FR2522459B1 - - Google Patents

Info

Publication number
FR2522459B1
FR2522459B1 FR8203301A FR8203301A FR2522459B1 FR 2522459 B1 FR2522459 B1 FR 2522459B1 FR 8203301 A FR8203301 A FR 8203301A FR 8203301 A FR8203301 A FR 8203301A FR 2522459 B1 FR2522459 B1 FR 2522459B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8203301A
Other languages
French (fr)
Other versions
FR2522459A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR8203301A priority Critical patent/FR2522459A1/en
Priority to JP50077083A priority patent/JPS59500295A/en
Priority to PCT/FR1983/000031 priority patent/WO1983003040A1/en
Priority to AU12278/83A priority patent/AU1227883A/en
Priority to EP19830900717 priority patent/EP0101703A1/en
Publication of FR2522459A1 publication Critical patent/FR2522459A1/en
Application granted granted Critical
Publication of FR2522459B1 publication Critical patent/FR2522459B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FR8203301A 1982-02-26 1982-02-26 PRINTED ELECTRICAL CIRCUIT Granted FR2522459A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8203301A FR2522459A1 (en) 1982-02-26 1982-02-26 PRINTED ELECTRICAL CIRCUIT
JP50077083A JPS59500295A (en) 1982-02-26 1983-02-22 printed circuit
PCT/FR1983/000031 WO1983003040A1 (en) 1982-02-26 1983-02-22 Printed electric circuit
AU12278/83A AU1227883A (en) 1982-02-26 1983-02-22 Circuit electricque imprime
EP19830900717 EP0101703A1 (en) 1982-02-26 1983-02-22 Printed electric circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8203301A FR2522459A1 (en) 1982-02-26 1982-02-26 PRINTED ELECTRICAL CIRCUIT

Publications (2)

Publication Number Publication Date
FR2522459A1 FR2522459A1 (en) 1983-09-02
FR2522459B1 true FR2522459B1 (en) 1985-04-26

Family

ID=9271416

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8203301A Granted FR2522459A1 (en) 1982-02-26 1982-02-26 PRINTED ELECTRICAL CIRCUIT

Country Status (4)

Country Link
EP (1) EP0101703A1 (en)
JP (1) JPS59500295A (en)
FR (1) FR2522459A1 (en)
WO (1) WO1983003040A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429236A1 (en) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE
US4802741A (en) * 1987-10-09 1989-02-07 Eastman Kodak Company In-depth electrode light valve array devices and improved fabrication method therefor
KR20080023369A (en) * 1998-09-17 2008-03-13 이비덴 가부시키가이샤 Multilayer build-up wiring board
JP5773633B2 (en) * 2010-12-13 2015-09-02 キヤノン株式会社 Wiring board manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400210A (en) * 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
FR1493316A (en) * 1966-09-20 1967-08-25 Litton Industries Inc Multi-layer circuit board
DE2323529A1 (en) * 1973-05-10 1974-11-28 Peter Kammermeier CIRCUIT BOARD WITH PRINTED OR CLADDED TRACKS
FR2296988A1 (en) * 1974-12-31 1976-07-30 Ibm France IMPROVEMENT OF THE MANUFACTURING PROCESSES OF A CERAMIC MULTILAYER CIRCUIT MODULE

Also Published As

Publication number Publication date
JPS59500295A (en) 1984-02-23
WO1983003040A1 (en) 1983-09-01
EP0101703A1 (en) 1984-03-07
FR2522459A1 (en) 1983-09-02

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse