FR2700659B1 - Procédé de fabrication de circuits multicouches er circuits ainsi obtenus. - Google Patents
Procédé de fabrication de circuits multicouches er circuits ainsi obtenus.Info
- Publication number
- FR2700659B1 FR2700659B1 FR9300400A FR9300400A FR2700659B1 FR 2700659 B1 FR2700659 B1 FR 2700659B1 FR 9300400 A FR9300400 A FR 9300400A FR 9300400 A FR9300400 A FR 9300400A FR 2700659 B1 FR2700659 B1 FR 2700659B1
- Authority
- FR
- France
- Prior art keywords
- circuits
- manufacturing multilayer
- manufacturing
- multilayer circuits
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9300400A FR2700659B1 (fr) | 1993-01-18 | 1993-01-18 | Procédé de fabrication de circuits multicouches er circuits ainsi obtenus. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9300400A FR2700659B1 (fr) | 1993-01-18 | 1993-01-18 | Procédé de fabrication de circuits multicouches er circuits ainsi obtenus. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2700659A1 FR2700659A1 (fr) | 1994-07-22 |
FR2700659B1 true FR2700659B1 (fr) | 1995-03-24 |
Family
ID=9443105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9300400A Expired - Fee Related FR2700659B1 (fr) | 1993-01-18 | 1993-01-18 | Procédé de fabrication de circuits multicouches er circuits ainsi obtenus. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2700659B1 (fr) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4221047A (en) * | 1979-03-23 | 1980-09-09 | International Business Machines Corporation | Multilayered glass-ceramic substrate for mounting of semiconductor device |
JPH0640472B2 (ja) * | 1985-10-17 | 1994-05-25 | 伊勢電子工業株式会社 | 蛍光表示管用基板の製造方法 |
US4808274A (en) * | 1986-09-10 | 1989-02-28 | Engelhard Corporation | Metallized substrates and process for producing |
DE3932017A1 (de) * | 1988-10-27 | 1990-05-03 | Bayer Ag | Elektrisch leitende strukturen |
GB8909729D0 (en) * | 1989-04-27 | 1990-04-25 | Ici Plc | Compositions |
FR2666686A1 (fr) * | 1990-09-10 | 1992-03-13 | Ramy Jean Pierre | Procede de fabrication d'un circuit hybride multicouche utilisant des composes organometalliques. |
-
1993
- 1993-01-18 FR FR9300400A patent/FR2700659B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2700659A1 (fr) | 1994-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |