FR2696870A1 - Layered circuit comprising at least one power resistor. - Google Patents

Layered circuit comprising at least one power resistor. Download PDF

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Publication number
FR2696870A1
FR2696870A1 FR9312002A FR9312002A FR2696870A1 FR 2696870 A1 FR2696870 A1 FR 2696870A1 FR 9312002 A FR9312002 A FR 9312002A FR 9312002 A FR9312002 A FR 9312002A FR 2696870 A1 FR2696870 A1 FR 2696870A1
Authority
FR
France
Prior art keywords
ceramic support
power resistor
layered circuit
power
layered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9312002A
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French (fr)
Other versions
FR2696870B1 (en
Inventor
Ruckert Reinhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Telefunken Microelectronic GmbH filed Critical Temic Telefunken Microelectronic GmbH
Publication of FR2696870A1 publication Critical patent/FR2696870A1/en
Application granted granted Critical
Publication of FR2696870B1 publication Critical patent/FR2696870B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Resistors (AREA)

Abstract

L'invention concerne un circuit à couches comprenant au moins une résistance de puissance, qui est agencée sur un support en céramique relié à un corps de refroidissement. Un autre support en céramique est agencé sur le circuit à couches et en contact thermo-conducteur avec la résistance de puissance.The invention relates to a layered circuit comprising at least one power resistor, which is arranged on a ceramic support connected to a cooling body. Another ceramic support is arranged on the layered circuit and in thermally conductive contact with the power resistor.

Description

1 26968701 2696870

DescriptionDescription

Circuit à couches comprenant au moins une résistance de puissance Pour des agencements de circuits dans la technologie des couches, c'est-à- dire ce qu'il est convenu d'appeler des circuits à couches, on utilise des résistances de puissance en vue de dissiper la chaleur résultante, ces résistances de puissance évacuant la chaleur au moyen d'un support en céramique (substrat) sur un corps de refroidissement; ici le circuit à couches est relié au support en céramique au moyen d'une colle bonne thermo-conductrice, de même que le support en céramique avec le corps de refroidissement. Lors d'une importante dissipation de chaleur, le substrat de céramique situé au-dessous de la résistance de puissance est "stressé", c'est-à-dire qu'il peut en résulter des détériorations du substrat (par exemple des fissures) Afin d'éviter de telles détériorations et de garantir une bonne évacuation de la chaleur, on peut réaliser la résistance de puissance avec une très grande surface; cependant, ceci n'est la plupart du temps pas réalisable en raison  Layered circuit comprising at least one power resistor For circuit arrangements in layer technology, that is to say what is known as layered circuits, power resistors are used in view dissipating the resulting heat, these power resistors dissipating the heat by means of a ceramic support (substrate) on a cooling body; here the layered circuit is connected to the ceramic support by means of a good heat-conductive adhesive, as is the ceramic support with the cooling body. During significant heat dissipation, the ceramic substrate below the power resistor is "stressed", that is to say that it may result in deterioration of the substrate (for example cracks) In order to avoid such deterioration and to guarantee good heat dissipation, the power resistor can be made with a very large surface; however, this is mostly not achievable due to

du besoin de place des autres composants du circuit à couches.  the space requirement of the other components of the layered circuit.

L'objectif sous-jacent à 1 ' invention est de réaliser un circuit à couches avec des propriétés améliorées, notamment une évacuation améliorée de la  The objective underlying the invention is to provide a layered circuit with improved properties, in particular an improved evacuation of the

chaleur.heat.

Cet objectif est atteint conformément à l'invention grâce aux  This objective is achieved in accordance with the invention thanks to the

caractéristiques de la partie caractérisante de la revendication 1.  characteristics of the characterizing part of claim 1.

Des développements avantageux de 1 ' invention ressortent des  Advantageous developments of the invention emerge from the

revendications dépendantes.dependent claims.

Grâce à l'autre support en céramique sur la face supérieure du circuit à couches dans la région de la résistance de puissance, on améliore d'une part la solidité mécanique de l'agencement de circuit (rigidification) et on rend  Thanks to the other ceramic support on the upper face of the layer circuit in the region of the power resistance, the mechanical strength of the circuit arrangement is improved on the one hand (stiffening) and

2 26968702 2696870

ainsi possible une structure compacte, et d'autre part la chaleur de la résistance de puissance est uniformément répartie sur une surface importante (répartition de la chaleur) Dans 1 ' agencement "sandwich" ici proposé (on peut encore prévoir en option un autre corps de 5 refroidissement sur le second support en céramique) il est possible d'évacuer la chaleur sur les deux côtés, grâce à quoi la puissance de perte  thus possible a compact structure, and on the other hand the heat of the power resistor is uniformly distributed over a large surface (heat distribution) In the "sandwich" arrangement here proposed (we can also optionally provide another body cooling on the second ceramic support) it is possible to dissipate the heat on both sides, whereby the power loss

admissible pour une résistance de puissance avec une surface de base prédéterminée peut être nettement augmentée.  permissible for a power resistance with a predetermined base area can be significantly increased.

L'autre support en céramique peut être du même matériau que le premier support en céramique, mais cependant réalisé de préférence plus épais en vue d'une meilleure accumulation-tampon de la chaleur et avec une surface plus importante que la résistance de puissance en vue d'améliorer la solidité mécanique et la répartition de la chaleur Le second support en céramique15 est de préférence monté au moyen d'une colle électriquement isolante mais  The other ceramic support may be of the same material as the first ceramic support, but preferably made thicker for better heat buffer accumulation and with a larger surface area than the power resistance in view. improve the mechanical strength and the heat distribution The second ceramic support15 is preferably mounted using an electrically insulating adhesive but

bonne thermo-conductrice sur la surface du circuit à couches.  good thermal conductor on the surface of the layered circuit.

En outre, l'invention sera expliquée plus en détails en se rapportant au  In addition, the invention will be explained in more detail with reference to

mode de réalisation illustré à la figure.  embodiment illustrated in the figure.

La figure montre en tant que circuit à couches 1 un circuit hacheur pour changeur de fréquence avec différents composants en technologie des couches ainsi qu'une résistance de puissance 2 ayant une superficie de 374 m ( 22 mm x 17 mm); le circuit à couches 1 est disposé sur un support en céramique 3 en A 1203 qui est relié à un corps de refroidissement 4 lequel sert simultanément de plaque de base de montage La liaison du circuit à couches 1 avec le support en céramique 3 et celle du support en céramique 3 avec le corps de refroidissement 4 s'effectue par l'intermédiaire d'une  The figure shows as a layer circuit 1 a chopper circuit for frequency changer with different components in layer technology as well as a power resistor 2 having an area of 374 m (22 mm x 17 mm); the layer circuit 1 is arranged on a ceramic support 3 in A 1203 which is connected to a cooling body 4 which simultaneously serves as a mounting base plate The connection of the layer circuit 1 with the ceramic support 3 and that of the ceramic support 3 with the cooling body 4 is effected by means of a

colle bonne thermo-conductrice 6, 7.  good heat-conductive glue 6, 7.

Sur la résistance de puissance 2 est agencé un second support en céramique qui a une surface de par exemple 644 mm 2 et a ainsi pratiquement le double de la surface de la résistance de puissance 2 (superficie 374 mm 2) Le second support en céramique 5 a une épaisseur de par exemple 1 mm et  On the power resistor 2 is arranged a second ceramic support which has an area of for example 644 mm 2 and thus almost twice the area of the power resistor 2 (area 374 mm 2) The second ceramic support 5 has a thickness of for example 1 mm and

3 26968703 2696870

est ainsi plus épais que le premier support en céramique 3 (épaisseur 0, 63 mm). Grâce à l'agencement proposé, on peut réaliser une évacuation de puissance de par exemple 150 W au moyen de la résistance de puissance; celle-ci est supérieure de plus de 30 % par rapport à des circuits à couches conventionnels pour une même surface de base de la résistance de puissance.  is thus thicker than the first ceramic support 3 (thickness 0.63 mm). Thanks to the proposed arrangement, it is possible to carry out a power evacuation of for example 150 W by means of the power resistor; this is more than 30% higher compared to conventional layered circuits for the same base surface of the power resistor.

4 26968704 2696870

Claims (4)

RevendicationsClaims 1 Circuit à couches ( 1) comprenant au moins une résistance de puissance ( 2), le circuit à couches ( 1) étant agencé sur un support en céramique ( 3) relié à un corps de refroidissement ( 4), caractérisé en ce qu'un autre support en céramique ( 5) est agencé sur le circuit à couches ( 1) en contact  1 layer circuit (1) comprising at least one power resistor (2), the layer circuit (1) being arranged on a ceramic support (3) connected to a cooling body (4), characterized in that another ceramic support (5) is arranged on the layered circuit (1) in contact thermo-conducteur avec la résistance de puissance ( 2).  thermally conductive with power resistor (2). 2 Circuit à couches selon revendication 1, caractérisé en ce que l'autre support en céramique ( 5) est relié à la résistance de puissance  2 layered circuit according to claim 1, characterized in that the other ceramic support (5) is connected to the power resistor ( 2) au moyen d'une colle ( 6) thermo-conductrice.  (2) by means of a heat-conducting adhesive (6). 3 Circuit à couches selon l'une ou l'autre des revendications 1 et 2,  3 layered circuit according to either of claims 1 and 2, caractérisé en ce que l'autre support en céramique ( 5) présente une surface  characterized in that the other ceramic support (5) has a surface plus importante que la résistance de puissance ( 2).  more important than the power resistance (2). 4 Circuit à couches selon l'une quelconque des revendications 1 à 3,  4 layered circuit according to any one of claims 1 to 3, caractérisé en ce que l'autre support en céramique ( 5) est au moins aussi  characterized in that the other ceramic support (5) is at least also épais que le premier support en céramique ( 3).  thicker than the first ceramic support (3). Circuit à couches selon l'une quelconque des revendications 1 à 4,  Layer circuit according to any one of claims 1 to 4, caractérisé en ce qu'un autre corps de refroidissement ( 8)est agencé sur  characterized in that another cooling body (8) is arranged on l'autre support en céramique ( 5).the other ceramic support (5).
FR9312002A 1992-10-09 1993-10-08 Layered circuit comprising at least one power resistor. Expired - Fee Related FR2696870B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924234022 DE4234022C2 (en) 1992-10-09 1992-10-09 Layer circuit with at least one power resistor

Publications (2)

Publication Number Publication Date
FR2696870A1 true FR2696870A1 (en) 1994-04-15
FR2696870B1 FR2696870B1 (en) 1995-05-24

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Family Applications (1)

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FR9312002A Expired - Fee Related FR2696870B1 (en) 1992-10-09 1993-10-08 Layered circuit comprising at least one power resistor.

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AT (1) ATA202193A (en)
DE (1) DE4234022C2 (en)
FR (1) FR2696870B1 (en)

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DE9319473U1 (en) * 1993-12-17 1994-06-23 Siemens AG, 80333 München Hybrid circuit arrangement
DE19505180A1 (en) * 1995-02-16 1996-08-22 Telefunken Microelectron Electronic control module
DE19519776A1 (en) * 1995-05-30 1997-02-13 Siemens Ag Method of manufacturing a printed circuit board and printed circuit board
DE19528632A1 (en) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Control unit consisting of at least two housing parts
JPH09116061A (en) * 1995-10-13 1997-05-02 Mitsubishi Materials Corp Electronic component cooling device
US7102484B2 (en) * 2003-05-20 2006-09-05 Vishay Dale Electronics, Inc. High power resistor having an improved operating temperature range
CN103680779B (en) * 2013-11-04 2016-04-06 西安电子工程研究所 A kind of high pressure resistant high power solid state current-limiting resistance

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GB2024515A (en) * 1978-06-30 1980-01-09 Mitsubishi Electric Corp Semiconductor voltage regulator

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Also Published As

Publication number Publication date
ATA202193A (en) 1998-10-15
FR2696870B1 (en) 1995-05-24
DE4234022A1 (en) 1994-04-14
DE4234022C2 (en) 1995-05-24

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