FR2432055A1 - Solution catalytique de depot non-galvanique de metaux et son procede de preparation - Google Patents
Solution catalytique de depot non-galvanique de metaux et son procede de preparationInfo
- Publication number
- FR2432055A1 FR2432055A1 FR7917824A FR7917824A FR2432055A1 FR 2432055 A1 FR2432055 A1 FR 2432055A1 FR 7917824 A FR7917824 A FR 7917824A FR 7917824 A FR7917824 A FR 7917824A FR 2432055 A1 FR2432055 A1 FR 2432055A1
- Authority
- FR
- France
- Prior art keywords
- catalytic
- preparation
- group
- metal deposition
- deposition solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003197 catalytic effect Effects 0.000 title abstract 4
- 238000001465 metallisation Methods 0.000 title 1
- 238000002360 preparation method Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 230000000737 periodic effect Effects 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 150000002739 metals Chemical group 0.000 abstract 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Catalysts (AREA)
- Chemically Coating (AREA)
Abstract
Solutions catalytiques. Solution catalytique de dépôt non-galvanique de métaux sur des substrats non électriquement conducteurs ou seulement partiellement conducteurs du type renfermant les produits de mélange et de réaction d'au moins un sel soluble d'un métal noble appartenant au groupe IB ou au groupe VIII de la classification périodique des éléments, d'au moins un sel soluble d'un métal appartenant au groupe IV de la classification périodique des éléments et d'un acide, caractérisée en ce qu'au moins une partie dudit axe est constituée par un acide sulfonique aliphatique pouvant former des complexes stables et catalytiquement actifs. Solutions catalytiques aqueuses.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT68768/78A IT1107840B (it) | 1978-07-25 | 1978-07-25 | Soluzione catalitica per la deposizione anelettrica di metalli |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2432055A1 true FR2432055A1 (fr) | 1980-02-22 |
FR2432055B1 FR2432055B1 (fr) | 1981-12-04 |
Family
ID=11310525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7917824A Granted FR2432055A1 (fr) | 1978-07-25 | 1979-07-10 | Solution catalytique de depot non-galvanique de metaux et son procede de preparation |
Country Status (6)
Country | Link |
---|---|
US (1) | US4244739A (fr) |
JP (1) | JPS5518595A (fr) |
DE (1) | DE2928699A1 (fr) |
FR (1) | FR2432055A1 (fr) |
GB (1) | GB2025782B (fr) |
IT (1) | IT1107840B (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59500870A (ja) * | 1982-05-26 | 1984-05-17 | マツクダ−ミツド インコ−ポレ−テツド | 非伝導性基板活性化触媒溶液および無電解メツキ方法 |
US4863758A (en) * | 1982-05-26 | 1989-09-05 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
US4741786A (en) * | 1986-06-10 | 1988-05-03 | Stanadyne, Inc. | Cold drawn free-machining steel bar including bismuth |
JP2649749B2 (ja) * | 1991-06-13 | 1997-09-03 | 石原薬品 株式会社 | 銅系素材上への選択的無電解めっき方法 |
US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
US5391395A (en) * | 1992-12-30 | 1995-02-21 | Witco Corporation | Method of preparing substrates for memory disk applications |
EP1162289A1 (fr) * | 2000-06-08 | 2001-12-12 | Lucent Technologies Inc. | Bain pour l'electrodeposition de palladium et processus pour l'electrodeposition |
DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
US20020062760A1 (en) * | 2000-11-06 | 2002-05-30 | Ronald Redline | Catalyst solutions useful in activating substrates for subsequent plating |
WO2002036273A1 (fr) * | 2000-11-06 | 2002-05-10 | Macdermid, Incorporated | Solutions catalytiques servant a activer des substrats avant leur metallisation |
US6645557B2 (en) | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
JP4069248B2 (ja) * | 2002-12-09 | 2008-04-02 | 大阪市 | 無電解めっき用触媒組成物 |
US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
CN103282545B (zh) * | 2010-09-03 | 2015-08-26 | Omg电子化学品有限责任公司 | 无电镍合金镀液及其沉积过程 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650913A (en) * | 1969-09-08 | 1972-03-21 | Macdermid Inc | An electroless plating process employing a specially prepared palladium-tin activator solution |
US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3874882A (en) * | 1972-02-09 | 1975-04-01 | Shipley Co | Catalyst solution for electroless deposition of metal on substrate |
-
1978
- 1978-07-25 IT IT68768/78A patent/IT1107840B/it active
-
1979
- 1979-07-10 FR FR7917824A patent/FR2432055A1/fr active Granted
- 1979-07-10 US US06/056,398 patent/US4244739A/en not_active Expired - Lifetime
- 1979-07-11 GB GB7924130A patent/GB2025782B/en not_active Expired
- 1979-07-16 DE DE19792928699 patent/DE2928699A1/de active Granted
- 1979-07-20 JP JP9251979A patent/JPS5518595A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
IT1107840B (it) | 1985-12-02 |
DE2928699A1 (de) | 1980-02-07 |
IT7868768A0 (it) | 1978-07-25 |
FR2432055B1 (fr) | 1981-12-04 |
DE2928699C2 (fr) | 1988-03-24 |
GB2025782A (en) | 1980-01-30 |
GB2025782B (en) | 1983-04-27 |
US4244739A (en) | 1981-01-13 |
JPS5518595A (en) | 1980-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |