FI20145454A - Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö - Google Patents
Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttöInfo
- Publication number
- FI20145454A FI20145454A FI20145454A FI20145454A FI20145454A FI 20145454 A FI20145454 A FI 20145454A FI 20145454 A FI20145454 A FI 20145454A FI 20145454 A FI20145454 A FI 20145454A FI 20145454 A FI20145454 A FI 20145454A
- Authority
- FI
- Finland
- Prior art keywords
- preparing
- mems structure
- mems
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00412—Mask characterised by its behaviour during the etching process, e.g. soluble masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00373—Selective deposition, e.g. printing or microcontact printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00396—Mask characterised by its composition, e.g. multilayer masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00404—Mask characterised by its size, orientation or shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00531—Dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00611—Processes for the planarisation of structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5663—Manufacturing; Trimming; Mounting; Housings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20145454A FI127168B (fi) | 2014-05-20 | 2014-05-20 | Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö |
US14/706,095 US9556021B2 (en) | 2014-05-20 | 2015-05-07 | Method of manufacturing a MEMS structure and use of the method |
EP15727469.7A EP3145857B1 (en) | 2014-05-20 | 2015-05-12 | Method of manufacturing a mems structure and use of the method |
PCT/IB2015/053480 WO2015177681A1 (en) | 2014-05-20 | 2015-05-12 | Method of manufacturing a mems structure and use of the method |
EP15729235.0A EP3145858B1 (en) | 2014-05-20 | 2015-05-15 | Method of manufacturing a mems structure |
TW104115337A TWI628138B (zh) | 2014-05-20 | 2015-05-15 | 一種製造一微機電系統結構的方法 |
PCT/IB2015/053580 WO2015177694A1 (en) | 2014-05-20 | 2015-05-15 | Method of manufacturing a mems structure |
US14/712,987 US9334160B2 (en) | 2014-05-20 | 2015-05-15 | Method of manufacturing a MEMS structure |
TW104115724A TWI612010B (zh) | 2014-05-20 | 2015-05-18 | 製造微機電系統結構的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20145454A FI127168B (fi) | 2014-05-20 | 2014-05-20 | Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20145454A true FI20145454A (fi) | 2015-11-21 |
FI127168B FI127168B (fi) | 2017-12-29 |
Family
ID=53298567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20145454A FI127168B (fi) | 2014-05-20 | 2014-05-20 | Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö |
Country Status (5)
Country | Link |
---|---|
US (2) | US9556021B2 (fi) |
EP (2) | EP3145857B1 (fi) |
FI (1) | FI127168B (fi) |
TW (2) | TWI628138B (fi) |
WO (2) | WO2015177681A1 (fi) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105445495B (zh) * | 2014-07-16 | 2018-11-02 | 中国科学院地质与地球物理研究所 | 一种对称的mems加速度敏感芯片及其制造工艺 |
CN106672896B (zh) * | 2017-01-12 | 2017-11-07 | 广东工业大学 | 一种任意三维微结构的加工方法 |
US10807863B2 (en) | 2017-05-30 | 2020-10-20 | Murata Manufacturing Co., Ltd. | Method for manufacturing micromechanical structures in a device wafer |
EP3656733A1 (en) * | 2018-11-23 | 2020-05-27 | Murata Manufacturing Co., Ltd. | Method for etching recessed structures |
JP2020122740A (ja) * | 2019-01-31 | 2020-08-13 | セイコーエプソン株式会社 | 構造体形成方法およびデバイス |
CN110161282B (zh) * | 2019-05-22 | 2021-03-30 | 龙微科技无锡有限公司 | 基于son结构的压阻式加速度传感器的制作方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5045898A (en) * | 1988-08-30 | 1991-09-03 | At&T Bell Laboratories | CMOS integrated circuit having improved isolation |
US5919548A (en) * | 1996-10-11 | 1999-07-06 | Sandia Corporation | Chemical-mechanical polishing of recessed microelectromechanical devices |
US6811853B1 (en) | 2000-03-06 | 2004-11-02 | Shipley Company, L.L.C. | Single mask lithographic process for patterning multiple types of surface features |
US6627096B2 (en) * | 2000-05-02 | 2003-09-30 | Shipley Company, L.L.C. | Single mask technique for making positive and negative micromachined features on a substrate |
KR100373739B1 (ko) | 2001-05-07 | 2003-02-26 | 조동일 | 단결정 실리콘 웨이퍼 한 장를 이용한 정전형 수직구동기의 제조 방법 |
TW521062B (en) | 2002-03-05 | 2003-02-21 | Walsin Lihwa Corp | Corner compensation method and structure constructed by the same |
TWI234819B (en) | 2003-05-06 | 2005-06-21 | Walsin Lihwa Corp | Selective etch method for side wall protection and structure formed using the method |
KR100574465B1 (ko) | 2004-05-21 | 2006-04-27 | 삼성전자주식회사 | 수직 단차 구조물의 제작 방법 |
US7449355B2 (en) | 2005-04-27 | 2008-11-11 | Robert Bosch Gmbh | Anti-stiction technique for electromechanical systems and electromechanical device employing same |
JP2007219303A (ja) | 2006-02-17 | 2007-08-30 | Hitachi Ltd | マイクロレンズ用型の製造方法 |
EP2098822B8 (en) | 2008-03-05 | 2015-08-12 | Colibrys S.A. | Vibrating gyroscope with quadrature signals reduction |
US8043973B2 (en) | 2008-05-22 | 2011-10-25 | Texas Instruments Incorporated | Mask overhang reduction or elimination after substrate etch |
WO2011148973A1 (ja) | 2010-05-25 | 2011-12-01 | ローム株式会社 | 圧力センサおよび圧力センサの製造方法 |
US7998776B1 (en) | 2010-06-10 | 2011-08-16 | Memsensing Microsystems Technology Co., Ltd. | Methods for manufacturing MEMS sensor and thin film thereof with improved etching process |
CN201828268U (zh) * | 2010-09-28 | 2011-05-11 | 深迪半导体(上海)有限公司 | 一种超小型mems陀螺仪传感器 |
US8394718B1 (en) | 2011-09-12 | 2013-03-12 | International Business Machines Corporation | Methods of forming self-aligned through silicon via |
TW201322366A (zh) | 2011-11-18 | 2013-06-01 | Chuan-Wei Wang | 感測器製程 |
CN102602881B (zh) | 2012-04-01 | 2014-04-09 | 杭州士兰集成电路有限公司 | Mems封帽硅片的多硅槽形成方法及其刻蚀掩膜结构 |
US8673765B2 (en) * | 2012-06-01 | 2014-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for back end of line semiconductor device processing |
-
2014
- 2014-05-20 FI FI20145454A patent/FI127168B/fi active IP Right Grant
-
2015
- 2015-05-07 US US14/706,095 patent/US9556021B2/en active Active
- 2015-05-12 EP EP15727469.7A patent/EP3145857B1/en active Active
- 2015-05-12 WO PCT/IB2015/053480 patent/WO2015177681A1/en active Application Filing
- 2015-05-15 US US14/712,987 patent/US9334160B2/en active Active
- 2015-05-15 TW TW104115337A patent/TWI628138B/zh active
- 2015-05-15 EP EP15729235.0A patent/EP3145858B1/en active Active
- 2015-05-15 WO PCT/IB2015/053580 patent/WO2015177694A1/en active Application Filing
- 2015-05-18 TW TW104115724A patent/TWI612010B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20150336793A1 (en) | 2015-11-26 |
US9334160B2 (en) | 2016-05-10 |
TWI628138B (zh) | 2018-07-01 |
EP3145858A1 (en) | 2017-03-29 |
FI127168B (fi) | 2017-12-29 |
US9556021B2 (en) | 2017-01-31 |
TW201609522A (zh) | 2016-03-16 |
US20150336794A1 (en) | 2015-11-26 |
EP3145857A1 (en) | 2017-03-29 |
WO2015177681A1 (en) | 2015-11-26 |
TW201604123A (zh) | 2016-02-01 |
EP3145858B1 (en) | 2019-03-27 |
WO2015177694A1 (en) | 2015-11-26 |
TWI612010B (zh) | 2018-01-21 |
EP3145857B1 (en) | 2018-08-29 |
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