FI20000755A - Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi - Google Patents

Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi Download PDF

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Publication number
FI20000755A
FI20000755A FI20000755A FI20000755A FI20000755A FI 20000755 A FI20000755 A FI 20000755A FI 20000755 A FI20000755 A FI 20000755A FI 20000755 A FI20000755 A FI 20000755A FI 20000755 A FI20000755 A FI 20000755A
Authority
FI
Finland
Prior art keywords
product sensor
forming
sensor
product
Prior art date
Application number
FI20000755A
Other languages
English (en)
Swedish (sv)
Other versions
FI20000755A0 (fi
FI112287B (fi
Inventor
Marko Hanhikorpi
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Priority to FI20000755A priority Critical patent/FI112287B/fi
Publication of FI20000755A0 publication Critical patent/FI20000755A0/fi
Priority to GB0225144A priority patent/GB2379802B/en
Priority to AU2001237458A priority patent/AU2001237458A1/en
Priority to DE10195997T priority patent/DE10195997T1/de
Priority to PCT/FI2001/000133 priority patent/WO2001075832A1/en
Publication of FI20000755A publication Critical patent/FI20000755A/fi
Priority to US10/247,754 priority patent/US6951621B2/en
Application granted granted Critical
Publication of FI112287B publication Critical patent/FI112287B/fi

Links

Classifications

    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
    • G08B13/244Tag manufacturing, e.g. continuous manufacturing processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10181Fuse
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Computer Security & Cryptography (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
FI20000755A 2000-03-31 2000-03-31 Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi FI112287B (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20000755A FI112287B (fi) 2000-03-31 2000-03-31 Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
GB0225144A GB2379802B (en) 2000-03-31 2001-02-13 A method for forming a product sensor, and a product sensor
AU2001237458A AU2001237458A1 (en) 2000-03-31 2001-02-13 A method for forming a product sensor, and a product sensor
DE10195997T DE10195997T1 (de) 2000-03-31 2001-02-13 Verfahren zur Herstellung eines Produktsensors, sowie ein Produktsensor
PCT/FI2001/000133 WO2001075832A1 (en) 2000-03-31 2001-02-13 A method for forming a product sensor, and a product sensor
US10/247,754 US6951621B2 (en) 2000-03-31 2002-09-19 Method for forming a product sensor, and a product sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20000755A FI112287B (fi) 2000-03-31 2000-03-31 Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
FI20000755 2000-03-31

Publications (3)

Publication Number Publication Date
FI20000755A0 FI20000755A0 (fi) 2000-03-31
FI20000755A true FI20000755A (fi) 2001-10-01
FI112287B FI112287B (fi) 2003-11-14

Family

ID=8558080

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20000755A FI112287B (fi) 2000-03-31 2000-03-31 Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi

Country Status (6)

Country Link
US (1) US6951621B2 (fi)
AU (1) AU2001237458A1 (fi)
DE (1) DE10195997T1 (fi)
FI (1) FI112287B (fi)
GB (1) GB2379802B (fi)
WO (1) WO2001075832A1 (fi)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10046710A1 (de) * 2000-09-21 2002-04-18 Bundesdruckerei Gmbh Fälschungs- und Diebstahlsicherungssystem insbesondere für Wert- und Sicherheitsdokumente
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
JP4937495B2 (ja) * 2003-12-25 2012-05-23 新光電気工業株式会社 キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法
US7307527B2 (en) 2004-07-01 2007-12-11 Avery Dennison Corporation RFID device preparation system and method
GB0501199D0 (en) * 2005-01-21 2005-03-02 Qinetiq Ltd Improved RF tags
ES2728286T3 (es) 2005-08-22 2019-10-23 Avery Dennison Retail Information Services Llc Método para realizar dispositivos RFID
JP2007142109A (ja) * 2005-11-17 2007-06-07 Tdk Corp 電子部品
JP4518013B2 (ja) * 2005-12-14 2010-08-04 Tdk株式会社 電子部品
US7901533B2 (en) * 2006-06-30 2011-03-08 Tamarack Products, Inc. Method of making an RFID article
TWI475581B (zh) * 2008-11-25 2015-03-01 Thin Film Electronics Asa 電容器、形成電容器的方法、具有電容器的裝置及製造與使用該等裝置的方法
US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
JP5831487B2 (ja) * 2013-03-29 2015-12-09 ソニー株式会社 非接触通信アンテナ、通信装置及び非接触通信アンテナの製造方法
US9949381B2 (en) * 2013-07-15 2018-04-17 Stmicroelectronics (Grenoble 2) Sas Electronic device with at least one impedance-compensating inductor and related methods

Family Cites Families (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE792488A (fr) * 1971-12-08 1973-03-30 Dainippon Printing Co Ltd Cartes d'identification et procede de fabrication de ces cartes
US4021705A (en) * 1975-03-24 1977-05-03 Lichtblau G J Resonant tag circuits having one or more fusible links
FR2435778A1 (fr) * 1978-08-01 1980-04-04 Pyral Soc Support d'enregistrement magnetique securitaire
US4253899A (en) * 1979-03-08 1981-03-03 Avery International Corporation Method of making matrix free thin labels
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
JPS57142798A (en) * 1981-02-26 1982-09-03 Nippon Piston Ring Co Ltd Powder molding method and molded article
DE3130032A1 (de) * 1981-07-30 1983-02-17 Agfa-Gevaert Ag, 5090 Leverkusen Faelschungssicheres dokument
US5294290A (en) * 1982-06-07 1994-03-15 Reeb Max E Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits
AU589144B2 (en) * 1984-11-16 1989-10-05 Toyo Seikan Kaisha Ltd. Packaging material comprising iron foil, and container and container lid composed thereof
EP0227293A3 (en) 1985-12-05 1988-02-03 General Binding Corporation Method for laminating
US4866505A (en) * 1986-03-19 1989-09-12 Analog Devices, Inc. Aluminum-backed wafer and chip
NL8601404A (nl) 1986-05-30 1987-12-16 Papier Plastic Coating Groning Gegevensdragende kaart, werkwijze voor het vervaardigen van een dergelijke kaart en inrichting voor het uitvoeren van deze werkwijze.
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US4954814A (en) * 1986-09-29 1990-09-04 Monarch Marking Systems, Inc. Tag and method of making same
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Icカードの製造方法
EP0545910A3 (en) 1987-12-23 1993-10-20 Alusuisse Lonza Services Ag Laminated foil for making high-frequency field interfering elements
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
KR0147813B1 (ko) * 1989-05-16 1998-08-01 월터 클리웨인, 한스-피터 위트린 적층 구조물 및 그의 제조방법
JPH03239595A (ja) * 1990-02-16 1991-10-25 Dainippon Printing Co Ltd カード製造方法
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Icカードの製造方法
DE69304042T2 (de) 1990-07-12 1996-12-19 C A Lawton Co Verfahren und Vorrichtung zur Herstellung von strukturellen verstärkten Vorformlingen, mit energetischen temporären Verkleben oder Heften
CH680823A5 (fi) * 1990-08-17 1992-11-13 Kobe Properties Ltd
DE4034430C1 (fi) 1990-10-29 1992-06-17 Rota-Druck W. Kieser Kg, 8902 Neusaess, De
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
US5201976A (en) * 1991-05-06 1993-04-13 Morgan Adhesives Company Method of producing a continuous label web
GB9114793D0 (en) * 1991-07-09 1991-08-28 Scient Generics Ltd Novel rf tag
JPH05160290A (ja) * 1991-12-06 1993-06-25 Rohm Co Ltd 回路モジュール
US5244836A (en) * 1991-12-30 1993-09-14 North American Philips Corporation Method of manufacturing fusible links in semiconductor devices
US5302431A (en) * 1992-01-06 1994-04-12 National Poly Products, Inc. Deformable label
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5266355A (en) * 1992-06-18 1993-11-30 Eastman Kodak Company Chemical vapor deposition of metal oxide films
US5386627A (en) * 1992-09-29 1995-02-07 International Business Machines Corporation Method of fabricating a multi-layer integrated circuit chip interposer
US5677063A (en) * 1992-12-22 1997-10-14 Dai Nippon Printing Co., Ltd. Information recording medium and information recording and reproducing method
DE4327642C2 (de) 1993-05-17 1998-09-24 Anatoli Stobbe Lesegerät für ein Detektierplättchen
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
US5822194A (en) * 1994-03-31 1998-10-13 Ibiden Co., Ltd. Electronic part mounting device
FR2721733B1 (fr) 1994-06-22 1996-08-23 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5541399A (en) 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
DE59502482D1 (de) 1994-11-03 1998-07-16 Fela Holding Ag Basis Folie für Chip Karte
DE4444789C3 (de) 1994-12-15 2001-05-10 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen von Chipkarten, Chipkarte und Vorrichtung zum Durchführen des Verfahrens
DE4446369A1 (de) * 1994-12-23 1996-06-27 Giesecke & Devrient Gmbh Datenträger mit einem elektronischen Modul
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
AU1750995A (en) * 1995-01-27 1996-08-14 Interprint Formularios Ltda. Memory card and method of producing same
JP3488547B2 (ja) * 1995-03-03 2004-01-19 日東電工株式会社 共振回路タグ、その製造方法およびその共振特性を変化させる方法
DE19511300A1 (de) 1995-03-28 1996-10-02 Telefunken Microelectron Antennenstruktur
JP2814477B2 (ja) 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式icカード及びその製造方法
US5714305A (en) * 1995-05-24 1998-02-03 Polaroid Corporation Overcoat-releasing laminate and method for the manufacture thereof
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
DE19530823A1 (de) 1995-08-23 1997-02-27 Angewandte Digital Elektronik Kombinierte Chipkarte
US5937512A (en) * 1996-01-11 1999-08-17 Micron Communications, Inc. Method of forming a circuit board
US5639696A (en) 1996-01-31 1997-06-17 Lsi Logic Corporation Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array
JP3842362B2 (ja) * 1996-02-28 2006-11-08 株式会社東芝 熱圧着方法および熱圧着装置
US5781110A (en) * 1996-05-01 1998-07-14 James River Paper Company, Inc. Electronic article surveillance tag product and method of manufacturing same
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
DE19634473C2 (de) 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP3928753B2 (ja) 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
WO1998012607A1 (en) * 1996-09-19 1998-03-26 Dai Nippon Printing Co., Ltd. Volume hologram laminate and label for preparing volume hologram laminate
IL129025A (en) * 1996-09-27 2002-05-23 Avery Dennison Corp Pressure-sensitive adhesive construction
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
US6025780A (en) * 1997-07-25 2000-02-15 Checkpoint Systems, Inc. RFID tags which are virtually activated and/or deactivated and apparatus and methods of using same in an electronic security system
DE19733800A1 (de) 1997-08-05 1999-02-11 Sachsenring Automobiltechnik Verfahren zur Herstellung eines Abstellteils mit einem Antirutschbelag
EP1002306B1 (en) * 1997-08-08 2002-07-03 Ird A/S Polymeric radio frequency resonant tags and method for manufacture
DE19737565A1 (de) 1997-08-28 1999-03-04 Etr Elektronik Und Technologie Chipkarte, bestehend aus einem Kartenkörper, mit wenigstens einem elektronischen Chip, Kontaktfeld mit Kontakten und/oder Spulen
BR9811446A (pt) * 1997-09-11 2000-08-22 Precision Dynamics Corp Dispositivo de identificação de rádio frequência laminado
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
FR2769440B1 (fr) * 1997-10-03 1999-12-03 Gemplus Card Int Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
FR2772494B1 (fr) * 1997-12-15 2001-02-23 Gemplus Card Int Carte a puce munie d'une etiquette de garantie
EP1051885A1 (en) * 1998-02-06 2000-11-15 FLEXcon Company, Inc. Thin film transferable electric components
TW424312B (en) * 1998-03-17 2001-03-01 Sanyo Electric Co Module for IC cards, method for making a module for IC cards, hybrid integrated circuit module and method for making same
US6315856B1 (en) * 1998-03-19 2001-11-13 Kabushiki Kaisha Toshiba Method of mounting electronic component
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
US6066377A (en) * 1998-08-17 2000-05-23 Furon Laminated air brake tubing
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6569280B1 (en) * 1998-11-06 2003-05-27 The Standard Register Company Lamination by radiation through a ply
ATE202428T1 (de) * 1999-01-23 2001-07-15 Ident Gmbh X Rfid-transponder mit bedruckbarer oberfläche
US6412702B1 (en) * 1999-01-25 2002-07-02 Mitsumi Electric Co., Ltd. Non-contact IC card having an antenna coil formed by a plating method
DE19915765C2 (de) 1999-04-08 2001-06-21 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
US6248199B1 (en) * 1999-04-26 2001-06-19 Soundcraft, Inc. Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
IT1317426B1 (it) * 1999-05-19 2003-07-09 Bosch Gmbh Robert Procedimento e dispositivo per comandare l'unita' motrice di unveicolo.
EP1204136B1 (en) * 1999-07-16 2009-08-19 Panasonic Corporation Method of fabricating a packaged semiconductor device
JP4588139B2 (ja) * 1999-08-31 2010-11-24 リンテック株式会社 Icカードの製造方法
US6557766B1 (en) * 1999-10-01 2003-05-06 Keith R. Leighton Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
US6478229B1 (en) * 2000-03-14 2002-11-12 Harvey Epstein Packaging tape with radio frequency identification technology
US6249199B1 (en) * 2000-04-10 2001-06-19 George Liu Quick magnetizing and demagnetizing device for screwdrivers
JP2002109491A (ja) * 2000-09-29 2002-04-12 Sony Corp Icカード及びその製造方法
US6480110B2 (en) * 2000-12-01 2002-11-12 Microchip Technology Incorporated Inductively tunable antenna for a radio frequency identification tag
EP1485867A4 (en) * 2001-12-24 2012-02-22 L 1 Secure Credentialing Inc CONTACT CHIP CARDS HAVING A DOCUMENT CORE AND CONTACTLESS CHIP CARDS COMPRISING A MULTILAYER STRUCTURE, A PET IDENTIFICATION DOCUMENT, AND METHODS OF PRODUCING THE SAME

Also Published As

Publication number Publication date
AU2001237458A1 (en) 2001-10-15
GB2379802B (en) 2004-04-21
FI20000755A0 (fi) 2000-03-31
US6951621B2 (en) 2005-10-04
US20030052077A1 (en) 2003-03-20
GB2379802A (en) 2003-03-19
DE10195997T1 (de) 2003-02-27
GB0225144D0 (en) 2002-12-11
WO2001075832A1 (en) 2001-10-11
FI112287B (fi) 2003-11-14

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