boîtier et symbolisés sur la figure la par un rectangle
C, sont à la fois fixés mécaniquement au substrat et reliés électriquement aux zones de connexion prévues à cet effet sur le substrat, directement à l'aide d'un joint de brasure J et non par des broches ou pattes de connexion.According to the so-called flat mounting technique, also called surface mounting, the electronic components or microcircuits, whether or not placed in a housing and symbolized in FIG. 1 a by a rectangle
C, are both mechanically fixed to the substrate and electrically connected to the connection zones provided for this purpose on the substrate, directly using a solder joint J and not by pins or connection lugs.

La figure lb représente un agrandissement de la partie A de la figure la, contenant un joint de brasure J. Figure lb shows an enlargement of part A of Figure la, containing a solder joint J.

Sur cette figure, on a représenté, vues en coupe, une fraction du circuit imprimé Cl, une fraction du composant C et la forme qu'affecte en général le joint J, s'étendant sous le composant et remontant légèrement le long de sa face latérale. In this figure, there is shown, in section, a fraction of the printed circuit Cl, a fraction of the component C and the shape that generally affects the seal J, extending under the component and rising slightly along its face. lateral.

Ainsi qu'il a été expliqué ci-dessus, le choix du matériau de brasure est fait en fonction de ses propriétés physico-chimiques, notamment de compatibilité avec le cuivre, de mouillage et de viscosité, et conduit à retenir un alliage d'étain-plomb, avec en général quelques pour-cents d'argent, qui a un coefficient de dilatation différent de celui des matériaux formant habituellement le composant, son boîtier ou le circuit imprime. As explained above, the choice of brazing material is made according to its physicochemical properties, in particular compatibility with copper, wetting and viscosity, and results in retaining a tin alloy -lead, with generally a few percent of silver, which has a coefficient of expansion different from that of the materials usually forming the component, its casing or the printed circuit.

On voit que, lors de variations de température, le joint J est soumis à des contraintes mécaniques tant selon un axe Ox, parallèle au plan du circuit imprimé Cl, que selon un axe Oz, perpendiculaire à ce dernier plan. It can be seen that, during temperature variations, the seal J is subjected to mechanical stresses both along an axis Ox, parallel to the plane of the printed circuit Cl, and along an axis Oz, perpendicular to this latter plane.

La figure 2 représente une coupe faite dans une pâte à braser selon l'invention. FIG. 2 represents a section made in a solder paste according to the invention.

Une pâte à braser est habituellement constituée par des grains 21 d'un alliage d'étain-plomb, éventuellement additionné d'argent, sensiblement sphériques (d'un diamètre de l'ordre de quelques dizaines de micromètres), liés par un matériau 23 appelé flux, de sorte à constituer une pâte. A solder paste is usually made up of grains 21 of a tin-lead alloy, possibly with the addition of silver, substantially spherical (with a diameter of the order of a few tens of micrometers), linked by a material 23 called flux, so as to constitute a paste.

Selon l'invention, on ajoute à cette pâte des grains 22 d'une substance choisie selon les critères suivants:
son coefficient de dilatation doit être tel que, en fonction de la proportion de grains 22 par rapport aux grains 21, elle amène le coefficient de dilatation de l'ensemble de la pâte à une valeur intermédiaire entre celle du composant C et celle du circuit imprimé Cl;
son module d'élasticité doit être tel que, toujours en fonction de la proportion des grains 22, elle amène le module d'élasticité de l'ensemble de la pâte à une valeur suffisante pour absorber (sans formation de fissures) les différences d'allongement qui se produisent lors de variations de température, différences d'allongement dues aux différences résiduelles dans les valeurs des coefficients de dilatation;
sa température de fusion doit être supérieure à celle de l'alliage d'étain-plomb(- argent), afin de ne pas perturber les propriétés de la brasure et d'éviter toute modification des machines à braser et processus existants;
plus généralement, la substance des grains 22 et la proportion des grains doivent être tels qu'ils ne modifient pas substantiellement les propriétés métallurgiques et rhéologiques, notamment mouillage et viscosité de la brasure. En particulier la substance 22 ne doit de préférence pas se dissoudre dans ltétain-plomb, ni interagir chimiquement ou métallurgique- ment avec l'étain-plomb.According to the invention, grains 22 of a substance chosen according to the following criteria are added to this paste:
its coefficient of expansion must be such that, as a function of the proportion of grains 22 relative to grains 21, it brings the coefficient of expansion of the whole of the dough to an intermediate value between that of component C and that of the printed circuit Cl;
its modulus of elasticity must be such that, always as a function of the proportion of the grains 22, it brings the modulus of elasticity of the whole of the dough to a value sufficient to absorb (without the formation of cracks) the differences in elongation that occurs during temperature variations, differences in elongation due to residual differences in the values of the expansion coefficients;
its melting temperature must be higher than that of the tin-lead alloy (- silver), in order not to disturb the properties of the solder and to avoid any modification of the brazing machines and existing processes;
more generally, the substance of the grains 22 and the proportion of the grains must be such that they do not substantially modify the metallurgical and rheological properties, in particular wetting and viscosity of the solder. In particular, substance 22 should preferably not dissolve in tin-lead, nor interact chemically or metallurgically with tin-lead.

A titre d'exemple, les grains 22 peuvent être constitués par du métal, par exemple nickel ou graphite recouvert de nickel ou du plastique ou plastique recouvert d'un film métallique, nickel par exemple, ou encore par un alliage à mémoire de forme, par exemple un alliage cuivre-zincaluminium, les alliages à mémoire de forme présentant en général une très grande élasticité. By way of example, the grains 22 may consist of metal, for example nickel or graphite covered with nickel or plastic or plastic covered with a metallic film, nickel for example, or also by a shape memory alloy, for example a copper-zincaluminium alloy, the shape memory alloys generally having a very high elasticity.

A titre d'exemple, pour des grains 22 en nickel de diamètre de l'ordre de 40pm, la limite élastique exprimée en Pascals, de l'alliage classique SnPbAg (63-36-2) est notablement amélioré, d'environ 50% pour une proportion de 10% de grains de nickel. Toujours à titre d'exemple, dans le cas de grains en alliage à mémoire de forme (Cu-Zn-Al), la limite de l'alliage SnPbAg précédent passe, à 20"C, de 56 MPa à 140 MPa, tandis que le module d'élasticité passe de 43 GPa à 78 GPa. For example, for 22 nickel grains with a diameter of around 40 μm, the elastic limit expressed in Pascals, of the conventional SnPbAg alloy (63-36-2) is notably improved, by around 50%. for a proportion of 10% of nickel grains. Still by way of example, in the case of grains of shape memory alloy (Cu-Zn-Al), the limit of the preceding SnPbAg alloy passes, at 20 "C, from 56 MPa to 140 MPa, while the modulus of elasticity goes from 43 GPa to 78 GPa.

L'invention a été décrite ci-dessus dans le cadre du montage en surface des composants, domaine où elle est particulièrement avantageuse. The invention has been described above in the context of the surface mounting of the components, an area where it is particularly advantageous.

Toutefois, elle s'applique également au cas où les composants sont montés sur le circuit imprimé par l'intermédiaire de pattes. En effet, ce cas également conduit à des problèmes de fiabilité car l'élasticité des pattes peut ne pas compenser totalement la désadaptation mécanique entre boîtier et circuit imprimé. However, it also applies to the case where the components are mounted on the printed circuit by means of lugs. In fact, this case also leads to reliability problems because the elasticity of the tabs may not completely compensate for the mechanical mismatch between the housing and the printed circuit.

Claims (8)

REVENDICATIONS 1. Matériau pour brasure, destiné à former un joint de brasure entre un composant électronique (C) et un substrat de circuit imprimé (Cl), comportant des grains (21) d'un alliage à base d'étain-plomb liés par un flux (23), le matériau étant caractérisé par le fait qu'il comporte en outre des grains (22) une substance dont les propriétés physico-chimiques et la proportion sont telles que: 1. Solder material, intended to form a solder joint between an electronic component (C) and a printed circuit substrate (Cl), comprising grains (21) of a tin-lead alloy bonded by a flux (23), the material being characterized by the fact that it also comprises grains (22) a substance whose physicochemical properties and the proportion are such that: le coefficient de dilatation du matériau soit amené à une valeur intermédiaire entre celle du composant et celle du substrat  the coefficient of expansion of the material is brought to an intermediate value between that of the component and that of the substrate le module d'élasticité du matériau soit suffisant pour absorber les différences d'allongement susceptibles de se produire lors de variations de température; the modulus of elasticity of the material is sufficient to absorb the differences in elongation likely to occur during temperature variations; la température de fusion de la substance soit supérieure à celle de l'alliage; the melting point of the substance is higher than that of the alloy; telle ne modifie pas substantiellement les propriétés métallurgiques et rhéologiques du matériau. such does not substantially modify the metallurgical and rheological properties of the material. 2. Matériau selon la revendication 1, caractérisé par le fait que la substance est un métal ou un alliage métallique. 2. Material according to claim 1, characterized in that the substance is a metal or a metal alloy. 3. Matériau selon la revendication 1, caractérisé par le fait que la substance est du nickel. 3. Material according to claim 1, characterized in that the substance is nickel. 4. Matériau selon la revendication 1, caractérisé par le fait que les grains sont formés de graphite recouvert de nickel. 4. Material according to claim 1, characterized in that the grains are formed of graphite coated with nickel. 5. Matériau selon la revendication 1, caractérisé par le fait que la substance est une matière plastique. 5. Material according to claim 1, characterized in that the substance is a plastic. 6. Matériau selon la revendication 5, caractérisé par le fait que les grains de plastique sont recouverts d'un film métallique. 6. Material according to claim 5, characterized in that the plastic grains are covered with a metallic film. 7. Matériau selon la revendication 1, caractérisé par le fait que la substance est un alliage à mémoire de forme.  7. Material according to claim 1, characterized in that the substance is a shape memory alloy. 8. Matériau selon la revendication 7, caractérisé par le fait que l'alliage comporte du Cuivre, du Zinc et de l'Aluminium.  8. Material according to claim 7, characterized in that the alloy comprises copper, zinc and aluminum.
FR9306829A 1993-06-08 1993-06-08 Solder material. Expired - Fee Related FR2706139B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9306829A FR2706139B1 (en) 1993-06-08 1993-06-08 Solder material.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9306829A FR2706139B1 (en) 1993-06-08 1993-06-08 Solder material.

Publications (2)

Publication Number Publication Date
FR2706139A1 true FR2706139A1 (en) 1994-12-16
FR2706139B1 FR2706139B1 (en) 1995-07-21

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FR9306829A Expired - Fee Related FR2706139B1 (en) 1993-06-08 1993-06-08 Solder material.

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996019314A1 (en) * 1994-12-22 1996-06-27 Siemens Aktiengesellschaft Solder and its use for making a soldered joint between two objects
EP0753990A1 (en) * 1995-07-13 1997-01-15 Thomson-Csf Connection device and process
FR2772657A1 (en) * 1997-12-23 1999-06-25 Thomson Csf Brazing paste useful for mounting miniature electronic components on printed circuits
EP0937536A1 (en) * 1998-02-18 1999-08-25 Ngk Insulators, Ltd. Adhesive composition for bonding different kinds of members
WO2002020211A1 (en) * 2000-09-07 2002-03-14 Infineon Techonologies Ag Soldering flux for use in diffusion soldering process and method for producing soldered connections using said soldering flux
EP1250032A1 (en) * 2001-04-11 2002-10-16 Hitachi, Ltd. Electronic device using Zn-Al-Ge-Mg alloy solder having Al or Cu particles
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting
CN112309715A (en) * 2019-07-31 2021-02-02 株式会社村田制作所 Chip-type electronic component, electronic component mounting structure, and assembly

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FR1501290A (en) * 1965-11-22 1967-11-10 Nibco Soft solder penetrant joints for joining copper pipes and fittings, particularly in plumbing, processes and materials to perform them
FR2188307A1 (en) * 1972-06-13 1974-01-18 Licentia Gmbh
EP0164906A1 (en) * 1984-05-14 1985-12-18 RAYCHEM CORPORATION (a Delaware corporation) Solder composition
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4731130A (en) * 1987-05-27 1988-03-15 Gte Government Systems Corporation Soldering composition
US4740252A (en) * 1986-01-31 1988-04-26 Senju Metal Industry Co., Ltd. Solder paste for electronic parts

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
FR1501290A (en) * 1965-11-22 1967-11-10 Nibco Soft solder penetrant joints for joining copper pipes and fittings, particularly in plumbing, processes and materials to perform them
FR2188307A1 (en) * 1972-06-13 1974-01-18 Licentia Gmbh
EP0164906A1 (en) * 1984-05-14 1985-12-18 RAYCHEM CORPORATION (a Delaware corporation) Solder composition
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4740252A (en) * 1986-01-31 1988-04-26 Senju Metal Industry Co., Ltd. Solder paste for electronic parts
US4731130A (en) * 1987-05-27 1988-03-15 Gte Government Systems Corporation Soldering composition

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996019314A1 (en) * 1994-12-22 1996-06-27 Siemens Aktiengesellschaft Solder and its use for making a soldered joint between two objects
EP0753990A1 (en) * 1995-07-13 1997-01-15 Thomson-Csf Connection device and process
FR2736569A1 (en) * 1995-07-13 1997-01-17 Thomson Csf CONNECTING DEVICE AND CONNECTING METHOD
US6383305B1 (en) * 1997-12-23 2002-05-07 Thomson-Csf Method for the making soldering flux and resulting weld joint
FR2772657A1 (en) * 1997-12-23 1999-06-25 Thomson Csf Brazing paste useful for mounting miniature electronic components on printed circuits
WO1999033604A1 (en) * 1997-12-23 1999-07-08 Thomson-Csf Method for making soldering flux and resulting weld joint
US6390354B1 (en) 1998-02-18 2002-05-21 Ngk Insulators, Ltd. Adhesive composition for bonding different kinds of members
EP0937536A1 (en) * 1998-02-18 1999-08-25 Ngk Insulators, Ltd. Adhesive composition for bonding different kinds of members
US6742700B2 (en) 1998-02-18 2004-06-01 Ngk Insulators, Ltd. Adhesive composition for bonding different kinds of members
WO2002020211A1 (en) * 2000-09-07 2002-03-14 Infineon Techonologies Ag Soldering flux for use in diffusion soldering process and method for producing soldered connections using said soldering flux
US6872464B2 (en) 2000-09-07 2005-03-29 Infineon Technologies Ag Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
EP1250032A1 (en) * 2001-04-11 2002-10-16 Hitachi, Ltd. Electronic device using Zn-Al-Ge-Mg alloy solder having Al or Cu particles
US6563225B2 (en) 2001-04-11 2003-05-13 Hitachi, Ltd. Product using Zn-Al alloy solder
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting
CN112309715A (en) * 2019-07-31 2021-02-02 株式会社村田制作所 Chip-type electronic component, electronic component mounting structure, and assembly
US11348733B2 (en) 2019-07-31 2022-05-31 Murata Manufacturing Co., Ltd. Chip electronic component, electronic component mounting structure and electronic component assembly

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