FR2381567A1 - Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board - Google Patents

Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board

Info

Publication number
FR2381567A1
FR2381567A1 FR7705482A FR7705482A FR2381567A1 FR 2381567 A1 FR2381567 A1 FR 2381567A1 FR 7705482 A FR7705482 A FR 7705482A FR 7705482 A FR7705482 A FR 7705482A FR 2381567 A1 FR2381567 A1 FR 2381567A1
Authority
FR
France
Prior art keywords
board
appts
esp
printed circuit
mfg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7705482A
Other languages
French (fr)
Other versions
FR2381567B1 (en
Inventor
Michel Tribout
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Priority to FR7705482A priority Critical patent/FR2381567A1/en
Priority to DE19782807593 priority patent/DE2807593A1/en
Priority to US05/880,845 priority patent/US4162952A/en
Priority to JP1993678A priority patent/JPS53124129A/en
Publication of FR2381567A1 publication Critical patent/FR2381567A1/en
Application granted granted Critical
Publication of FR2381567B1 publication Critical patent/FR2381567B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Jet electrolysis appts. for the deposition or removal of metal on workpieces which are at least partly conducting is claimed. The workpiece esp. a printed circuit board travels through a tank fitted with sealing lips at its inlet and outlet. In the tank are pairs of driven rollers through which the board travels, and also other rollers on which the board rests. Nozzle provide rectangular or other streams of electrolyte flowing in a direction at 90 degrees to the direction in which the board travels, and >=1 sliding contact is used which travels on a selected zone of the board or on an endless conducting grid carried by the board. Appts. is used esp. for mfg. printed circuit boards by photo-electrodeposition, where a row of tanks is used, the outlet contact on one tank forming the inlet contact for the next tank. Used in conjunction with photoresist e.g. to deposit Cu in holes in a board.
FR7705482A 1977-02-24 1977-02-24 Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board Granted FR2381567A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7705482A FR2381567A1 (en) 1977-02-24 1977-02-24 Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board
DE19782807593 DE2807593A1 (en) 1977-02-24 1978-02-22 JET ELECTROLYSIS DEVICE
US05/880,845 US4162952A (en) 1977-02-24 1978-02-23 Apparatus for electrolysis by projection
JP1993678A JPS53124129A (en) 1977-02-24 1978-02-24 Electrolytic treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7705482A FR2381567A1 (en) 1977-02-24 1977-02-24 Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board

Publications (2)

Publication Number Publication Date
FR2381567A1 true FR2381567A1 (en) 1978-09-22
FR2381567B1 FR2381567B1 (en) 1979-09-14

Family

ID=9187205

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7705482A Granted FR2381567A1 (en) 1977-02-24 1977-02-24 Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board

Country Status (3)

Country Link
JP (1) JPS53124129A (en)
DE (1) DE2807593A1 (en)
FR (1) FR2381567A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006094657A1 (en) 2005-03-04 2006-09-14 Gebr. Schmid Gmbh & Co. Device and method for the etching of substrates

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE8006907L (en) * 1979-10-06 1981-04-07 Warner Lambert Co CUTTING ELEMENT WITH PROCEDURES FOR MANUFACTURING ITS
JPS57110690A (en) * 1980-12-24 1982-07-09 Ibm Growing of tentrite by electroplating

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334028A (en) * 1966-08-02 1967-08-01 Day Company Method of electroplating selected areas
CH527912A (en) * 1971-07-16 1972-09-15 Prochimie Engineering Machine for electroplating at least one area of a conductive part
DE2408617A1 (en) * 1973-02-23 1974-09-12 Tetsuya Hojyo METHOD AND DEVICE FOR CONTINUOUS AND PARTIAL COATING OF A METAL STRIP
DE2508777A1 (en) * 1975-02-05 1976-09-09 Siemens Ag Selective electroplating using sprays of electrolyte - esp gold plating lead frames for integrated circuits

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334028A (en) * 1966-08-02 1967-08-01 Day Company Method of electroplating selected areas
CH527912A (en) * 1971-07-16 1972-09-15 Prochimie Engineering Machine for electroplating at least one area of a conductive part
DE2408617A1 (en) * 1973-02-23 1974-09-12 Tetsuya Hojyo METHOD AND DEVICE FOR CONTINUOUS AND PARTIAL COATING OF A METAL STRIP
DE2508777A1 (en) * 1975-02-05 1976-09-09 Siemens Ag Selective electroplating using sprays of electrolyte - esp gold plating lead frames for integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006094657A1 (en) 2005-03-04 2006-09-14 Gebr. Schmid Gmbh & Co. Device and method for the etching of substrates

Also Published As

Publication number Publication date
FR2381567B1 (en) 1979-09-14
JPS53124129A (en) 1978-10-30
DE2807593A1 (en) 1978-08-31

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Legal Events

Date Code Title Description
CL Concession to grant licences
CL Concession to grant licences
CD Change of name or company name
RL Termination of a licence
TP Transmission of property
TP Transmission of property
ST Notification of lapse