FR2499768A1 - INTEGRATED CIRCUIT DEVICE AND ITS ASSEMBLY SUBASSEMBLY - Google Patents
INTEGRATED CIRCUIT DEVICE AND ITS ASSEMBLY SUBASSEMBLY Download PDFInfo
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- FR2499768A1 FR2499768A1 FR8115382A FR8115382A FR2499768A1 FR 2499768 A1 FR2499768 A1 FR 2499768A1 FR 8115382 A FR8115382 A FR 8115382A FR 8115382 A FR8115382 A FR 8115382A FR 2499768 A1 FR2499768 A1 FR 2499768A1
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
L'INVENTION CONCERNE UN DISPOSITIF A CIRCUIT INTEGRE ET SON CADRE DE MONTAGE. LE CADRE EST FORME D'UNE FEUILLE 10 DE METAL DE FORME RETICULAIRE COMPORTANT PLUSIEURS ELEMENTS CONDUCTEURS 14A A 15C, DEUX DES ELEMENTS CONDUCTEURS 14A, 15A AYANT DES PARTIES INTERNES 18, 19 QUI DEFINISSENT UNE PLATE-FORME 16 DESTINEE A RECEVOIR UN CONDENSATEUR C. LA SURFACE SUPERIEURE DE CE CONDENSATEUR DEFINIT UNE SURFACE DE MONTAGE POUR UNE PASTILLE DE SILICIUM ET IL SERT EN MEME TEMPS A DECOUPLER DE L'ALIMENTATION ELECTRIQUE DE LA PASTILLE LES EFFETS TRANSITOIRES. LE DISPOSITIF DE L'INVENTION S'APPLIQUE TOUT PARTICULIEREMENT AUX DISPOSITIFS DE MEMORISATION A CIRCUITS INTEGRES.THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE AND ITS MOUNTING FRAME. THE FRAME IS IN THE FORM OF A SHEET 10 OF RETICULAR-SHAPED METAL WITH SEVERAL CONDUCTIVE ELEMENTS 14A TO 15C, TWO OF THE CONDUCTIVE ELEMENTS 14A, 15A HAVING INTERNAL PARTS 18, 19 WHICH DEFINE A PLATFORM 16 INTENDED TO RECEIVE A CONDENSER C. THE TOP SURFACE OF THIS CAPACITOR DEFINES A MOUNTING SURFACE FOR A SILICON PELLET AND AT THE SAME TIME IT IS USED TO DECOUPLY THE POWER SUPPLY OF THE PELLET FOR TRANSITIONAL EFFECTS. THE DEVICE OF THE INVENTION APPLIES IN PARTICULARLY TO MEMORIZATION DEVICES WITH INTEGRATED CIRCUITS.
Description
La présente invention concerne les dispositifs à cir-The present invention relates to devices
cuits intégrés et, plus précisément, les dispositifs à circuits inté- baked products and, more specifically, integrated circuit devices
grés utilisés comme circuits de mémorisation. used as memory circuits.
Plus particulièrement, l'invention se rapporte à un dispositif à circuit intégré perfectionné et au sous-ensemble cons- tituant son cadre de montage présentant des caractéristiques de découplage améliorées-et permettant la formation d'ensembles de More particularly, the invention relates to an improved integrated circuit device and the subassembly constituting its mounting frame having improved decoupling characteristics and enabling the formation of sets of
mémorisation plus compacts.more compact storage.
L'utilisation de dispositifs à circuits intégrés, en particulier comme composants de circuits de mémorisation, est très The use of integrated circuit devices, particularly as storage circuit components, is very
répandue. Lorsqu'un ou plusieurs éléments de commutation d'un cir- widespread. When one or more switching elements of a circuit
cuit intégré sont activés, il apparait un courant et une tension transitoires, lesquels sont injectés dans le circuit d'alimentation électrique, ce dernier étant lié à d'autres éléments du dispositif embedded cookware are activated, there is a transient current and voltage, which are injected into the power supply circuit, the latter being connected to other elements of the device
de mémorisation. Lorsque l'énergie transitoire des impulsions pré- memorisation. When the transient energy of the pulses pre-
sente des caractéristiques approchant celles d'un signal fonctionnel, have characteristics approaching those of a functional signal,
il est possible que l'on obtienne une lecture erronée ou la trans- it is possible that we get a wrong reading or the trans-
mission d'une information erronée, ce qui donne lieu à ce qu'on mission of misinformation, which gives rise to
appelle dans l'industrie une "erreur primaire". calls in the industry a "primary error".
Pour réduire les possibilités de production d'erreurs primaires, il est classique de faire appel à des condensateurs de découplage ou de dérivation reliant les bornes d'entrée d'alimentation électrique du circuit intégré, si bien que l'énergie transitoire (bruit) est absorbée au lieu d'être transmise au reste des circuits In order to reduce the possibilities of producing primary errors, it is conventional to use decoupling or bypass capacitors connecting the power supply input terminals of the integrated circuit, so that the transient energy (noise) is absorbed instead of being passed on to the rest of the circuits
intégrés via les connexions d'alimentation électrique. integrated via the power supply connections.
Jusqu'ici, dans les circuits utilisant des circuits intégrés du type à cadre de montage, on réalise le découplage en So far, in circuits using integrated circuits of the mounting frame type, the decoupling is carried out in
montant un condensateur sur la plaquette de circuit imprimé se trou- mounting a capacitor on the printed circuit board is
vant au voisinage extérieur de chaque circuit intégré, les fils conducteurs du condensateur étant connectés via le câblage du circuit in the outer vicinity of each integrated circuit, the conductive wires of the capacitor being connected via the circuit wiring
imprimé entre les bornes d'alimentation électrique du circuit intégré. printed between the power supply terminals of the integrated circuit.
La combinaison en série des fils conducteurs et du càblage augmente l'impédance effective du condensateur, ce qui rend ce dernier moins efficace, en particulier en ce qui concerne le découplage des courants transitoires de haute fréquence qui sont typiquement produits par des circuits dynamiques de mémorisation à circuits intégrés. Dans ces circuits, il faut encore que l'alimentation électrique soit maintenue à + 10 7. pour que les données mémorisées dans la mémoire soient correctement conservées. La valeur des condensateurs qu'il était jusqu'ici nécessaire d'employer était notable, de l'ordre de 0,1 à 2 mF. The series combination of lead wires and wiring increases the effective impedance of the capacitor, which makes the capacitor less efficient, particularly with respect to the decoupling of high frequency transients typically generated by dynamic memory circuits. integrated circuits. In these circuits, it is still necessary that the power supply is maintained at + 10 7. so that the data stored in the memory are properly preserved. The value of the capacitors hitherto necessary to employ was significant, of the order of 0.1 to 2 mF.
Des condensateurs ayant des valeurs électriques relative- Capacitors with relative electrical values
ment élevées telles que celles notées ci-dessus sont non seulement coûteux mais encombrants, si bien que le but visé de compacité des such as those noted above are not only expensive but cumbersome, so that the goal of compactness of
circuits ne peut être satisfait.circuits can not be satisfied.
En résumé, l'invention propose un sous-ensemble per- In summary, the invention proposes a subset per-
fectionné de cadre de montage du type qui est fabriqué à partir d'une bande ou feuille métallique découpée au poinçon ou incisée Fitted with a mounting frame of the type which is made from punched or incised metal strip or sheet
chimiquement et se distingue en ce que les éléments de cadre métal- chemically and is distinguished in that the metal frame elements
liques du cadre de montage sont construits et agencés mécaniquement de manière à porter un condensateur qui se trouve électriquement en parallèle entre les conducteurs d'alimentation électrique du cadre de montage, le condensateur servant de support à une pastille ou puce de circuit intégré, les bornes d'alimentation électrique de la pastille de circuit intégré étant classiquement connectées aux Mounting frame members are constructed and mechanically arranged to carry a capacitor which is electrically parallel to the power supply conductors of the mounting frame, the capacitor serving as a support for an integrated circuit chip or chip, the terminals power supply of the integrated circuit chip being conventionally connected to the
conducteurs d'alimentation électrique du cadre de montage par l'in- power supply conductors of the mounting frame by the in-
termédiaire de courtes sections de fil conducteur, de cavaliers, ou intermediate short sections of lead wire, jumpers, or
de fil de liaison du type cAble.wire-type wire.
Il a été montré que la longueur de fil conducteur des circuits de découplage actuellement connus était un facteur notable de l'accroissement visible de l'amplitude des effets transitoires ou impulsions d'alimentation électrique indésirables produits du fait de la réactance inductive créée par les fils conducteurs longs, et que, en juxtaposant le condensateur en voisinage intime avec les bornes d'alimentation électrique de la pastille de circuit intégré, ce qui entraîne une réduction de la longueur des fils conducteurs dans le circuit de découplage, on pouvait réaliser, & l'aide de petites valeurs de capacité un amortissement des impulsions. A titre d'exemple, et sans que ceci constitue une limitation, une valeur de 0,05 mF de capacité insérée au voisinage de la pastille de circuit It has been shown that the current conductor wire length of currently known decoupling circuits is a significant factor in the visible increase in amplitude of the transient or unwanted power supply pulses produced due to the inductive reactance created by the wires. long conductors, and that, by juxtaposing the capacitor in close proximity with the power supply terminals of the integrated circuit chip, which leads to a reduction in the length of the conductive wires in the decoupling circuit, it was possible to realize, helps small values of capacity damping impulses. By way of example, and without this being a limitation, a value of 0.05 mF of capacity inserted in the vicinity of the circuit chip
intégré et placée intérieurement en parallèle sur ses bornes d'ali- integrated and placed internally in parallel on its terminals of
mentation électrique, permet un amortissement efficace d'impulsions de courant qui, jusqu'ici, demandaient une capacité externe d'une valeur comprise entre 0,1 et 2mF selon la fréquence de l'impulsion electrical damping, allows efficient damping of current pulses which, until now, required an external capacitance of between 0.1 and 2mF depending on the frequency of the pulse
de courant.current.
L'invention se rapporte plus particulièrement à un cadre de montage du type comprenant une feuille découpée de manière à définir une pièce réticulaire d'éléments métalliques séparés qui font ultimement fonction de conducteurs, au moins l'un des éléments du cadre de montage étant fléchi par rapport au plan de la feuille The invention more particularly relates to a mounting frame of the type comprising a sheet cut to define a reticular piece of separate metal elements which ultimately function as conductors, at least one of the elements of the mounting frame being flexed. relative to the plane of the sheet
métallique et définissant un siège destiné au montage d'un conden- metal and defining a seat for mounting a condensate
sateur qui est à la fois électriquement et mécaniquement porté par celuici. Le condensateur fournit une plate-forme de montage pour who is both electrically and mechanically carried by him. The capacitor provides a mounting platform for
la pastille ou puce de circuit intégré, dont les bornes d'alimenta- the chip or chip of integrated circuit, whose power supply terminals
tion électrique sont électriquement connectées à des éléments du cadre de montage, qui sont en connexion électrique et en relation electrical connection are electrically connected to elements of the mounting frame, which are in electrical connection and in relation
de support matériel avec les bornes du condensateur. Dans ces condi- hardware support with the capacitor terminals. In these circumstances
tions, la longueur des fils entre le condensateur de découplage et les bornes d'alimentation de la pastille est ramenée à une valeur extrêmement brève, si bien que la réactance inductive normalement ajoutée par des fils classiques et par le cAblage du circuit imprimé As a result, the length of the wires between the decoupling capacitor and the pellet supply terminals is reduced to an extremely brief value, so that the inductive reactance normally added by conventional wires and the wiring of the printed circuit
est minimisée.is minimized.
Par conséquent, un but de l'invention est de proposer un sous-ensemble de cadre de montage perfectionné qui est destiné, pa r l'addition d'une pastille ou puce de silicium portant un circuit approprié, à être formé en un dispositif à circuit intégré, se distinguant en ce que le condensateur est relié aux éléments SUMMARY OF THE INVENTION It is therefore an object of the invention to provide an improved mounting frame subassembly which is intended, by the addition of a silicon chip or chip carrying a suitable circuit, to be formed into a device. integrated circuit, distinguished in that the capacitor is connected to the elements
métalliques du cadre de montage de manière que le condensateur cons- the mounting frame so that the capacitor
titue un support matériel pour la pastille et que les fils se trou- material support for the pellet and that the wires are
vant entre l'entrée électrique de la pastille de circuit intégré et between the electrical input of the integrated circuit chip and
le condensateur soient maintenus à une longueur minimale. the capacitor are kept at a minimum length.
Selon un autre but de l'invention, il est proposé un According to another object of the invention, it is proposed a
dispositif à circuit intégré qui est fabriqué à partir d'un sous- integrated circuit device which is manufactured from a sub-device
ensemble de cadre de montage du type décrit. assembly frame assembly of the type described.
Un autre but de l'invention est de proposer un dispositif Another object of the invention is to propose a device
à circuit intégré du type à cadre de montage, c'est-à-dire un dis- an integrated circuit of the mounting frame type, i.e.
positif fabriqué à partir d'éléments d'ossature d'une feuille métal- made from structural elements of a metal foil-
lique découpée au poinçon et comportant en outre un élément capacitif punched die and further comprising a capacitive element
interne qui découple efficacement le circuit d'alimentation élec- internal circuit which effectively cuts off the electrical supply circuit.
trique vis-à-vis de la transmission d'effets transitoires de com- with respect to the transmission of transient
mutation, la valeur de la capacité n'étant qu'une faible fraction de la valeur de capacité qui serait nécessaire s'il était fait appel à un découplage externe. Selon un autre but de l'invention, il est proposé un sous-ensemble de cadre de montage du type décrit et comprenant une multiplicité d'élémentsde cadre de montage interconnectés conçus pour être manipulés par une machine de traitement automatique, chacun des éléments notés comportant un condensateur de découplage interne qui fait également fonction de support-mécanique pour une pastille mutation, the value of the capacity being only a small fraction of the value of capacity that would be required if external decoupling was used. According to another object of the invention, there is provided a mounting frame subassembly of the type described and comprising a multiplicity of interconnected mounting frame members adapted to be handled by an automatic processing machine, each of the scored elements comprising an internal decoupling capacitor which also acts as a mechanical support for a pellet
de silicium ou un composant analogue. silicon or a similar component.
La description suivante, conçue à titre d'illustration The following description, designed as an illustration
de l'invention, vise à donner une meilleure compréhension de ses caractéristiques et avantages; elle s'appuie sur les dessins annexés, parmi lesquels: - la figure 1 est une vue en plan d'une courte section d'une feuille allongée définissant une série de cadre de montage pour circuits intégrés; - la figure 2 est une vue en coupe prise suivant la ligne II-Il de la figure 1; of the invention, aims to give a better understanding of its features and advantages; it is based on the accompanying drawings, in which: - Figure 1 is a plan view of a short section of an elongated sheet defining a series of mounting frame for integrated circuits; - Figure 2 is a sectional view taken along the line II-II of Figure 1;
- la figure 3 est une vue en plan fragmentaire du sous- FIG. 3 is a fragmentary plan view of the subset
ensemble de cadre de montage après que le condensateur y a été inté- mounting frame assembly after the capacitor has been inte-
gré; - la figure 4 est une vue en coupe prise suivant la ligne IV-IV de la figure 3; - la figure 5 est une vue en perspective agrandie du cadre de montage auquel est appliquée une pastille de silicium de circuit intégré et montre les connexions s'étendant jusqu'à la pastille; - la figure 6 est une vue en plan d'un dispositif à circuit intégré achevé selon l'invention; et - la figure 7 est une vue en plan d'un dispositif à will; - Figure 4 is a sectional view taken along the line IV-IV of Figure 3; FIG. 5 is an enlarged perspective view of the mounting frame to which an integrated circuit silicon chip is applied and shows the connections extending to the chip; FIG. 6 is a plan view of an integrated circuit device completed according to the invention; and FIG. 7 is a plan view of a device
circuit intégré achevé selon la technique antérieure. integrated circuit completed according to the prior art.
On se reporte maintenant aux dessins, et en particulier à la figure 1, sur laquelle on peut voir une feuille allongée de métal.lO qui a été incisée chimiquement ou découpée au poinçon, d'une manière connue en soi, de manière à former une multiplicité d'aires découpées, les éléments métalliques M qui restent entre les parties découpées B étant utilisées pour former des conducteurs destinés à être reliés intérieurement à une pastille de circuit intégré 12 et extérieurement entre le dispositif à circuit intégré Reference is now made to the drawings, and in particular to FIG. 1, in which an elongate sheet of metal 10 which has been chemically incised or punched out, in a manner known per se, can be seen to form a multiplicity of cut areas, the metal elements M remaining between the cut portions B being used to form conductors intended to be internally connected to an integrated circuit chip 12 and externally between the integrated circuit device
et la plaquette de circuit imprimé ou u n élément analogue. and the printed circuit board or the like.
La feuille 10 du cadre de montage peut comporter plusieurs ouvertures de guidage 13 destinées à venir en prise avec un équipement de traitement automatique en vue de la mise en The sheet 10 of the mounting frame may have a plurality of guide apertures 13 for engaging with automatic processing equipment for the purpose of
oeuvre des diverses étapes ultérieures nécessaires à la transforma- of the various subsequent steps necessary for the transformation
tion de la pièce métallique réticulaire en un dispositif & circuit the reticular metal part into a device & circuit
intégré fini.integrated finished.
Le cadre de montage comporte une série de parties con- The mounting frame has a series of con-
ductricesl4a, 14b, 14c, etc. et 15a, l5b, 15c, etc., lesquelles, dans le dispositif à circuit intégré fini que montre la figure 6, sont sensiblement encastrées à l'intérieur d'une masse de matériau ducts 14a, 14b, 14c, etc. and 15a, 15b, 15c, etc., which, in the finished integrated circuit device shown in FIG. 6, are substantially embedded within a mass of material
polymère 36.polymer 36.
On comprendra que, comme cela est classique, les parties conductrices l4a, 14b, 14c, etc., et 15a, 15b, 15c, etc. ont des parties bornes internes 14'a, 14'b, W4'e, etc. et 15'a, 15'b, 15'c, etc. auxquelles les bornes de la pastille de circuit intégré 12 seront connectées d'une manière qui sera décrite ci-après. Les It will be understood that, as is conventional, the conductive portions 14a, 14b, 14c, etc., and 15a, 15b, 15c, and so forth. have internal terminal parts 14'a, 14'b, W4'e, etc. and 15'a, 15'b, 15'c, etc. to which the terminals of the integrated circuit chip 12 will be connected in a manner to be described hereinafter. The
parties conductrices ont également des parties bornes intermé- conductive parts also have intermediate terminals
diaires 14"a, 14"b, 14"c, etc. et 15"a, 15"b, 15"c, etc., qui con- 14 "a, 14" b, 14 "c, etc. and 15" a, 15 "b, 15" c, etc., which
duisent aux parties bornes externes 14"'a, 14"'b, etc. et 15"'a, "'b, etc. dépassant du dispositif à circuit intégré fini que to the external terminal parts 14 "', 14"' b, etc. and 15 "a," b, etc. exceeding the finished integrated circuit device that
montre la figure 6 pour être connectées au circuit extérieur. shows Figure 6 to be connected to the external circuit.
Jusqu'à ce point de la description, le cadre de montage Up to this point in the description, the mounting frame
est sensiblement classique.is substantially conventional.
Selon l'invention, les parties conductrices 14a, 15a, qui définiront finalement les entrées du circuit d'alimentation sont initialement reliées au niveau de leurs extrémités 14'a, 15'a formant According to the invention, the conductive parts 14a, 15a, which will finally define the inputs of the supply circuit are initially connected at their ends 14'a, 15'a forming
des bornes internes par un pont central 16. internal terminals by a central bridge 16.
Les étapes suivantes de la fabrication du sous-ensemble de cadre de montage selon l'invention consistent en le sectionnement The following steps in the manufacture of the mounting frame subassembly according to the invention consist in sectioning
du pont central 16, sensiblement suivant une région 17 de section- of the central bridge 16, substantially following a region 17 of section-
nement centrale(voir figure 1) de manière à définir deux éléments métalliques distincts 18, 19. Au moyen d'un outil de conformation approprié, on fléchit ensuite les éléments 18, 19 de manière à définir des pattes verticales 21, 22 et des pattes horizon- 1) to define two distinct metal elements 18, 19. By means of a suitable shaping tool, the elements 18, 19 are then flexed so as to define vertical tabs 21, 22 and tabs. horizon-
tales 23, 24.23, 24.
Comme cela paralt plus clairement sur les figures 4 et 5, As it appears more clearly in FIGS. 4 and 5,
les pattes horizontales 23, 24 définissent des plates-formes de sup- the horizontal legs 23, 24 define support platforms
port pour un condensateur C, lequel est de préférence un condensa- port for a capacitor C, which is preferably a capacitor
teur du type céramique à plusieurs couches. Les bornes 25, 26 du condensateur sont électriquement et mécaniquement connectées, par exemple par soudage, aux pattes verticales 21, 22 et aux pattes ceramic type multilayer. The terminals 25, 26 of the capacitor are electrically and mechanically connected, for example by welding, to the vertical tabs 21, 22 and the tabs
horizontales 23, 24.horizontal 23, 24.
Le condensateur C contient une partie de surface supé- Capacitor C contains a higher surface area
rieure 27, qui constitue un lit ou support pour la pastille de cir- 27, which constitutes a bed or support for the pellet of
cuit intégré 12. De façon facultative mais préférée, la pastille 12 repose sur une couche d'époxy 28, ou une couche d'adhésif analogue, montée sur la surface supérieure 27 du condensateur C. Ensuite, on connecte les extrémités 14'a et 15'a formant les bornes intérieures aux bornes respectives P d'alimentation électrique de la pastille 12 12. Optionally but preferentially, the wafer 12 rests on an epoxy layer 28, or a layer of similar adhesive, mounted on the upper surface 27 of the capacitor C. Next, the ends 14'a and 15'a forming the inner terminals to the respective terminals P of power supply of the pellet 12
par des fils 30, de la manière classique. by wires 30, in the conventional manner.
Sur la base de la description qui vient d'être donnée, On the basis of the description that has just been given,
il est clair que la partie 14"'a formant une borne extérieure est maintenant, via la partie conductrice l4a, électriquement connectée à la borne terminale 26 du condensateur C. De la même manière, la partie 15"'a constituant la borne extérieure est, par l'intermédiaire de la partie conductrice l5a, électriquement connectée à la borne terminale 25 du condensateur, si bien que le condensateur se trouve disposé en pont sur les bornes P d'alimentation électrique de la it is clear that the portion 14 "'forming an outer terminal is now, via the conductive portion 14a, electrically connected to the terminal terminal 26 of the capacitor C. In the same way, the portion 15"' constituting the outer terminal is via the conductive portion 15a, electrically connected to the terminal terminal 25 of the capacitor, so that the capacitor is arranged in a bridge on the power supply terminals P of the
pastille de circuit intégré.integrated circuit chip.
Ensuite, on connecte de manière classique les autres Then we connect in a classic way the others
bornes T de la pastille 12 à l'aide de fils 30' aux extrémités res- terminals T of the pellet 12 using 30 'wires at the ends ends
pectives 14' et 15' constituant des bornes internes du cadre de montage 10, et on découpe la pièce réticulaire de manière à supprimer 14 'and 15' forming internal terminals of the mounting frame 10, and cutting the reticular piece to remove
les parties S reliant en parallèle les conducteurs (figure 1). the parts S connecting the conductors in parallel (Figure 1).
Une fois terminé le sous-ensemble comportant le cadre de montage, le condensateur et la pastille de circuit intégré 12, on immerge le sousensemble dans une masse de matériau polymère 36 pour former un bloc. Le Aoc de polymère enferme hermétiquement les éléments et maintient en position fixe les parties conductrices. On découpe alors chaque unité suivant les lignes 31, 31 de la figure 1 de manière que les parties conductrices 14a, 14b, etc., 15a, 15b, etc., soient séparées des parties restantes de la feuille et que seules After completing the subassembly comprising the mounting frame, the capacitor and the integrated circuit chip 12, the subassembly is immersed in a mass of polymeric material 36 to form a block. The polymer Aoc hermetically encloses the elements and maintains the conductive parts in a fixed position. Each unit is then cut along the lines 31, 31 of FIG. 1 so that the conductive portions 14a, 14b, etc., 15a, 15b, etc., are separated from the remaining portions of the sheet and that only
les extrémités 1411a, 14"b, etc., 15"a, 15"b, etc., des parties con- ends 1411a, 14 "b, etc., 15" a, 15 "b, etc.,
ductrices et les fils conducteurs M4"'a, etc., 15"'a, etc., fassent saillie du bloc 16 de matériau polymère. On courbe ensuite les fils 14"'a, etc., et 15"'a, etc., de manière à permettre l'insertion conductors and lead wires M4 "a, etc., etc.", etc., protrude from the block 16 of polymeric material. The wires 14 ", etc., and 15" a, etc., are then bent so as to allow insertion
dans les trous de montage d'une plaquette de circuit imprimé. in the mounting holes of a printed circuit board.
Comme l'homme de l'art l'aura compris, un sous-ensemble de cadre de montage comprenant un cadre de montage ou une série de cadresde montage interconnectés, chacun portant un condensateur, peut être fourni à des fabricants de dispositifs à circuits intégrés d'une manière qui les intéressera. Le fabricant peut traiter ces sous-ensembles de cadre de montage de la même manière quec'étaitlecas dans la technique antérieure. Toutefois, au lieu de monter la pastille de circuit intégré sur une partie métallique du cadre de montage comme dans la technique antérieure, le fabricant monte la pastille sur une couche d'époxy 28 qui peut être appliqué à la surface 27 du condensateur C juste avant la mise en place de la pastille de circuit intégré sur celui-ci, la résine époxy constituant un moyen de fixer la pastille de manière fixe. Les opérations de traitement ultérieures As will be understood by those skilled in the art, a mounting frame subassembly comprising a mounting frame or a series of interconnected mounting frames, each carrying a capacitor, may be provided to IC manufacturers. in a way that will interest them. The manufacturer can process these mounting frame subassemblies in the same manner as was the case in the prior art. However, instead of mounting the integrated circuit chip on a metal part of the mounting frame as in the prior art, the manufacturer mounts the chip on an epoxy layer 28 which can be applied to the surface 27 of the capacitor C just before placing the integrated circuit chip thereon, the epoxy resin constituting a means for fixedly securing the patch. Subsequent processing operations
qu'effectue le fabricant sont identiques à celles actuellement pra- made by the manufacturer are identical to those currently
tiquées dans la fabrication du dispositif à circuit intégré clas- in the manufacture of the Class IC device.
sique. Ainsi, après la mise en place et la fixation de la pastille de circuit intégré, les diverses connexions, comme par exemple les if that. Thus, after the introduction and fixing of the integrated circuit chip, the various connections, such as for example the
fils 30 et 30', sont établies entre les bornes internes appro- 30 and 30 'are set between the appropriate internal terminals
priées 14'a, 14'b, 14'c, etc., et l5'a, 15'b, 15'c, etc. du cadre de montage métallique et les bornes respectives P et T de la pastille de circuit intégré 12. On encastre ensuite l'unité dans une masse de matériau polymère de manière à former un bloc, puis on sépare l'unité de la partie restante de la feuille métallique et des fils conducteurs formés. 14'a, 14'b, 14'c, etc., and l5'a, 15'b, 15'c, etc. of the metal mounting frame and respective terminals P and T of the integrated circuit chip 12. The unit is then embedded in a mass of polymeric material so as to form a block, then the unit is separated from the remaining part of the the metal foil and formed conductive wires.
Z499768Z499768
Sur la base de la description qui vient d'être donnée, On the basis of the description that has just been given,
on appréciera qu'il est décrit selon l'invention un sous-ensemble de cadre de montage perfectionné destiné au montage d'une pastille de circuit intégré, se distinguant en ce qu'un condensateur est incorporé en juxtaposition intime avec la pastille de circuit intégré et ses bornes d'alimentation électrique. Puisque la connexion entre le condensateur et les bornes P d'alimentation électrique de la pastille se limite simplement à la longueur des fils courts 30 au lieu des fils 32, 33 relativement longs du dispositif de la technique antérieure (voir figure 7), les composants inductifs du circuit sont It will be appreciated that there is described according to the invention an improved mounting frame subassembly for mounting an integrated circuit chip, distinguished in that a capacitor is incorporated in intimate juxtaposition with the integrated circuit chip. and its power supply terminals. Since the connection between the capacitor and the power supply terminals P of the chip is simply limited to the length of the short wires 30 instead of the relatively long wires 32, 33 of the prior art device (see FIG. inductive circuit are
réduits au minimum, si bien que la capacité nécessaire à l'amortis- minimized, so that the capacity needed to
sement des impulsions de commutation produites est réduite sensi- the switching pulses produced is reduced substantially.
blement par comparaison avec celle de condensateurs de découplage compared to decoupling capacitors
placés extérieurement.placed externally.
On observera en outre que, selon l'invention, il est It will further be observed that, according to the invention, it is
décrit un dispositif à circuit intégré perfectionné portant un con- discloses an improved integrated circuit device carrying a
densateur d'amortissement interne, les dimensions externes du circuit intégré n'étant pas plus grandesque celles d'un dispositif à circuit intégré fabriqué de manière classique. On peut supprimer entièrement l'utilisation d'un condensateur de découplage externe, et obtenir une internal damping densifier, the external dimensions of the integrated circuit being no larger than those of an integrated circuit device manufactured conventionally. The use of an external decoupling capacitor can be completely eliminated, and a
réduction de l'encombrement et du colt. reduced congestion and colt.
Ayant compris que l'esprit de l'invention réside dans le concept consistant à utiliser, dans un dispositif de cadre de montage métallique classique, un élément capacitif qui définit le support structurel des composants du circuit, c'est-à-dire la pastille de circuit intégré, et fait fonction de condensateur de découplage, l'homme de l'art sera bien entendu en mesure d'imaginer, à partir du Having understood that the spirit of the invention lies in the concept of using, in a conventional metal mounting frame device, a capacitive element which defines the structural support of the components of the circuit, i.e. the tablet of an integrated circuit, and acts as a decoupling capacitor, the person skilled in the art will of course be able to imagine, from the
du dispositif dont la description vient d'être donnée à titre simple- the description of which has just been given in a simple
ment illustratif et nullement limitatif, diverses variantes et modi- illustrative and in no way limitative, various variants and modifications
fications ne sortant pas du cadre de l'invention. fications not departing from the scope of the invention.
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22412781A | 1981-01-12 | 1981-01-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2499768A1 true FR2499768A1 (en) | 1982-08-13 |
FR2499768B1 FR2499768B1 (en) | 1985-12-20 |
Family
ID=22839370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8115382A Expired FR2499768B1 (en) | 1981-01-12 | 1981-08-07 | INTEGRATED CIRCUIT DEVICE AND ITS MOUNTING SUB-ASSEMBLY |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS57126157A (en) |
CA (1) | CA1156771A (en) |
DE (1) | DE3130072A1 (en) |
FR (1) | FR2499768B1 (en) |
GB (1) | GB2091035B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954249A (en) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | Semiconductor device |
JPS5966157A (en) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
FR2550009B1 (en) * | 1983-07-29 | 1986-01-24 | Inf Milit Spatiale Aeronaut | ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR |
US4534105A (en) * | 1983-08-10 | 1985-08-13 | Rca Corporation | Method for grounding a pellet support pad in an integrated circuit device |
JPH0828447B2 (en) * | 1983-10-05 | 1996-03-21 | 富士通株式会社 | Method for manufacturing semiconductor device |
DE3410196A1 (en) * | 1984-03-20 | 1985-09-26 | Siemens AG, 1000 Berlin und 8000 München | Conductor strip for the mounting of integrated circuits |
US4612564A (en) * | 1984-06-04 | 1986-09-16 | At&T Bell Laboratories | Plastic integrated circuit package |
JPS61151349U (en) * | 1985-03-11 | 1986-09-18 | ||
FR2584865B1 (en) * | 1985-07-12 | 1988-06-17 | Inf Milit Spatiale Aeronaut | ELECTRONIC COMPONENT HAVING A CAPACITOR |
US5281846A (en) * | 1990-05-29 | 1994-01-25 | Texas Instruments Deutschland Gmbh | Electronic device having a discrete capacitor adherently mounted to a lead frame |
DE4017217A1 (en) * | 1990-05-29 | 1991-12-19 | Texas Instruments Deutschland | ELECTRONIC COMPONENT |
US5140496A (en) * | 1991-01-02 | 1992-08-18 | Honeywell, Inc. | Direct microcircuit decoupling |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3802069A (en) * | 1972-05-04 | 1974-04-09 | Gte Sylvania Inc | Fabricating packages for use in integrated circuits |
FR2256625A1 (en) * | 1973-12-28 | 1975-07-25 | Burroughs Corp | |
FR2456388A1 (en) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | ELECTRONIC CIRCUIT MICROBOX, AND HYBRID CIRCUIT HAVING SUCH A MICROBOX |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558286Y2 (en) * | 1974-11-20 | 1980-02-23 | ||
JPS55179055U (en) * | 1979-06-07 | 1980-12-23 |
-
1981
- 1981-06-16 GB GB8118481A patent/GB2091035B/en not_active Expired
- 1981-07-27 JP JP56117561A patent/JPS57126157A/en active Granted
- 1981-07-30 DE DE19813130072 patent/DE3130072A1/en not_active Withdrawn
- 1981-08-07 CA CA000383371A patent/CA1156771A/en not_active Expired
- 1981-08-07 FR FR8115382A patent/FR2499768B1/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3802069A (en) * | 1972-05-04 | 1974-04-09 | Gte Sylvania Inc | Fabricating packages for use in integrated circuits |
FR2256625A1 (en) * | 1973-12-28 | 1975-07-25 | Burroughs Corp | |
FR2456388A1 (en) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | ELECTRONIC CIRCUIT MICROBOX, AND HYBRID CIRCUIT HAVING SUCH A MICROBOX |
Also Published As
Publication number | Publication date |
---|---|
GB2091035A (en) | 1982-07-21 |
FR2499768B1 (en) | 1985-12-20 |
JPS6316906B2 (en) | 1988-04-11 |
JPS57126157A (en) | 1982-08-05 |
GB2091035B (en) | 1985-01-09 |
DE3130072A1 (en) | 1982-08-05 |
CA1156771A (en) | 1983-11-08 |
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