FR2408219A1 - SEMICONDUCTOR COMPONENT READY TO BE CONNECTED - Google Patents

SEMICONDUCTOR COMPONENT READY TO BE CONNECTED

Info

Publication number
FR2408219A1
FR2408219A1 FR7831067A FR7831067A FR2408219A1 FR 2408219 A1 FR2408219 A1 FR 2408219A1 FR 7831067 A FR7831067 A FR 7831067A FR 7831067 A FR7831067 A FR 7831067A FR 2408219 A1 FR2408219 A1 FR 2408219A1
Authority
FR
France
Prior art keywords
semiconductor component
component ready
ready
contracting
capsule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7831067A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2408219A1 publication Critical patent/FR2408219A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Thyristors (AREA)

Abstract

COMPOSANT A SEMI-CONDUCTEUR COMPRENANT UN CORPS EN DISQUE A AU MOINS UNE JONCTION PN. LE COMPOSANT 1, 2, 3 COMPREND UN BOITIER FORME D'UNE CAPSULE 4 SE CONTRACTANT PAR RETRAIT. APPLICATION ESSENTIELLEMENT AUX DIODES ET THYRISTORS DE PUISSANCE.SEMICONDUCTOR COMPONENT INCLUDING A DISC BODY HAS AT LEAST ONE PN JUNCTION. COMPONENT 1, 2, 3 CONSISTS OF A BOX SHAPED OF A CAPSULE 4 CONTRACTING BY REMOVAL. APPLICATION ESSENTIALLY TO DIODES AND POWER THYRISTORS.

FR7831067A 1977-11-04 1978-11-02 SEMICONDUCTOR COMPONENT READY TO BE CONNECTED Withdrawn FR2408219A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772749359 DE2749359A1 (en) 1977-11-04 1977-11-04 READY-TO-CONNECT SEMI-CONDUCTOR COMPONENT

Publications (1)

Publication Number Publication Date
FR2408219A1 true FR2408219A1 (en) 1979-06-01

Family

ID=6022992

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7831067A Withdrawn FR2408219A1 (en) 1977-11-04 1978-11-02 SEMICONDUCTOR COMPONENT READY TO BE CONNECTED

Country Status (4)

Country Link
JP (1) JPS5469070A (en)
DE (1) DE2749359A1 (en)
FR (1) FR2408219A1 (en)
GB (1) GB2007431A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3221794A1 (en) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim DISC-SHAPED SEMICONDUCTOR CELL FOR PRESSURE-CONTACTABLE POWER SEMICONDUCTOR COMPONENTS
DE19839422A1 (en) * 1998-08-29 2000-03-02 Asea Brown Boveri Explosion protection for semiconductor modules
EP3879556A1 (en) * 2020-03-11 2021-09-15 ABB Schweiz AG Power component including a main component and a sensor and emitter unit and system with the power component

Also Published As

Publication number Publication date
JPS5469070A (en) 1979-06-02
GB2007431A (en) 1979-05-16
DE2749359A1 (en) 1979-05-10

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Legal Events

Date Code Title Description
ST Notification of lapse