FR2649831B1 - Dispositif soi-mos presentant une structure de paroi laterale conductrice et procede pour sa fabrication - Google Patents

Dispositif soi-mos presentant une structure de paroi laterale conductrice et procede pour sa fabrication

Info

Publication number
FR2649831B1
FR2649831B1 FR909008962A FR9008962A FR2649831B1 FR 2649831 B1 FR2649831 B1 FR 2649831B1 FR 909008962 A FR909008962 A FR 909008962A FR 9008962 A FR9008962 A FR 9008962A FR 2649831 B1 FR2649831 B1 FR 2649831B1
Authority
FR
France
Prior art keywords
soi
production
side wall
wall structure
mos device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR909008962A
Other languages
English (en)
Other versions
FR2649831A1 (fr
Inventor
Tadashi Nishimura
Tsuyoshi Yamano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13300190A external-priority patent/JPH03129777A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2649831A1 publication Critical patent/FR2649831A1/fr
Application granted granted Critical
Publication of FR2649831B1 publication Critical patent/FR2649831B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78609Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903FET configuration adapted for use as static memory cell

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
FR909008962A 1989-07-13 1990-07-13 Dispositif soi-mos presentant une structure de paroi laterale conductrice et procede pour sa fabrication Expired - Fee Related FR2649831B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18095289 1989-07-13
JP13300190A JPH03129777A (ja) 1989-07-13 1990-05-23 電界効果型トランジスタを備えた半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
FR2649831A1 FR2649831A1 (fr) 1991-01-18
FR2649831B1 true FR2649831B1 (fr) 1992-02-07

Family

ID=26467446

Family Applications (1)

Application Number Title Priority Date Filing Date
FR909008962A Expired - Fee Related FR2649831B1 (fr) 1989-07-13 1990-07-13 Dispositif soi-mos presentant une structure de paroi laterale conductrice et procede pour sa fabrication

Country Status (2)

Country Link
US (1) US5060035A (fr)
FR (1) FR2649831B1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5449953A (en) * 1990-09-14 1995-09-12 Westinghouse Electric Corporation Monolithic microwave integrated circuit on high resistivity silicon
JP2635831B2 (ja) * 1991-01-28 1997-07-30 株式会社東芝 半導体装置
US5434441A (en) * 1992-01-31 1995-07-18 Canon Kabushiki Kaisha Silicon-on-insulator CMOS device and a liquid crystal display with controlled base insulator thickness
JP3191061B2 (ja) * 1992-01-31 2001-07-23 キヤノン株式会社 半導体装置及び液晶表示装置
US5331116A (en) * 1992-04-30 1994-07-19 Sgs-Thomson Microelectronics, Inc. Structure and method for forming contact structures in integrated circuits
US5445107A (en) * 1993-11-22 1995-08-29 Motorola, Inc. Semiconductor device and method of formation
US5448513A (en) * 1993-12-02 1995-09-05 Regents Of The University Of California Capacitorless DRAM device on silicon-on-insulator substrate
JPH08125034A (ja) * 1993-12-03 1996-05-17 Mitsubishi Electric Corp 半導体記憶装置
US6232649B1 (en) 1994-12-12 2001-05-15 Hyundai Electronics America Bipolar silicon-on-insulator structure and process
FR2728390A1 (fr) * 1994-12-19 1996-06-21 Korea Electronics Telecomm Procede de formation d'un transistor a film mince
JP3171764B2 (ja) * 1994-12-19 2001-06-04 シャープ株式会社 半導体装置の製造方法
JP2748885B2 (ja) * 1995-03-06 1998-05-13 日本電気株式会社 半導体集積回路装置
US5904535A (en) * 1995-06-02 1999-05-18 Hyundai Electronics America Method of fabricating a bipolar integrated structure
US6191484B1 (en) 1995-07-28 2001-02-20 Stmicroelectronics, Inc. Method of forming planarized multilevel metallization in an integrated circuit
JP3917185B2 (ja) 1996-05-16 2007-05-23 日本特殊陶業株式会社 点火装置
EP0905789A4 (fr) * 1996-06-14 1999-08-25 Mitsubishi Electric Corp Composant a semi-conducteurs ayant une structure silicium sur isolant et procede de fabrication de ce composant
US6355955B1 (en) 1998-05-14 2002-03-12 Advanced Micro Devices, Inc. Transistor and a method for forming the transistor with elevated and/or relatively shallow source/drain regions to achieve enhanced gate electrode formation
JP2000012864A (ja) 1998-06-22 2000-01-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP4476390B2 (ja) 1998-09-04 2010-06-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6140171A (en) * 1999-01-20 2000-10-31 International Business Machines Corporation FET device containing a conducting sidewall spacer for local interconnect and method for its fabrication
US8187174B2 (en) * 2007-01-22 2012-05-29 Capso Vision, Inc. Detection of when a capsule camera enters into or goes out of a human body and associated operations
US7500392B1 (en) 2007-10-11 2009-03-10 Memsys, Inc. Solid state microanemometer device and method of fabrication
KR101802436B1 (ko) * 2011-12-07 2017-11-29 삼성전자주식회사 반도체 장치 및 그 제조 방법
CN103389443B (zh) * 2012-05-07 2015-12-09 无锡华润上华科技有限公司 绝缘体上硅mos器件动态击穿电压的测试方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054895A (en) * 1976-12-27 1977-10-18 Rca Corporation Silicon-on-sapphire mesa transistor having doped edges
JPS59181670A (ja) * 1983-03-31 1984-10-16 Toshiba Corp Mos型半導体装置
JPS60180053A (ja) * 1984-02-27 1985-09-13 Hitachi Medical Corp 電離箱形放射線検出器
JPS6113661A (ja) * 1984-06-29 1986-01-21 Nippon Telegr & Teleph Corp <Ntt> 半導体装置およびその製造方法
JPS62298162A (ja) * 1986-06-18 1987-12-25 Nec Corp Soi misトランジスタ
US4753896A (en) * 1986-11-21 1988-06-28 Texas Instruments Incorporated Sidewall channel stop process
SE461490B (sv) * 1987-08-24 1990-02-19 Asea Ab Mos-transistor utbildad paa ett isolerande underlag
GB2211022B (en) * 1987-10-09 1991-10-09 Marconi Electronic Devices A semiconductor device and a process for making the device

Also Published As

Publication number Publication date
FR2649831A1 (fr) 1991-01-18
US5060035A (en) 1991-10-22

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Legal Events

Date Code Title Description
D6 Patent endorsed licences of rights
ST Notification of lapse

Effective date: 20080331