FR2647294B1 - METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE - Google Patents
METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATEInfo
- Publication number
- FR2647294B1 FR2647294B1 FR8906483A FR8906483A FR2647294B1 FR 2647294 B1 FR2647294 B1 FR 2647294B1 FR 8906483 A FR8906483 A FR 8906483A FR 8906483 A FR8906483 A FR 8906483A FR 2647294 B1 FR2647294 B1 FR 2647294B1
- Authority
- FR
- France
- Prior art keywords
- electrical components
- conductive circuit
- metallic substrate
- circuit printed
- insulated metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8906483A FR2647294B1 (en) | 1989-05-18 | 1989-05-18 | METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8906483A FR2647294B1 (en) | 1989-05-18 | 1989-05-18 | METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2647294A1 FR2647294A1 (en) | 1990-11-23 |
FR2647294B1 true FR2647294B1 (en) | 1994-05-20 |
Family
ID=9381754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8906483A Expired - Lifetime FR2647294B1 (en) | 1989-05-18 | 1989-05-18 | METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2647294B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2671933B1 (en) * | 1991-01-18 | 1996-12-13 | Ramy Jean Pierre | PROCESS FOR INTEGRATING BRAZING MATERIAL IN THE MANUFACTURE OF ELECTRONIC CIRCUITS AND HOUSINGS. |
US5591941A (en) * | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2548915A1 (en) * | 1975-10-31 | 1977-05-12 | Allg Electricitaets Ges Aeg Te | Soldering circuit element to plate, esp. ceramic plate - with thick or thin film circuit by infrared heating from below avoids damage by excessive heating |
JPS59161056A (en) * | 1983-03-03 | 1984-09-11 | Fuji Electric Corp Res & Dev Ltd | Ceramic package semiconductor device |
DE3447520A1 (en) * | 1984-12-27 | 1986-08-14 | Metallwerk Plansee GmbH, Reutte, Tirol | COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD |
JPS63202989A (en) * | 1987-02-19 | 1988-08-22 | 株式会社日立製作所 | Soldering |
US4771929A (en) * | 1987-02-20 | 1988-09-20 | Hollis Automation, Inc. | Focused convection reflow soldering method and apparatus |
-
1989
- 1989-05-18 FR FR8906483A patent/FR2647294B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2647294A1 (en) | 1990-11-23 |
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