FR2601175B1 - Cible de pulverisation cathodique et support d'enregistrement utilisant une telle cible. - Google Patents
Cible de pulverisation cathodique et support d'enregistrement utilisant une telle cible.Info
- Publication number
- FR2601175B1 FR2601175B1 FR8703807A FR8703807A FR2601175B1 FR 2601175 B1 FR2601175 B1 FR 2601175B1 FR 8703807 A FR8703807 A FR 8703807A FR 8703807 A FR8703807 A FR 8703807A FR 2601175 B1 FR2601175 B1 FR 2601175B1
- Authority
- FR
- France
- Prior art keywords
- target
- recording medium
- cathode spraying
- cathode
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
- H01F41/183—Sputtering targets therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/13—Amorphous metallic alloys, e.g. glassy metals
- H01F10/133—Amorphous metallic alloys, e.g. glassy metals containing rare earth metals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7780786 | 1986-04-04 | ||
JP61146743A JP2747580B2 (ja) | 1986-04-04 | 1986-06-23 | 磁性薄膜用スパッタリング・ターゲット |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2601175A1 FR2601175A1 (fr) | 1988-01-08 |
FR2601175B1 true FR2601175B1 (fr) | 1993-11-12 |
Family
ID=26418871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8703807A Expired - Lifetime FR2601175B1 (fr) | 1986-04-04 | 1987-03-19 | Cible de pulverisation cathodique et support d'enregistrement utilisant une telle cible. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4814053A (fr) |
FR (1) | FR2601175B1 (fr) |
NL (1) | NL191420C (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5529854A (en) * | 1984-09-12 | 1996-06-25 | Seiko Epson Corporation | Magneto-optic recording systems |
DE3788069T2 (de) * | 1986-08-22 | 1994-06-01 | Japan Broadcasting Corp | Optomagnetisches speichermedium und verfahren zur herstellung. |
JP2646398B2 (ja) * | 1989-09-20 | 1997-08-27 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 光磁気記録媒体 |
DE4321851A1 (de) * | 1993-07-01 | 1995-01-12 | Philips Patentverwaltung | Magnetooptisches Aufzeichnungsmedium |
JP2733006B2 (ja) * | 1993-07-27 | 1998-03-30 | 株式会社神戸製鋼所 | 半導体用電極及びその製造方法並びに半導体用電極膜形成用スパッタリングターゲット |
US5439500A (en) * | 1993-12-02 | 1995-08-08 | Materials Research Corporation | Magneto-optical alloy sputter targets |
US6071357A (en) * | 1997-09-26 | 2000-06-06 | Guruswamy; Sivaraman | Magnetostrictive composites and process for manufacture by dynamic compaction |
US6342114B1 (en) * | 1999-03-31 | 2002-01-29 | Praxair S.T. Technology, Inc. | Nickel/vanadium sputtering target with ultra-low alpha emission |
US6113761A (en) | 1999-06-02 | 2000-09-05 | Johnson Matthey Electronics, Inc. | Copper sputtering target assembly and method of making same |
US6858102B1 (en) * | 2000-11-15 | 2005-02-22 | Honeywell International Inc. | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets |
US6432819B1 (en) | 1999-09-27 | 2002-08-13 | Applied Materials, Inc. | Method and apparatus of forming a sputtered doped seed layer |
US6391163B1 (en) | 1999-09-27 | 2002-05-21 | Applied Materials, Inc. | Method of enhancing hardness of sputter deposited copper films |
JP3434476B2 (ja) * | 1999-09-29 | 2003-08-11 | 秋田県 | 高密度情報記録媒体及びその媒体の製造方法 |
CN1425196A (zh) | 1999-11-24 | 2003-06-18 | 霍尼韦尔国际公司 | 导电互连 |
AU2003216441A1 (en) * | 2002-02-28 | 2003-09-16 | Seagate Technology Llc | Chemically ordered, cobalt-platinum alloys for magnetic recording |
WO2005021828A2 (fr) * | 2003-08-21 | 2005-03-10 | Honeywell International Inc. | Cibles pvd comprenant du cuivre dans des melanges ternaires, et procedes pour former des cibles pvd contenant du cuivre |
JP4579709B2 (ja) | 2005-02-15 | 2010-11-10 | 株式会社神戸製鋼所 | Al−Ni−希土類元素合金スパッタリングターゲット |
US20090008786A1 (en) * | 2006-03-06 | 2009-01-08 | Tosoh Smd, Inc. | Sputtering Target |
KR20080100358A (ko) * | 2006-03-06 | 2008-11-17 | 토소우 에스엠디, 인크 | 전자 장치, 이의 제조방법 및 스퍼터링 타겟 |
JP4377906B2 (ja) * | 2006-11-20 | 2009-12-02 | 株式会社コベルコ科研 | Al−Ni−La系Al基合金スパッタリングターゲット、およびその製造方法 |
US20090065354A1 (en) * | 2007-09-12 | 2009-03-12 | Kardokus Janine K | Sputtering targets comprising a novel manufacturing design, methods of production and uses thereof |
US20150041731A1 (en) * | 2013-08-09 | 2015-02-12 | Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National Defense | Method For Preparing Scandium-Doped Hafnium Oxide Film |
JP2021127490A (ja) * | 2020-02-13 | 2021-09-02 | 山陽特殊製鋼株式会社 | スパッタリングターゲット材及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH616777A5 (fr) * | 1975-09-23 | 1980-04-15 | Bbc Brown Boveri & Cie | |
US4135953A (en) * | 1975-09-23 | 1979-01-23 | Bbc Brown, Boveri & Company, Limited | Permanent magnet and method of making it |
JPS54104408A (en) * | 1978-02-03 | 1979-08-16 | Namiki Precision Jewel Co Ltd | Rare earthhcobalt base permanent magnet alloy |
JPS601940B2 (ja) * | 1980-08-11 | 1985-01-18 | 富士通株式会社 | 感温素子材料 |
JPS5968854A (ja) * | 1982-09-28 | 1984-04-18 | Seiko Instr & Electronics Ltd | 光磁気記録媒体 |
JPS59202614A (ja) * | 1983-05-04 | 1984-11-16 | Showa Denko Kk | 磁気素子 |
JPS60117436A (ja) * | 1983-11-29 | 1985-06-24 | Sharp Corp | 磁気光学記憶素子 |
US4547276A (en) * | 1984-04-30 | 1985-10-15 | The United States Of America As Represented By The Secretary Of The Army | Method of directly crystallizing a (Sm+Ti):Fe=1:5 compound |
JPS616807A (ja) * | 1984-06-20 | 1986-01-13 | Oki Electric Ind Co Ltd | 光磁気記録用材料 |
JPS6115308A (ja) * | 1984-07-02 | 1986-01-23 | Hitachi Ltd | 光磁気記録材料 |
US4620872A (en) * | 1984-10-18 | 1986-11-04 | Mitsubishi Kinzoku Kabushiki Kaisha | Composite target material and process for producing the same |
-
1987
- 1987-03-19 FR FR8703807A patent/FR2601175B1/fr not_active Expired - Lifetime
- 1987-04-03 NL NL8700792A patent/NL191420C/xx not_active IP Right Cessation
- 1987-04-03 US US07/033,719 patent/US4814053A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL191420B (nl) | 1995-02-16 |
NL191420C (nl) | 1995-07-17 |
FR2601175A1 (fr) | 1988-01-08 |
NL8700792A (nl) | 1987-11-02 |
US4814053A (en) | 1989-03-21 |
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