FR2567324B1 - Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique - Google Patents

Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique

Info

Publication number
FR2567324B1
FR2567324B1 FR8410772A FR8410772A FR2567324B1 FR 2567324 B1 FR2567324 B1 FR 2567324B1 FR 8410772 A FR8410772 A FR 8410772A FR 8410772 A FR8410772 A FR 8410772A FR 2567324 B1 FR2567324 B1 FR 2567324B1
Authority
FR
France
Prior art keywords
mounting device
electronic module
thick layer
hybrid component
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8410772A
Other languages
English (en)
Other versions
FR2567324A1 (fr
Inventor
Jean Neyroud
Alain Guillier
Abdelkader Mahi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
La Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by La Telemecanique Electrique SA filed Critical La Telemecanique Electrique SA
Priority to FR8410772A priority Critical patent/FR2567324B1/fr
Priority to US06/751,641 priority patent/US4648008A/en
Priority to DE19853524002 priority patent/DE3524002A1/de
Publication of FR2567324A1 publication Critical patent/FR2567324A1/fr
Application granted granted Critical
Publication of FR2567324B1 publication Critical patent/FR2567324B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8410772A 1984-07-06 1984-07-06 Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique Expired FR2567324B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8410772A FR2567324B1 (fr) 1984-07-06 1984-07-06 Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
US06/751,641 US4648008A (en) 1984-07-06 1985-07-03 Mounting device for a thick layer electronic module
DE19853524002 DE3524002A1 (de) 1984-07-06 1985-07-04 Montagevorrichtung fuer dickfilmbauelemente, insbesondere fuer elektronische module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8410772A FR2567324B1 (fr) 1984-07-06 1984-07-06 Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique

Publications (2)

Publication Number Publication Date
FR2567324A1 FR2567324A1 (fr) 1986-01-10
FR2567324B1 true FR2567324B1 (fr) 1986-11-28

Family

ID=9305880

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8410772A Expired FR2567324B1 (fr) 1984-07-06 1984-07-06 Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique

Country Status (3)

Country Link
US (1) US4648008A (fr)
DE (1) DE3524002A1 (fr)
FR (1) FR2567324B1 (fr)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3440334A1 (de) * 1984-11-05 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper
IT1215267B (it) * 1985-04-26 1990-01-31 Ates Componenti Elettron Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.
DE3615583C2 (de) * 1986-05-09 1995-05-24 Hella Kg Hueck & Co Schaltungsanordnung
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
US5019942A (en) * 1987-11-30 1991-05-28 Thermalloy Incorporated Insulating apparatus for electronic device assemblies
DE3814987A1 (de) * 1988-05-03 1989-11-16 Draloric Electronic Elektrischer leistungswiderstand
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
DE4012180C1 (fr) * 1990-04-14 1991-08-01 Robert Bosch Gmbh, 7000 Stuttgart, De
DE9014091U1 (de) * 1990-10-10 1992-02-13 Robert Bosch Gmbh, 7000 Stuttgart Federelement für eine Baugruppe eines elektronischen Steuergerätes
JP2565474Y2 (ja) * 1990-10-10 1998-03-18 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子制御装置の構成部材群のためのばね部材
US5459348A (en) * 1991-05-24 1995-10-17 Astec International, Ltd. Heat sink and electromagnetic interference shield assembly
NO173412C (no) * 1991-06-28 1993-12-08 Ame Space As Montasjeanordning
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
DE4218224A1 (de) * 1992-06-03 1993-12-09 Asea Brown Boveri Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger
DE4222172A1 (de) * 1992-07-06 1994-01-13 Siemens Matsushita Components Elektrisch isolierende Wärmekopplung für zwangsgekühlte elektrische Kondensatoren
DE4327144C2 (de) * 1993-08-12 1995-08-10 Siemens Nixdorf Inf Syst Wärmeleitfolie
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
DE4332115B4 (de) * 1993-09-22 2004-06-03 Philips Intellectual Property & Standards Gmbh Anordnung zur Kühlung mindestens einen Kühlkörper aufweisenden Leiterplatte
DE4336961C2 (de) * 1993-10-29 2000-07-06 Kerafol Keramische Folien Gmbh Flexible Wärmeübertragungsvorrichtung
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
DE4441044C2 (de) * 1994-11-18 1998-11-12 Becker Gmbh Befestigungselement für elektrische Bauteile
US5725050A (en) * 1996-09-03 1998-03-10 Thermal Corp. Integrated circuit with taped heat pipe
JPH10242354A (ja) * 1997-02-24 1998-09-11 Matsushita Electric Ind Co Ltd 熱伝導部材およびそれを用いた電子装置
DE19748597A1 (de) * 1997-11-04 1998-10-15 Bosch Gmbh Robert Elektrisches Gerät und ein Verfahren zu dessen Herstellung
DE19807718C2 (de) * 1998-02-24 2000-12-07 Lear Automotive Electronics Gm Elektronikbaugruppe
DE19859739A1 (de) * 1998-12-23 2000-07-06 Bosch Gmbh Robert Kühlvorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät
US6674164B1 (en) 1999-04-26 2004-01-06 Aerovironment, Inc. System for uniformly interconnecting and cooling
AT409681B (de) * 2000-02-11 2002-10-25 Thallner Erich Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage
US6625027B2 (en) * 2001-10-31 2003-09-23 Baker Hughes Incorporated Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
DE202005003267U1 (de) * 2005-02-25 2006-07-06 Schunk Motorensysteme Gmbh Widerstandsanordnung
US7630204B2 (en) * 2005-03-28 2009-12-08 Sandisk Il Ltd. Detachable device holder
FR2921226B1 (fr) * 2007-09-14 2009-10-30 Thales Sa Dispositif de demontage de composants electroniques de puissance et procede pour la mise en oeuvre du dispositif
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3039440C2 (de) * 1980-10-18 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Anordnung zur Aufnahme von elektrischen und/oder elektronischen Bauelementen
IT992650B (it) * 1973-07-19 1975-09-30 Ates Componenti Elettron Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato
DE2344145A1 (de) * 1973-09-01 1975-03-13 Bosch Gmbh Robert Steuerteil fuer ein elektronisches steuergeraet, insbesondere fuer die zentralelektronik in fahrzeugen
US4069497A (en) * 1975-08-13 1978-01-17 Emc Technology, Inc. High heat dissipation mounting for solid state devices and circuits
DE2823699A1 (de) * 1978-05-31 1979-12-06 Bosch Gmbh Robert Anordnung mit einem kuehlkoerper fuer zwei halbleiterbauelemente
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
DE3204683A1 (de) * 1982-02-11 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Einrichtung zur kuehlung von verlustwaermeerzeugenden elektrischen bzw. elektronischen bauelementen
US4544942A (en) * 1982-02-22 1985-10-01 Aavid Engineering, Inc. Heat sinks with staked solderable studs
EP0103067B1 (fr) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Dispositif de refroidissement pour une pluralité de composants intégrés, assemblés comme structure plane
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink

Also Published As

Publication number Publication date
DE3524002A1 (de) 1986-02-06
US4648008A (en) 1987-03-03
FR2567324A1 (fr) 1986-01-10

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Legal Events

Date Code Title Description
ST Notification of lapse