FR2503526B1 - - Google Patents
Info
- Publication number
- FR2503526B1 FR2503526B1 FR8106773A FR8106773A FR2503526B1 FR 2503526 B1 FR2503526 B1 FR 2503526B1 FR 8106773 A FR8106773 A FR 8106773A FR 8106773 A FR8106773 A FR 8106773A FR 2503526 B1 FR2503526 B1 FR 2503526B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Conversion In General (AREA)
- Thyristors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8106773A FR2503526A1 (fr) | 1981-04-03 | 1981-04-03 | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
DE19823211975 DE3211975A1 (de) | 1981-04-03 | 1982-03-31 | Montagegehaeuse fuer halbleiterbauteile mittlerer leistung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8106773A FR2503526A1 (fr) | 1981-04-03 | 1981-04-03 | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2503526A1 FR2503526A1 (fr) | 1982-10-08 |
FR2503526B1 true FR2503526B1 (fr) | 1984-07-13 |
Family
ID=9257005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8106773A Granted FR2503526A1 (fr) | 1981-04-03 | 1981-04-03 | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3211975A1 (fr) |
FR (1) | FR2503526A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3241508A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
BR8400122A (pt) * | 1983-01-12 | 1984-08-21 | Allen Bradley Co | Modulo semicondutor e embalagem de semicondutor aperfeicoada |
JPS59172759A (ja) * | 1983-03-22 | 1984-09-29 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタモジユ−ル |
US4819042A (en) * | 1983-10-31 | 1989-04-04 | Kaufman Lance R | Isolated package for multiple semiconductor power components |
DE3586735D1 (de) * | 1984-10-19 | 1992-11-12 | Bbc Brown Boveri & Cie | Abschaltbares leistungshalbleiterbauelement. |
DE3527206A1 (de) * | 1985-07-30 | 1987-02-12 | Bbc Brown Boveri & Cie | Anschlussblock fuer stromrichtergeraete |
CH668667A5 (de) * | 1985-11-15 | 1989-01-13 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul. |
JPS62142856U (fr) * | 1986-02-28 | 1987-09-09 | ||
DE3839383A1 (de) * | 1988-11-22 | 1990-05-23 | Semikron Elektronik Gmbh | Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens |
EP0380799B1 (fr) * | 1989-02-02 | 1993-10-06 | Asea Brown Boveri Ag | Composant semi-conducteur à contact de pression |
FR2660826A1 (fr) * | 1990-04-05 | 1991-10-11 | Mcb Sa | Boitier economique pour composants electroniques de puissance, a fixer sur dissipateur thermique et son procede de fabrication. |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US20120319768A1 (en) * | 2010-12-20 | 2012-12-20 | Diodes Zetex Semiconductors Limited | Complementary Darlington Emitter Follower with Improved Switching Speed and Improved Cross-over Control and Increased Output Voltage |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1789028B1 (de) * | 1968-09-25 | 1971-05-13 | Licentia Gmbh | Elektronischer baustein |
DE2639979C3 (de) * | 1976-09-04 | 1980-05-14 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Halbleiterbaueinheit |
US4106052A (en) * | 1975-04-19 | 1978-08-08 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position |
FR2392498A1 (fr) * | 1976-11-23 | 1978-12-22 | Motorola Semiconducteurs | Ensemble redresseur |
DE2728564A1 (de) * | 1977-06-24 | 1979-01-11 | Siemens Ag | Halbleiterbauelement |
US4249034A (en) * | 1978-11-27 | 1981-02-03 | General Electric Company | Semiconductor package having strengthening and sealing upper chamber |
-
1981
- 1981-04-03 FR FR8106773A patent/FR2503526A1/fr active Granted
-
1982
- 1982-03-31 DE DE19823211975 patent/DE3211975A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2503526A1 (fr) | 1982-10-08 |
DE3211975A1 (de) | 1982-10-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |