FI20030508A0 - Hapeton kupariseos - Google Patents

Hapeton kupariseos

Info

Publication number
FI20030508A0
FI20030508A0 FI20030508A FI20030508A FI20030508A0 FI 20030508 A0 FI20030508 A0 FI 20030508A0 FI 20030508 A FI20030508 A FI 20030508A FI 20030508 A FI20030508 A FI 20030508A FI 20030508 A0 FI20030508 A0 FI 20030508A0
Authority
FI
Finland
Prior art keywords
oxygen
copper alloy
free copper
free
alloy
Prior art date
Application number
FI20030508A
Other languages
English (en)
Swedish (sv)
Inventor
Ilm. Myoeh.
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20030508A priority Critical patent/FI20030508A0/fi
Publication of FI20030508A0 publication Critical patent/FI20030508A0/fi
Priority to FI20040375A priority patent/FI119646B/fi
Priority to TW093108493A priority patent/TW200426231A/zh
Priority to PCT/FI2004/000203 priority patent/WO2004087976A1/en
Priority to CNA2004800087052A priority patent/CN1798854A/zh
Priority to EP04725401A priority patent/EP1608788A1/en
Priority to US10/551,477 priority patent/US20060198757A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
FI20030508A 2003-04-03 2003-04-03 Hapeton kupariseos FI20030508A0 (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos
FI20040375A FI119646B (fi) 2003-04-03 2004-03-10 Hapeton kupariseos ja menetelmä sen valmistamiseksi sekä kupariseoksen käyttö
TW093108493A TW200426231A (en) 2003-04-03 2004-03-29 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
PCT/FI2004/000203 WO2004087976A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
CNA2004800087052A CN1798854A (zh) 2003-04-03 2004-04-02 无氧铜合金和它的生产方法以及铜合金的应用
EP04725401A EP1608788A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
US10/551,477 US20060198757A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos

Publications (1)

Publication Number Publication Date
FI20030508A0 true FI20030508A0 (fi) 2003-04-03

Family

ID=8565920

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos

Country Status (6)

Country Link
US (1) US20060198757A1 (fi)
EP (1) EP1608788A1 (fi)
CN (1) CN1798854A (fi)
FI (1) FI20030508A0 (fi)
TW (1) TW200426231A (fi)
WO (1) WO2004087976A1 (fi)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018206237A1 (en) 2017-05-10 2018-11-15 Haldor Topsøe A/S A process for reducing the content of oxygen in metallic copper
CN111549254A (zh) * 2020-04-29 2020-08-18 铜陵有色金属集团股份有限公司金威铜业分公司 一种无氧铜基微合金及其制备方法和应用
WO2022004803A1 (ja) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 銅合金塑性加工材、銅合金棒材、電子・電気機器用部品、端子
CN115735013B (zh) * 2020-06-30 2024-01-26 三菱综合材料株式会社 铜合金塑性加工材、铜合金线材、电子电气设备用组件及端子
CN115768910B (zh) * 2020-06-30 2024-01-12 三菱综合材料株式会社 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条、引线框架及散热基板
JP7205567B2 (ja) * 2021-05-31 2023-01-17 三菱マテリアル株式会社 銅合金塑性加工材、銅合金棒材、電子・電気機器用部品、端子
JP7120389B1 (ja) 2021-05-31 2022-08-17 三菱マテリアル株式会社 銅合金塑性加工材、銅合金線材、電子・電気機器用部品、端子

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH03291340A (ja) * 1990-04-10 1991-12-20 Mitsubishi Materials Corp 半導体装置用銅合金極細線及び半導体装置
JP2662209B2 (ja) * 1995-10-05 1997-10-08 古河電気工業株式会社 メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JP2898627B2 (ja) * 1997-03-27 1999-06-02 日鉱金属株式会社 銅合金箔
JP3957391B2 (ja) * 1998-03-06 2007-08-15 株式会社神戸製鋼所 剪断加工性に優れる高強度、高導電性銅合金

Also Published As

Publication number Publication date
US20060198757A1 (en) 2006-09-07
CN1798854A (zh) 2006-07-05
EP1608788A1 (en) 2005-12-28
WO2004087976A1 (en) 2004-10-14
TW200426231A (en) 2004-12-01

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Legal Events

Date Code Title Description
FD Application lapsed