FR2398779A1 - Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties - Google Patents

Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties

Info

Publication number
FR2398779A1
FR2398779A1 FR7723520A FR7723520A FR2398779A1 FR 2398779 A1 FR2398779 A1 FR 2398779A1 FR 7723520 A FR7723520 A FR 7723520A FR 7723520 A FR7723520 A FR 7723520A FR 2398779 A1 FR2398779 A1 FR 2398779A1
Authority
FR
France
Prior art keywords
filler
compsns
wax
coupling agent
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7723520A
Other languages
French (fr)
Other versions
FR2398779B1 (en
Inventor
Harold W Tuller
Ralph W Nussbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allied Corp
Original Assignee
Allied Chemical and Dye Corp
Allied Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Chemical and Dye Corp, Allied Chemical Corp filed Critical Allied Chemical and Dye Corp
Priority to FR7723520A priority Critical patent/FR2398779A1/en
Publication of FR2398779A1 publication Critical patent/FR2398779A1/en
Application granted granted Critical
Publication of FR2398779B1 publication Critical patent/FR2398779B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02Organic and inorganic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Compsn. comprises (a) an epoxide cpd. with >=2 1,2-epoxide gps., (b) hardener selected from (i) polyanhydride of m.wt. 1000 comprising the reaction prod. of a maleic monomer and >=1 alkyl styrene monomers and (ii) pre-polymers of (i) and the epoxide, (c) curing catalyst, (d) 55-75 wt. % of a silica filler, (e) 10-20 wt.% calcined clay Sb2O3, Sb tetraoxide, Ca silicate, TiO2, CaCO3, ZnO, MgO or mixts. as additional filler, (f) 0.01-2 wt.% of carnauba wax, montanic acid ester wax, polyethylene wax and/or PTFE wax lubricant, and (g) 0.05-2 wt.% of silane coupling agent. The presence of (e), (f) and (g) improves the high temp. wet electrical props of the compsn., when heat cured, as indicated by a decreased % change of the dielectric loss index measured after exposure to 15 psig steam for 16 hr from the dielectric loss index measured under dry conditions at 25%. Compsns. are used to encapsulate semiconductors.
FR7723520A 1977-07-29 1977-07-29 Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties Granted FR2398779A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7723520A FR2398779A1 (en) 1977-07-29 1977-07-29 Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7723520A FR2398779A1 (en) 1977-07-29 1977-07-29 Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties

Publications (2)

Publication Number Publication Date
FR2398779A1 true FR2398779A1 (en) 1979-02-23
FR2398779B1 FR2398779B1 (en) 1984-06-15

Family

ID=9194043

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7723520A Granted FR2398779A1 (en) 1977-07-29 1977-07-29 Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties

Country Status (1)

Country Link
FR (1) FR2398779A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3789038A (en) * 1970-10-16 1974-01-29 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3813379A (en) * 1970-12-14 1974-05-28 Motorola Inc Thermally stabilized thermosetting plastic material,and article

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3789038A (en) * 1970-10-16 1974-01-29 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3813379A (en) * 1970-12-14 1974-05-28 Motorola Inc Thermally stabilized thermosetting plastic material,and article

Also Published As

Publication number Publication date
FR2398779B1 (en) 1984-06-15

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse