FR2317770A1 - Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires - Google Patents
Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similairesInfo
- Publication number
- FR2317770A1 FR2317770A1 FR7619343A FR7619343A FR2317770A1 FR 2317770 A1 FR2317770 A1 FR 2317770A1 FR 7619343 A FR7619343 A FR 7619343A FR 7619343 A FR7619343 A FR 7619343A FR 2317770 A1 FR2317770 A1 FR 2317770A1
- Authority
- FR
- France
- Prior art keywords
- realization
- integrated
- electronic components
- similar type
- conductive filaments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
- C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
- C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
- C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59057275A | 1975-06-26 | 1975-06-26 | |
US05/667,541 US4140265A (en) | 1975-06-26 | 1976-03-16 | Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2317770A1 true FR2317770A1 (fr) | 1977-02-04 |
FR2317770B1 FR2317770B1 (fr) | 1978-05-05 |
Family
ID=27080881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7619343A Granted FR2317770A1 (fr) | 1975-06-26 | 1976-06-25 | Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS524173A (fr) |
AT (1) | AT368320B (fr) |
AU (1) | AU507497B2 (fr) |
CA (1) | CA1088281A (fr) |
CH (1) | CH612296A5 (fr) |
DE (1) | DE2628519C3 (fr) |
FR (1) | FR2317770A1 (fr) |
GB (1) | GB1541274A (fr) |
IT (1) | IT1066563B (fr) |
NL (1) | NL7606943A (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57143717A (en) * | 1981-03-03 | 1982-09-06 | Nippon Telegr & Teleph Corp <Ntt> | Magnetic head for magnetic disk |
GB2177639B (en) * | 1985-07-08 | 1988-12-29 | Philips Electronic Associated | Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith |
DE4218741C2 (de) * | 1992-06-06 | 1994-10-20 | Vossloh Schwabe Gmbh | Verfahren zum Verdrahten von Anschlußstellen elektrischer Geräte oder Baugruppenelemente |
JPH07103897A (ja) * | 1993-09-30 | 1995-04-21 | Shimadzu Corp | 発光分光分析装置 |
DE102008048081B4 (de) * | 2008-09-19 | 2015-06-18 | Cascade Microtech, Inc. | Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1127439A (en) * | 1964-11-26 | 1968-09-18 | Philips Electronic Associated | Improvements in and relating to methods of manufacturing semiconductor devices |
US3648354A (en) * | 1969-11-17 | 1972-03-14 | Gen Motors Corp | Tailless bonder for filamentary wire leads |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE755950A (fr) * | 1969-09-11 | 1971-03-09 | Philips Nv | Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation |
-
1976
- 1976-05-27 AU AU14370/76A patent/AU507497B2/en not_active Expired
- 1976-06-21 GB GB25711/76A patent/GB1541274A/en not_active Expired
- 1976-06-22 CH CH795776A patent/CH612296A5/xx not_active IP Right Cessation
- 1976-06-22 CA CA255,403A patent/CA1088281A/fr not_active Expired
- 1976-06-23 DE DE2628519A patent/DE2628519C3/de not_active Expired
- 1976-06-23 AT AT0458876A patent/AT368320B/de not_active IP Right Cessation
- 1976-06-24 JP JP51075964A patent/JPS524173A/ja active Granted
- 1976-06-25 IT IT50151/76A patent/IT1066563B/it active
- 1976-06-25 FR FR7619343A patent/FR2317770A1/fr active Granted
- 1976-06-25 NL NL7606943A patent/NL7606943A/xx not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1127439A (en) * | 1964-11-26 | 1968-09-18 | Philips Electronic Associated | Improvements in and relating to methods of manufacturing semiconductor devices |
US3648354A (en) * | 1969-11-17 | 1972-03-14 | Gen Motors Corp | Tailless bonder for filamentary wire leads |
Also Published As
Publication number | Publication date |
---|---|
CA1088281A (fr) | 1980-10-28 |
DE2628519C3 (de) | 1981-06-04 |
DE2628519A1 (de) | 1976-12-30 |
DE2628519B2 (de) | 1980-10-02 |
JPS5750057B2 (fr) | 1982-10-25 |
ATA458876A (de) | 1982-01-15 |
GB1541274A (en) | 1979-02-28 |
NL7606943A (nl) | 1976-12-28 |
FR2317770B1 (fr) | 1978-05-05 |
AU507497B2 (en) | 1980-02-14 |
AU1437076A (en) | 1977-12-01 |
JPS524173A (en) | 1977-01-13 |
IT1066563B (it) | 1985-03-12 |
AT368320B (de) | 1982-10-11 |
CH612296A5 (en) | 1979-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |