FR2426334A1 - Dispositif de connexion de semi-conducteurs et son procede de fabrication - Google Patents
Dispositif de connexion de semi-conducteurs et son procede de fabricationInfo
- Publication number
- FR2426334A1 FR2426334A1 FR7814918A FR7814918A FR2426334A1 FR 2426334 A1 FR2426334 A1 FR 2426334A1 FR 7814918 A FR7814918 A FR 7814918A FR 7814918 A FR7814918 A FR 7814918A FR 2426334 A1 FR2426334 A1 FR 2426334A1
- Authority
- FR
- France
- Prior art keywords
- power supply
- substrate
- semiconductor device
- insulating layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
L'invention concerne un perfectionnement apporté à la formation des connexions d'un dispositif à semi-conducteurs. Dans le dispositif de l'invention, la ligne commune d'alimentation électrique 2 est surmontée par un fil métallique supplémentaire 3 d'épaisseur moindre. Ainsi, les connexions selon l'invention peuvent supporter le passage d'un courant important, ayant des variations importantes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7814918A FR2426334A1 (fr) | 1978-05-19 | 1978-05-19 | Dispositif de connexion de semi-conducteurs et son procede de fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7814918A FR2426334A1 (fr) | 1978-05-19 | 1978-05-19 | Dispositif de connexion de semi-conducteurs et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2426334A1 true FR2426334A1 (fr) | 1979-12-14 |
FR2426334B1 FR2426334B1 (fr) | 1982-12-17 |
Family
ID=9208468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7814918A Granted FR2426334A1 (fr) | 1978-05-19 | 1978-05-19 | Dispositif de connexion de semi-conducteurs et son procede de fabrication |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2426334A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0103362A2 (fr) * | 1982-06-30 | 1984-03-21 | Fujitsu Limited | Dispositif semi-conducteur comprenant des lignes de puissance |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2170846A1 (fr) * | 1972-02-03 | 1973-09-21 | Garyainov Stanislav | |
FR2192383A1 (fr) * | 1972-07-10 | 1974-02-08 | Amdahl Corp | |
FR2227637A1 (fr) * | 1973-04-30 | 1974-11-22 | Hughes Aircraft Co |
-
1978
- 1978-05-19 FR FR7814918A patent/FR2426334A1/fr active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2170846A1 (fr) * | 1972-02-03 | 1973-09-21 | Garyainov Stanislav | |
FR2192383A1 (fr) * | 1972-07-10 | 1974-02-08 | Amdahl Corp | |
FR2227637A1 (fr) * | 1973-04-30 | 1974-11-22 | Hughes Aircraft Co |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0103362A2 (fr) * | 1982-06-30 | 1984-03-21 | Fujitsu Limited | Dispositif semi-conducteur comprenant des lignes de puissance |
EP0103362A3 (en) * | 1982-06-30 | 1985-07-03 | Fujitsu Limited | Semiconductor device with power lines |
Also Published As
Publication number | Publication date |
---|---|
FR2426334B1 (fr) | 1982-12-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |