FR2207401A1 - - Google Patents

Info

Publication number
FR2207401A1
FR2207401A1 FR7241432A FR7241432A FR2207401A1 FR 2207401 A1 FR2207401 A1 FR 2207401A1 FR 7241432 A FR7241432 A FR 7241432A FR 7241432 A FR7241432 A FR 7241432A FR 2207401 A1 FR2207401 A1 FR 2207401A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7241432A
Other languages
French (fr)
Other versions
FR2207401B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INFORMATIQUE CIE INTERNA FR
Original Assignee
INFORMATIQUE CIE INTERNA FR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INFORMATIQUE CIE INTERNA FR filed Critical INFORMATIQUE CIE INTERNA FR
Priority to FR7241432A priority Critical patent/FR2207401B1/fr
Publication of FR2207401A1 publication Critical patent/FR2207401A1/fr
Application granted granted Critical
Publication of FR2207401B1 publication Critical patent/FR2207401B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
FR7241432A 1972-11-22 1972-11-22 Expired FR2207401B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7241432A FR2207401B1 (en) 1972-11-22 1972-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7241432A FR2207401B1 (en) 1972-11-22 1972-11-22

Publications (2)

Publication Number Publication Date
FR2207401A1 true FR2207401A1 (en) 1974-06-14
FR2207401B1 FR2207401B1 (en) 1975-09-12

Family

ID=9107505

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7241432A Expired FR2207401B1 (en) 1972-11-22 1972-11-22

Country Status (1)

Country Link
FR (1) FR2207401B1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413016A1 (en) * 1977-12-26 1979-07-20 Radiotechnique Compelec Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate
FR2541511A1 (en) * 1983-02-22 1984-08-24 Smiths Industries Plc SUBSTRATE FOR SUPPORTING INTEGRATED CIRCUITS
EP0256778A2 (en) * 1986-08-08 1988-02-24 Ronald Krajewski Multi-layer printed circuit structure
EP0296019A1 (en) * 1987-06-16 1988-12-21 Thomson-Csf Support for a printed circuit forming a heat sink with a controlled dilatation, and manufacturing process
WO1989001282A1 (en) * 1987-08-03 1989-02-09 Allied-Signal Inc. Method for the manufacture of multilayer printed circuit boards
EP0432044A1 (en) * 1989-12-08 1991-06-12 Thomson-Csf III-V-Compound power transistor in silicon substrate and method of fabrication
EP0590354A1 (en) * 1992-09-29 1994-04-06 Robert Bosch Gmbh Device with a board, a heat sink and at least one power component
EP0600590A1 (en) * 1992-12-03 1994-06-08 International Computers Limited Cooling electronic circuit assemblies
FR2706730A1 (en) * 1993-06-18 1994-12-23 Sagem Power electronics module having a heat-sink support

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145771A (en) * 1965-03-18 1969-03-19 Litton Industries Inc Electrical circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145771A (en) * 1965-03-18 1969-03-19 Litton Industries Inc Electrical circuit boards

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413016A1 (en) * 1977-12-26 1979-07-20 Radiotechnique Compelec Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate
FR2541511A1 (en) * 1983-02-22 1984-08-24 Smiths Industries Plc SUBSTRATE FOR SUPPORTING INTEGRATED CIRCUITS
EP0256778A3 (en) * 1986-08-08 1989-03-08 Ronald Krajewski Multi-layer printed circuit structure
EP0256778A2 (en) * 1986-08-08 1988-02-24 Ronald Krajewski Multi-layer printed circuit structure
AU603450B2 (en) * 1987-06-16 1990-11-15 Thomson-Csf Mounting for printed circuit forming a heat sink with controlled expansion
FR2616997A1 (en) * 1987-06-16 1988-12-23 Thomson Csf SUPPORT FOR PRINTED CIRCUIT, FORMING THERMAL DRAIN WITH CONTROLLED EXPANSION, AND METHOD OF MANUFACTURE
US4878152A (en) * 1987-06-16 1989-10-31 Thomson-Csf Mounting for printed circuits forming a heat sink with controlled expansion
EP0296019A1 (en) * 1987-06-16 1988-12-21 Thomson-Csf Support for a printed circuit forming a heat sink with a controlled dilatation, and manufacturing process
WO1989001282A1 (en) * 1987-08-03 1989-02-09 Allied-Signal Inc. Method for the manufacture of multilayer printed circuit boards
EP0432044A1 (en) * 1989-12-08 1991-06-12 Thomson-Csf III-V-Compound power transistor in silicon substrate and method of fabrication
FR2655774A1 (en) * 1989-12-08 1991-06-14 Thomson Csf IMPROVEMENT TO POWER TRANSISTORS IN III-V MATERIALS ON SILICON SUBSTRATE AND METHOD OF MANUFACTURE
US5138407A (en) * 1989-12-08 1992-08-11 Thomson - Csf Transistor made of 3-5 group semiconductor materials on a silicon substrate
EP0590354A1 (en) * 1992-09-29 1994-04-06 Robert Bosch Gmbh Device with a board, a heat sink and at least one power component
US5375039A (en) * 1992-09-29 1994-12-20 Robert Bosch Gmbh Circuit board heat dissipation layering arrangement
EP0600590A1 (en) * 1992-12-03 1994-06-08 International Computers Limited Cooling electronic circuit assemblies
FR2706730A1 (en) * 1993-06-18 1994-12-23 Sagem Power electronics module having a heat-sink support

Also Published As

Publication number Publication date
FR2207401B1 (en) 1975-09-12

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