FI945444A - Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi - Google Patents
Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi Download PDFInfo
- Publication number
- FI945444A FI945444A FI945444A FI945444A FI945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A
- Authority
- FI
- Finland
- Prior art keywords
- gild
- circuit board
- mount holes
- coated circuit
- processing dip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI945444A FI109642B (fi) | 1994-11-18 | 1994-11-18 | Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi |
GB9523567A GB2295114B (en) | 1994-11-18 | 1995-11-17 | Method and means for treating the through holes of immersion gold plated printed circuit boards |
DE19543021A DE19543021A1 (de) | 1994-11-18 | 1995-11-18 | Verfahren und Mittel zur Behandlung von Durchkontaktlöchern in mit Tauchvergoldung beschichteten Leiterplatten |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI945444 | 1994-11-18 | ||
FI945444A FI109642B (fi) | 1994-11-18 | 1994-11-18 | Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi |
Publications (3)
Publication Number | Publication Date |
---|---|
FI945444A0 FI945444A0 (fi) | 1994-11-18 |
FI945444A true FI945444A (fi) | 1996-05-19 |
FI109642B FI109642B (fi) | 2002-09-13 |
Family
ID=8541829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI945444A FI109642B (fi) | 1994-11-18 | 1994-11-18 | Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE19543021A1 (fi) |
FI (1) | FI109642B (fi) |
GB (1) | GB2295114B (fi) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4029168B2 (ja) | 2003-02-18 | 2008-01-09 | 株式会社村田製作所 | 電子部品の製造方法 |
US10172243B2 (en) | 2016-11-14 | 2019-01-01 | International Business Machines Corporation | Printed circuit board and methods to enhance reliability |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2257386B (en) * | 1991-06-24 | 1995-07-05 | Tani Denki Kogyo Kk | Screen printing apparatus |
-
1994
- 1994-11-18 FI FI945444A patent/FI109642B/fi active
-
1995
- 1995-11-17 GB GB9523567A patent/GB2295114B/en not_active Expired - Fee Related
- 1995-11-18 DE DE19543021A patent/DE19543021A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2295114A (en) | 1996-05-22 |
DE19543021A1 (de) | 1996-05-23 |
GB2295114B (en) | 1998-07-08 |
FI945444A0 (fi) | 1994-11-18 |
FI109642B (fi) | 2002-09-13 |
GB9523567D0 (en) | 1996-01-17 |
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